IP Library Granted Patent US 11,880,968
Granted Patent B2
US 11,880,968 · App. 17/043,960 · Granted Jan 23, 2024

Distributed computing system for product defect analysis

Inventors: Zhaoyue Li (Beijing, CN); Dong Chai (Beijing, CN); Yaoping Wang (Beijing, CN); Meijuan Zhang (Beijing, CN); Hong Wang (Beijing, CN)
Assignee: BOE TECHNOLOGY GROUP CO., LTD.
G06T7/0004G05B19/41875G06V10/82G06V10/96G05B2219/32368G06T2207/20081G06T2207/20084G06T2207/30148
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Quick Facts
Patent No.
US 11,880,968
App. No.
17/043,960
Granted
Jan 23, 2024
Kind
B2
Abstract

A distributed computing system for product defect analysis is disclosed. The distributed computing system for product defect analysis includes a computing cluster for processing product manufacturing messages, a computing cluster for identifying product defect, a product image database, and a client device.

Claims (50)

1. A distributed computing system for product defect analysis, comprising a computing cluster for processing product manufacturing messages, a computing cluster for identifying product defect, a product image database, and a client device, wherein:

the product image database is configured to store product images generated in the product manufacturing process;

the computing cluster for processing product manufacturing messages is configured to generate product defect analysis tasks according to product manufacturing messages, wherein the product defect analysis tasks include a first defect identification task;

the computing cluster for identifying product defect is configured to identify product defect content in one of the product images through a defect identification model based on the first defect identification task, wherein the product defect content includes any one or more of: defect type, defect position, and defect size of products; and

the client device is configured to output a product defect identification result,

wherein the product manufacturing messages include a first product manufacturing message related to registration information, and the computing cluster for processing product manufacturing messages is configured to monitor the first product manufacturing message by interrupt,

wherein the product manufacturing messages further include a second product manufacturing message irrelevant to the registration information; and the computing cluster for processing product manufacturing messages is further configured to: monitor the second product manufacturing message by polling, determine whether the second product manufacturing message includes a product manufacturing keyword; keep the second product manufacturing message if the second product manufacturing message includes the product manufacturing keyword; and discard the second product manufacturing message if the second product manufacturing message does not include the product manufacturing keyword.

2. The distributed computing system for product defect analysis according to claim 1 , wherein the first product manufacturing message includes a lot-product manufacturing message, and the second product manufacturing message includes a single product manufacturing message.

3. The distributed computing system for product defect analysis according to claim 1 , wherein generating the product defect analysis tasks according to the product manufacturing messages includes:

determining whether a defect identification model corresponding to the product type exists according to the product manufacturing message;

generating the first defect identification task if a defect identification model corresponding to the product type exists; and

sending a first defect analysis task to the computing cluster for identifying product defect.

4. The distributed computing system for product defect analysis according to claim 3 , wherein generating the product defect analysis tasks according to the product manufacturing messages further includes:

generating a second defect identification task if no defect identification model is corresponding to the product type; and

sending a second defect analysis task to the client device.

5. The distributed computing system for product defect analysis according to claim 1 , wherein the computing cluster for processing product manufacturing messages is configured to:

establish a product defect analysis task queue by sorting a plurality of product defect analysis tasks based on one or more of: the time sequence of generating the plurality of product defect analysis tasks, a priority order of products, and a product scheduling plan.

6. The distributed computing system for product defect analysis according to claim 5 , wherein the computing cluster for processing product manufacturing messages is further configured to:

control a speed of sending the product defect analysis tasks in the product defect analysis task queue according to a load status of the computing cluster for identifying product defect.

7. The distributed computing system for product defect analysis according to claim 1 , wherein the defect identification model includes any one or more of: a feedforward neural network defect identification model, a convolutional neural network model, a recurrent neural network model, and a generative adversarial network model.

8. The distributed computing system for product defect analysis according to claim 1 , wherein the client device includes a display; and wherein outputting the product defect identification result further includes:

displaying, by the display, a product image of which product defect is identified by the computing cluster for identifying product defect.

9. The distributed computing system for product defect analysis according to claim 8 , wherein the product image of which product defect is identified by the computing cluster for identifying product defect is labeled with a product defect content label, and the product defect content label includes any one or more of: defect mark box, defect mark box coordinate, defect category label, and defect category score.

10. The distributed computing system for product defect analysis according to claim 8 , wherein the display is configured to display a product image of which the product defect cannot be identified by the computing cluster for identifying product defect.

11. The distributed computing system for product defect analysis according to claim 10 , wherein the client device is also configured to:

obtain a product defect identification instruction inputted by a user; and

display the product defect content label of the product images of which the product defect cannot be identified by the computing cluster for identifying product defect based on the product defect identification instruction.

12. The distributed computing system for product defect analysis according to claim 9 , wherein the client device is further configured to:

obtain a product defect rechecking instruction inputted by a user; and

confirm or modify the product defect content label in a product image to be rechecked based on the product defect rechecking instruction.

13. The distributed computing system for product defect analysis according to claim 8 ,

wherein the display is further configured to:

display a task list corresponding to a plurality of product defect analysis tasks;

wherein the client device is further configured to:

obtain an execution priority adjustment instruction of the plurality of product defect analysis tasks inputted by the user; and

modify the sorting of the product defect analysis tasks in the task list based on the execution priority adjustment instruction.

14. The distributed computing system for product defect analysis according to claim 1 , wherein

the computing cluster for processing product manufacturing messages is further configured to generate a defect identification model training task; and

the computing cluster for identifying product defect is further configured to train the defect identification model based on the defect identification model training task.

15. A product defect analysis method based on a distributed system, comprising:

generating product defect analysis tasks according to product manufacturing messages, wherein the product defect analysis tasks include a first defect identification task;

identifying product defect content in a product image by a defect identification model based on the first defect identification task, wherein the product defect content includes any one or more of: defect type, defect position, and defect size of products; and

outputting a product defect identification result,

wherein the product manufacturing messages include a first product manufacturing message related to registration information, and the first product manufacturing message is monitored by interrupt, and

wherein, the product manufacturing messages further include a second product manufacturing message irrelevant to the registration information, and the second product manufacturing message is monitored by polling, wherein, the second product manufacturing message is kept if the second product manufacturing message includes the product manufacturing keyword, and the second product manufacturing message is discarded if the second product manufacturing message does not include the product manufacturing keyword.

16. The product defect analysis method according to claim 15 , wherein generating the product defect analysis tasks according to the product manufacturing messages includes:

determining whether a defect identification model is corresponding to the product type according to the product manufacturing messages;

generating the first defect identification task if a defect identification model is corresponding to the product type; and

generating a second defect identification task if no defect identification model is corresponding to the product type.

17. A non-volatile computer-readable storage medium with computer programs stored thereon, when the programs are executed by a processor, the product defect analysis method according to claim 15 is implemented.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2020
From: LI, ZHAOYUE; CHAI, DONG; WANG, YAOPING; ZHANG, MEIJUAN; WANG, HONG
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 053933/0290 →
Continuity (1)
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