Power semiconductor module
A power semiconductor module includes an insulating circuit substrate; a printed circuit board disposed over the insulating circuit substrate; and a plurality of terminals each having a rod-shaped portion and including a first protrusion and a second protrusion each protruding laterally form a side face of the rod-shaped portion; wherein at least one of the plurality of terminals is inserted to one of the through-holes of the printed circuit board and is locked to the one of the through-holes via the first protrusion, and wherein at least another one of the plurality of terminals is inserted to another one of the through-holes of the printed circuit board and is locked to said another one of the through-holes via the second protrusion, and an end of the at least another one of the plurality of terminals is electrically connected to a conductive plate on the insulating circuit substrate.
1. A power semiconductor module, comprising:
an insulating circuit substrate having a conductive plate that mounts a semiconductor chip thereon;
a printed circuit board having a plurality of through-holes, the printed circuit being placed above the insulating circuit substrate so as to face a surface of the insulating circuit substrate on which the semiconductor chip is mounted;
a plurality of terminals, each of the plurality of terminals having a rod-shaped portion, and including a first protrusion and a second protrusion each protruding laterally form a side face of the rod-shaped portion, the first protrusion being positioned closer to an end of the terminal than the second protrusion; and
a sealing part sealing the insulating circuit substrate, the printed circuit board, and the plurality of terminals,
wherein at least one of the plurality of terminals is inserted to one of the through-holes of the printed circuit board and is locked to the one of the through-holes via the first protrusion, and
wherein at least another one of the plurality of terminals is inserted to another one of the through-holes of the printed circuit board and is locked to said another one of the through-holes via the second protrusion, and the end of the at least another one of the plurality of terminals is electrically connected to the conductive plate on the insulating circuit substrate.
2. The power semiconductor module according to claim 1 , wherein in each of the plurality of terminals, the first and second protrusions protrude laterally from the side face in mutually different directions.
3. The power semiconductor module according to claim 1 , wherein an outermost dimension of the second protrusion is greater than an outermost dimension of the first protrusion.
4. The power semiconductor module according to claim 1 , wherein in each of the plurality of terminals, at least one of the first and second protrusions has more than one protruding parts in a cross section taken along a plane perpendicular to an elongated direction of the rod-shaped part of the terminal.
5. The power semiconductor module according to claim 4 , wherein in each of the plurality of terminals, said at least one of the first and second protrusions has a crisscross shape in the cross-sectional view taken along the plane perpendicular to the elongated direction of the rod-shaped part of the terminal.
6. The power semiconductor module according to claim 1 , wherein each of said one of the plurality of terminals and said another one of the plurality of terminals has a recess to engage with the sealing part.
7. The power semiconductor module according to claim 1 ,
wherein the printed circuit board includes an insulating layer, a circuit layer formed on a front surface of the insulating layer, and another circuit layer formed on a rear surface of the insulating layer,
wherein each of the plurality of through-holes penetrates through the circuit layer, the insulating layer, and the another circuit layer, and an inner face of the through-hole is formed of a conductive material that electrically connect the circuit layer and the another circuit layer.
8. A power semiconductor module, comprising:
an insulating circuit substrate having a conductive plate that mounts a semiconductor chip thereon;
a printed circuit board having a plurality of through-holes, the printed circuit being placed above the insulating circuit substrate so as to face a surface of the insulating circuit substrate on which the semiconductor chip is mounted;
a plurality of terminals, each of the plurality of terminals having a rod-shaped portion, and including a first protrusion and a second protrusion each protruding laterally form a side face of the rod-shaped portion, the first protrusion being positioned closer to a bottom end of the terminal than the second protrusion; and
a sealing part sealing the insulating circuit substrate, the printed circuit board, and the plurality of terminals,
wherein at least one of the plurality of terminals is inserted to one of the through-holes of the printed circuit board and is locked to the one of the through-holes by press-fitting and locking the first protrusion to the one of the through-holes, and
wherein at least another one of the plurality of terminals is inserted to another one of the through-holes of the printed circuit board and is locked to said another one of the through-holes by press-fitting and locking the second protrusion to said another one of the through-holes, and the bottom end of the at least another one of the plurality of terminals is electrically connected to the conductive plate on the insulating circuit substrate.