Polysiloxane-containing temporary adhesive comprising heat-resistant polymerization inhibitor
A temporary adhesive without the formation of voids between a support and a wafer. A temporary adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the temporary adhesive including a component (A) that is cured by a hydrosilylation reaction; a polymerization inhibitor (B) having a 5% mass decrease temperature of 80° C. or higher as measured using a Tg-DTA; and a solvent (C). The component (A) may include a polysiloxane (A1) including a polyorganosiloxane (a1) containing a C 1-10 alkyl group and a C 2-10 alkenyl group, and a polyorganosiloxane (a2) containing a C 1-10 alkyl group and a hydrogen atom; and a platinum group metal-based catalyst (A2). The polymerization inhibitor (B) may be a compound of formula (1): (wherein R 7 and R 8 are each a C 6-40 aryl group, or a combination of a C 1-10 alkyl group and a C 6-40 aryl group).
1 . A temporary adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the temporary adhesive comprising
a component (A) that is cured by a hydrosilylation reaction, wherein the component (A) comprises a polysiloxane (A1) including
a polyorganosiloxane (a1) formed by a combination of siloxane units selected from the group consisting of a Q unit of SiO2, a M unit of R 1 R 2 R 3 SiO 1/2 , a D unit of R 4 R 5 SiO 2/2 , and a T unit of R 6 SiO 3/2 , with the proviso that R 1 to R 6 each are a C 1-10 alkyl group or a C 2-10 alkenyl group bonded to a silicon atom and the polyorganosilxoane (a1) contains a C 1-10 alkyl group and a C 2-10 alkenyl group, and
a polyorganosiloxane (a2) formed by a combination of siloxane units selected from the group consisting of a Q unit of SiO 2 , a M unit of R 1 R 2 R 3 SiO 1/2 , a D unit of R 4 R 5 SiO 2/2 , and a T unit of R 6 SiO 3/2 , wherein R 1 to R 6 each are a C 1-10 alkyl group or a hydrogen atom bonded to a silicon atom and the polyorganosiloxane (a2) contains a C 1-10 alkyl group and a hydrogen atom;
an epoxy group-containing polydimethylsiloxane, a phenyl group-containing polydimethylsiloxane, or a mixture thereof;
a polymerization inhibitor (B) having a 5% mass decrease temperature of 80° C. or higher as measured using a Tg-DTA; and
a solvent (C).
2 . The temporary adhesive according to claim 1 , wherein the component (A) further comprises a platinum group metal-based catalyst (A2).
3 . The temporary adhesive according to claim 1 , wherein the polymerization inhibitor (B) is a compound of formula (1):
wherein R 7 and R 8 are each a C 6-40 aryl group, or a combination of a C 2-10 alkyl group and a C 6-40 aryl group, and R 7 and R 8 optionally form a ring together.
4 . The temporary adhesive according to claim 1 , wherein the polymerization inhibitor (B) is 1-phenyl-2-propyn-1-ol, 1,1-diphenyl-2-propyn-1-ol, or 9-ethynyl-9-fluorenol.
5 . A layered body for processing a rear surface of a wafer, comprising a temporary adhesive layer formed using the temporary adhesive according to claim 1 to separatably attach a support to a circuit side of the wafer.
6 . A layered body for processing a rear surface of a wafer, comprising a temporary adhesive layer that separatably attaches a support to a circuit side of the wafer, and a separating agent layer, wherein the temporary adhesive layer is formed using the temporary adhesive according to claim 1 , and the separating agent layer is formed of a polydimethylsiloxane, an epoxy group-containing polydimethylsiloxane, a phenyl group-containing polydimethylsiloxane, or a mixture thereof.
7 . A method for attaching a layered body, comprising applying the temporary adhesive according to claim 1 onto a first body and removing a solvent by heating to form a temporary adhesive layer, attaching a second body to the temporary adhesive layer, and heating the resulting product from a side of the first body.
8 . A method for attaching a layered body, comprising applying the temporary adhesive according to claim 1 onto a first body and removing a solvent by heating to form a temporary adhesive layer, applying a separating agent including a polydimethylsiloxane, an epoxy group-containing polydimethylsiloxane, a phenyl group-containing polydimethylsiloxane, or a mixture thereof onto a second body and heating the separating agent to form a separating agent layer, attaching the first body to the second body such that the temporary adhesive layer faces the separating agent layer, and heating the resulting product from a side of the first body.
9 . The method for attaching a layered body according to claim 7 , wherein the first body is a support, the second body is a wafer, and a circuit side of the wafer faces a surface of the first body.
10 . The method for attaching a layered body according to claim 7 , wherein the first body is a wafer, the second body is a support, and a circuit side of the wafer faces a surface of the second body.
11 . A separation method comprising applying the temporary adhesive according to claim 1 onto a first body to form a temporary adhesive layer, attaching a second body to the temporary adhesive layer, heating the resulting product from a side of the first body to cure the temporary adhesive layer to accomplish a layered body, processing the layered body, and carrying out separation between the bodies and the temporary adhesive layer.
12 . A separation method comprising applying the temporary adhesive according to claim 1 onto a first body to form a temporary adhesive layer, applying a separating agent including a polydimethylsiloxane, an epoxy group-containing polydimethylsiloxane, a phenyl group-containing polydimethylsiloxane, or a mixture thereof onto a second body and heating the separating agent to form a separating agent layer, attaching the first body to the second body such that the temporary adhesive layer faces the separating agent layer, heating the resulting product from a side of the first body to cure the temporary adhesive layer and the separating agent layer to accomplish a layered body, processing the layered body, and carrying out separation between the bodies and the temporary adhesive layer or the separating agent layer.
13 . The separation method according to claim 11 , wherein the first body is a support, the second body is a wafer, and a circuit side of the wafer faces a surface of the first body.
14 . The separation method according to claim 11 , wherein the first body is a wafer, the second body is a support, and a circuit side of the wafer faces a surface of the second body.
15 . The separation method according to claim 11 , wherein the processing is polishing of a rear surface.
16 . A temporary adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the temporary adhesive comprising a component (A) that is cured by a hydrosilylation reaction, wherein the component (A) comprises a polysiloxane (A1) including
a polyorganosiloxane (al) formed by a combination of siloxane units selected from the group consisting of a Q unit of SiO 2 , a M unit of R 1 R 2 R 3 SiO 1/2 , a D unit of R 4 R 5 SiO 2/2 , and a T unit of R 6 SiO 3/2 , with the proviso that R 1 to R 6 each are a C 1-10 alkyl group or a C 2-10 alkenyl group bonded to a silicon atom and the polyorganosilxoane (a1) contains a C 1-10 alkyl group and a C 2-10 alkenyl group, and
a polyorganosiloxane (a2) formed by a combination of siloxane units selected from the group consisting of a Q unit of SiO 2 , a M unit of R 1 R 2 R 3 SiO 1/2 , a D unit of R 4 R 5 SiO 2/2 , and a T unit of R 6 SiO 3/2 , wherein R 1 to R 6 each are a C 1-10 alkyl group or a hydrogen atom bonded to a silicon atom and the polyorganosiloxane (a2) contains a C 1-10 alkyl group and a hydrogen atom;
a polymerization inhibitor (B) that is 1-phenyl-2-propyn-1-ol; and
a solvent (C).
17 . The temporary adhesive according to claim 1 , wherein the polymerization inhibitor (B) comprises 1,1-diphenyl-2-propyn-1-ol.