Vapor chamber with condensate flow paths disposed on wall parts
A vapor chamber in which an enclosed space is formed, and a working fluid is sealed in this space, the enclosed space including: a plurality of condensate flow paths through which a fluid that is the working fluid in a condensing state flows; and vapor flow paths through which a vapor that is the working fluid in a vaporizing state flows, wherein each of projecting parts with which each of the vapor flow paths is provided has a projecting amount varying in an extending direction of the vapor flow paths; a pitch for opening parts that allow the vapor flow paths and the condensate flow paths to communicate varies in the extending direction of the vapor flow paths; or wall parts that separate the flow paths each have a given relationship with a transverse cross section of a given flow path.
1. A vapor chamber in which an enclosed space is formed, and a working fluid is sealed in the enclosed space, the enclosed space comprising:
a plurality of condensate flow paths through which the working fluid in a condensing state flows, the condensate flow paths extending in parallel to each other; and
a plurality of vapor flow paths through which the working fluid in a vaporizing state flows, the vapor flow paths extending in parallel to each other, wherein
at least one of the condensate flow paths is between adjacent ones of the vapor flow paths in a plan view,
wall parts that separate the vapor flow paths and the condensate flow paths each comprise a plurality of communicating opening parts that are openings via which the vapor flow paths and the condensate flow paths communicate, wherein the wall parts adjoin one of upper and lower inner faces of the vapor chamber, and the condensate flow paths are also on the one inner face, and
pitches for the communicating opening parts vary in an extending direction of the vapor flow paths and the condensate flow paths.
2. The vapor chamber according to claim 1 , comprising
three superposed metal plates,
wherein the enclosed space is formed between two of three metal plates, the two of the three metal plates being outsides of the three metal plates respectively.
3. The vapor chamber according to claim 1 , wherein
when the vapor chamber is divided into a plurality of areas in the extending direction of the vapor flow paths so that one area includes some of the communicating opening parts aligning in a direction along the vapor flow paths, a pitch for the communicating opening parts in the one area is larger than a pitch for the communicating opening parts in both areas adjacent to the one area.
4. The vapor chamber according to claim 1 , wherein
when one of the vapor flow paths is divided into three areas in the extending direction of the vapor flow paths, an average value of pitches for the communicating opening parts included in areas on both ends is smaller than an average value of pitches for the communicating opening parts included in an area between the areas on both ends.
5. The vapor chamber according to claim 1 , wherein
when one of the vapor flow paths is divided into a first area, as second area, a third area, a fourth area, and a fifth area in order in the extending direction of the vapor flow paths, an average value of pitches for the communicating opening parts included in the third area, and an average value of pitches for the communicating opening parts included in the first area and the fifth area are each smaller than an average value of pitches for the communicating opening parts in the second area and the fourth area.
6. An electronic device comprising:
a housing;
an electronic component that is arranged inside the housing; and
the vapor chamber according to claim 1 , the vapor chamber being arranged in contact with the electronic component directly, or via another member.
7. The vapor chamber according to claim 1 , wherein
wall parts that bound the condensate flow paths and the vapor flow paths are straight in the extending direction of the vapor flow paths and the condensate flow paths.