Flexible hexagonal boron nitride composites for additive manufacturing applications
Thermal management composites and scaffolds for heat-generating implantable electronic devices made from the thermal management composites are provided. The composite materials are cytocompatible, porous materials that include hexagonal boron nitride particles dispersed in an elastomeric polymer binder.
1. A biocompatible device comprising:
an implantable electronic device; and
a thermally conductive, electrically insulating scaffold around at least a portion of the implantable electronic device, the scaffold comprising continuous flexible fibers of a cytocompatible composite, the cytocompatible composite comprising:
a biocompatible elastomeric polymer binder; and
hexagonal boron nitride particles dispersed in the biocompatible elastomeric polymer binder.
2. The device of claim 1 , wherein the cytocompatible composite has a hexagonal boron nitride particle content in the range from 30 vol. % to 60 vol. %.
3. The device of claim 1 , wherein the cytocompatible composite has a hexagonal boron nitride particle content in the range from 35 vol. % to 45 vol. %.
4. The device of claim 1 , wherein the cytocompatible composite has a porosity in the range from 20% to 40%.
5. The device of claim 1 , wherein the cytocompatible composite has a porosity in the range from 20% to 35%.
6. The device of claim 2 , wherein the cytocompatible composite has a porosity in the range from 20% to 40%.
7. The device of claim 6 , wherein the biocompatible elastomeric polymer binder is poly(lactic-co-glycolic acid).
8. The device of claim 7 , wherein the cytocompatible composite has a thermal conductivity of at least 1.5 W/m-K.
9. The device of claim 1 , wherein the one or more fibers have a cross-sectional diameter in the range from 50 μm to 500 μm.
10. The device of claim 9 , wherein the one or more fibers have a circular or oval cross-section.