CURABLE COMPOSITION FOR INKJET PRINTING, CURED PRODUCT THEREOF, AND ELECTRONIC COMPONENT HAVING THE CURED PRODUCT THEREOF
[Problem to be Solved] Provided is a curable composition for inkjet printing for obtaining a cured product excellent in heat resistance, adhesion to a substrate, and hardness. [Solution] The curable composition for inkjet printing comprises (A) a multi-branched oligomer or polymer having an ethylenically unsaturated group, (B) a photopolymerization initiator, and (C) a thermosetting compound.
1 . A curable composition for inkjet printing, comprising:
a multi-branched oligomer or polymer having an ethylenically unsaturated group;
a photopolymerization initiator; and
a thermosetting compound.
2 . The curable composition for inkjet printing according to claim 1 , wherein the multi-branched oligomer or polymer has one of a hyperbranched structure and a dendrimer structure.
3 . The curable composition for inkjet printing according to claim 1 , wherein the curable composition has a viscosity at 50° C. measured according to JIS Z 8803 is 50 mPa·s or less.
4 . The curable composition for inkjet printing according to claim 1 , further comprising:
a filler having a Mohs hardness of 5 or more.
5 . The curable composition for inkjet printing according to claim 1 , wherein a number of (meth)acryloyl groups of the multi-branched oligomer or a polymer exceeds 6.
6 . The curable composition for inkjet printing according to claim 1 , wherein the thermosetting compound is blocked isocyanate.
7 . A cured product obtained by curing the curable composition of claim 1 .
8 . An electronic component, comprising:
the cured product of claim 7 .
9 . A method of producing a printed wiring board, comprising:
drawing the curable composition of claim 1 directly on a substrate with an inkjet printer; and
curing the curable composition drawn by irradiation with light such that a resist pattern is formed.
10 . The curable composition for inkjet printing according to claim 2 , wherein the curable composition has a viscosity at 50° C. measured according to JIS Z 8803 is 50 mPa·s or less.
11 . The curable composition for inkjet printing according to claim 2 , further comprising:
a filler having a Mohs hardness of 5 or more.
12 . The curable composition for inkjet printing according to claim 2 , wherein the thermosetting compound is blocked isocyanate.
13 . A cured product obtained by curing the curable composition of claim 2 .
14 . An electronic component, comprising:
the cured product of claim 13 .
15 . A method of producing a printed wiring board, comprising:
drawing the curable composition of claim 2 directly on a substrate with an inkjet printer; and
curing the curable composition drawn by irradiation with light such that a resist pattern is formed.
16 . The curable composition for inkjet printing according to claim 3 , further comprising:
a filler having a Mohs hardness of 5 or more.
17 . The curable composition for inkjet printing according to claim 3 , wherein the thermosetting compound is blocked isocyanate.
18 . A cured product obtained by curing the curable composition of claim 3 .
19 . An electronic component, comprising:
the cured product of claim 18 .
20 . A method of producing a printed wiring board, comprising:
drawing the curable composition of claim 3 directly on a substrate with an inkjet printer; and
curing the curable composition drawn by irradiation with light such that a resist pattern is formed.