Apparatus and method for wireless communication

1. An apparatus for wireless communication, comprising:

two or more transceiver array groups, each transceiver array group comprising one or more radio frequency, RF, circuits, and one or more RF front end, RF FE, circuits;

wherein the transceiver array groups are configured to operate at different frequencies;

wherein the transceiver array groups are configured to be connected to one corresponding digital baseband processor;

wherein the transceiver array groups comprise at least one first transceiver array group configured to operate at cm wavelength or larger; and

wherein the transceiver array groups are configured to enable selective coupling of each RF circuit of one transceiver array group to one or more of the RF FE circuits of the same transceiver array group and vice versa.

2. The apparatus of claim 1 , wherein the transceiver array groups comprise at least one second transceiver array group configured to operate at mm wavelength.

3. The apparatus of claim 1 , wherein one or more of the RF FE circuits comprise phase and amplitude control blocks.

4. The apparatus of claim 1 , wherein one or more of the transceiver array groups are configured to support multiple-input-multiple-output, MIMO, or massive MIMO.

5. The apparatus of claim 1 , wherein one or more of the transceiver array groups are configured to support analogue beamforming, digital beamforming, or hybrid analogue/digital beamforming.

6. The apparatus of claim 1 , wherein one or more of the transceiver array groups are configured to support carrier aggregation.

7. The apparatus of claim 1 , wherein the transceiver array groups are implemented on a single chip.

8. The apparatus of claim 7 , wherein the single chip comprises both complementary metal-oxide-semiconductor, CMOS, and III-V semiconductor devices.

9. The apparatus of claim 1 , further comprising the corresponding digital baseband processor.

10. A method for wireless communication, the method comprising the steps of:

operating two or more transceiver array groups, each transceiver array group comprising one or more radio frequency, RF, circuits, and one or more RF front end, RF FE, circuits and being configured to be connected to one corresponding digital baseband processor, at different frequencies;

operating at least one first transceiver array group of the transceiver array groups at cm wavelength or larger, and

selectively coupling each RF circuit of one transceiver array group to one or more of the RF FE circuits of the same transceiver array group and vice versa.

11. The method of claim 10 , comprising operating at least one second transceiver array group of the transceiver array groups at mm wavelength.

12. The method of claim 10 , comprising phase and amplitude control in one or more of the RF FE circuits.

13. The method of claim 10 , comprising supporting multiple-input-multiple-output, MIMO, or massive MIMO using the one or more of the transceiver array groups.

14. The method of claim 10 , comprising supporting analogue beamforming, digital beamforming, or hybrid analogue/digital beamforming using one or more of the transceiver array groups.

15. The method of claim 10 , comprising performing carrier aggregation using one or more of the transceiver array groups.

16. The method of claim 10 , comprising implementing the transceiver array on a single chip.

17. The method of claim 16 , wherein the single chip comprises both complementary metal-oxide-semiconductor, CMOS, and III-V semiconductor devices.

18. A method of fabricating the apparatus of claim 1 , the method comprising fabricating both CMOS and III-V semiconductor devices on a single die.

19. The method of claim 18 , comprising using low energy electronics systems, LEES, processing.