IP Library › Granted Patent US 11,778,855
Granted Patent B2
US 11,778,855 · App. 17/043,163 · Granted Oct 3, 2023

Light-emitting diode structure, fabrication method therefor, and display panel

Inventor: Zhuo Chen (Beijing, CN)
Assignee: BOE TECHNOLOGY GROUP CO., LTD.
H10K50/854H01L25/0753H01L33/06H01L33/14H01L33/382H10K50/115H10K50/15H10K50/16H10K50/17H10K50/818H10K50/822H10K50/828H10K71/00H10K71/621H01L2933/0016H10K2102/103H10K2102/3026
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Quick Facts
Patent No.
US 11,778,855
App. No.
17/043,163
Granted
Oct 3, 2023
Kind
B2
Abstract

A light-emitting diode structure, a fabrication method therefor, and a display panel. The light-emitting diode structure includes: a base substrate; and a first electrode layer, a light-emitting layer and a second electrode layer that are successively stacked on the base substrate, wherein the second electrode layer includes a first coarse surface that is located at a side far from the base substrate.

Claims (15)

1. A fabrication method of a light-emitting diode structure, comprising:

providing a base substrate;

sequentially forming a first electrode layer and a light-emitting layer on the base substrate;

arranging a first mask and a second mask which are stacked with each other on a side of the light-emitting layer facing away from the base substrate, a spacing being set between the first mask and the second mask; and

forming a second electrode layer on the base substrate on which the first electrode layer and the light-emitting layer are formed by adopting the first mask and the second mask,

wherein the first mask includes at least one first opening and a first shielding portion surrounding the at least one first opening, the second mask includes a plurality of second openings and a second shielding portion surrounding the plurality of second openings, and orthogonal projections of the plurality of second openings on the first mask are located within the at least one first opening,

forming the second electrode layer on the base substrate on which the first electrode layer and the light-emitting layer are formed by adopting the first mask and the second mask includes:

enabling the electrode material to sequentially pass through each second opening of the second mask and the at least one first opening of the first mask so as to form the second electrode layer, a plurality of protrusions being formed on the surface of the second electrode layer away from the base substrate.

2. The fabrication method according to claim 1 , wherein the first mask and the second mask have shielding patterns different from each other, so that a part of an electrode material passing through the first mask is shielded by the second mask.

3. The fabrication method according to claim 1 , wherein the plurality of second openings are arranged in an array mode, and a size of each second opening is 10 microns to 100 microns.

4. The fabrication method according to claim 1 , further comprising:

forming a first transport layer on a side of the light-emitting layer close to the second electrode layer,

wherein the first mask is attached to the first transport layer and is in contact with the first transport layer.

5. The fabrication method according to claim 1 , wherein the spacing between the first mask and the second mask is 5 millimeters to 15 millimeters.

6. The fabrication method according to claim 1 , wherein the second electrode layer is formed by a magnetron sputtering method.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 29, 2020
From: CHEN, ZHUO
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 053917/0114 →
Priority Claims (1)
CN 201810834313.5 · Jul 26, 2018 · national
Continuity (1)
Related Publication 20210193876A1 · Jun 24, 2021