IP Library Granted Patent US 11,333,876
Granted Patent B2
US 11,333,876 · App. 17/066,012 · Granted May 17, 2022

Method and system for mapping objects on unknown specimens

Inventors: Matthew C. Putman (Brooklyn, NY); John B. Putman (Celebration, FL); John Cruickshank (Brooklyn, NY); Julie Orlando (Akron, OH); Adele Frankel (New York, NY); Brandon Scott (New York, NY)
Assignee: Nanotronics Imaging, Inc.
G02B21/365G02B21/0032G02B21/361G06K9/3241G06T7/73
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Quick Facts
Patent No.
US 11,333,876
App. No.
17/066,012
Granted
May 17, 2022
Kind
B2
Abstract

A method and system for mapping fluid objects on a substrate using a microscope inspection system that includes a light source, imaging device, stage for moving a substrate disposed on the stage, and a control module. A computer analysis system includes an object identification module that identifies for each of the objects on the substrate, an object position on the substrate including a set of X, Y, and θ coordinates using algorithms, networks, machines and systems including artificial intelligence and image processing algorithms. At least one of the objects is fluid and has shifted from a prior position or deformed from a prior size.

Claims (61)

1. A method, comprising:

generating, by a computing system, a prediction model for predicting coordinates of an object on a substrate at each stage of processing by:

generating a training data set comprising labeled examples of known objects on substrates and labeled examples of deformed objects on substrates, and

training the prediction model to detect objects on the substrates and predict coordinates of each object at each stage of processing;

receiving, by the computing system, a scan of a set of target objects positioned on a stage of a microscope system;

identifying, by the computing system, a position of each target object in the set of target objects; and

predicting, by the computing system via the prediction model, coordinates of each target object in the set of target objects at different stages of examination.

2. The method of claim 1 , wherein predicting, by the computing system, the coordinates of each target object in the set of target objects at different stages of examination comprises:

predicting a second set of coordinates of each target object at a downstream process.

3. The method of claim 1 , further comprising:

comparing, by the computing system, the predicted coordinates of each target object in the set of target objects to the identified position of each target object in the set of target objects; and

generating, by the computing system, an alert upon determining that the predicted coordinates of each target object exceeds a threshold tolerance from the identified position of each target object.

4. The method of claim 1 , further comprising:

assessing, by the computing system, a degree of deformity of each target object based on the predicting.

5. The method of claim 4 , further comprising:

identifying, by the computing system, an actual degree of deformity of each target object following a downstream processing stage; and

assessing, by the computing system, an accuracy of the prediction model based on a comparison between the actual degree of deformity and the degree of deformity.

6. The method of claim 1 , further comprising:

generating, by the computing system, object mapping information based on the predicting.

7. The method of claim 6 , further comprising:

generating, by the computing system, an object layout map using the object mapping information.

8. A microscope inspection system, comprising:

one or more processors in communication with a microscope system that includes a stage for moving a set of objects disposed on the stage and an imaging device, wherein the imaging device scans the set of objects from the stage; and

a memory having programming instructions stored thereon, which, when executed by the one or more processors, performs one or more operations, comprising:

generating a prediction model for predicting coordinates of an object on a substrate at each stage of processing by:

generating a training data set comprising labeled examples of known objects on substrates and labeled examples of deformed objects on substrates, and

training the prediction model to detect objects on the substrates and predict coordinates of each object at each stage of processing;

receiving a scan of a set of target objects positioned on the stage of the microscope system;

identifying a position of each target object in the set of target objects; and

predicting, by the prediction model, coordinates of each target object in the set of target objects at different stages of examination.

9. The microscope inspection system of claim 8 , wherein predicting, by the prediction model, the coordinates of each target object in the set of target objects at different stages of examination comprises:

predicting a second set of coordinates of each target object at a downstream process.

10. The microscope inspection system of claim 8 , wherein the one or more operations further comprise:

comparing the predicted coordinates of each target object in the set of target objects to the identified position of each target object in the set of target objects; and

generating an alert upon determining that the predicted coordinates of each target object exceeds a threshold tolerance from the identified position of each target object.

11. The microscope inspection system of claim 8 , wherein the one or more operations further comprise:

assessing a degree of deformity of each target object based on the predicting.

12. The microscope inspection system of claim 11 , wherein the one or more operations further comprise:

identifying an actual degree of deformity of each target object following a downstream processing stage; and

assessing an accuracy of the prediction model based on a comparison between the actual degree of deformity and the degree of deformity.

13. The microscope inspection system of claim 8 , wherein the one or more operations further comprise:

generating object mapping information based on the predicting.

14. The microscope inspection system of claim 13 , wherein the one or more operations further comprise:

generating an object layout map using the object mapping information.

15. A method, comprising:

training, by a computing system, a prediction model to predict coordinates of an object on a substrate at a downstream processing stage based on detected positions of objects on the substrate at an upstream processing stage;

receiving, by the computing system, a scan of a set of target objects positioned on a stage of a microscope system;

identifying, by the computing system, a position of each target object in the set of target objects; and

predicting, by the computing system via the prediction model, coordinates of each target object in the set of target objects at different stages of examination.

16. The method of claim 15 , further comprising:

comparing, by the computing system, the predicted coordinates of each target object in the set of target objects to the identified position of each target object in the set of target objects; and

generating, by the computing system, an alert upon determining that the predicted coordinates of each target object exceeds a threshold tolerance from the identified position of each target object.

17. The method of claim 15 , further comprising:

assessing, by the computing system, a degree of deformity of each target object based on the predicting.

18. The method of claim 17 , further comprising:

identifying, by the computing system, an actual degree of deformity of each target object following a downstream processing stage; and

assessing, by the computing system, an accuracy of the prediction model based on a comparison between the actual degree of deformity and the degree of deformity.

19. The method of claim 15 , further comprising:

generating, by the computing system, object mapping information based on the predicting.

20. The method of claim 19 , further comprising:

generating, by the computing system, an object layout map using the object mapping information.

Assignments (3)
SECURITY INTEREST Recorded Nov 30, 2023
From: NANOTRONICS IMAGING, INC.; NANOTRONICS HEALTH LLC; CUBEFABS INC.
To: ORBIMED ROYALTY & CREDIT OPPORTUNITIES IV, LP
Reel/Frame 065726/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2021
From: PUTMAN, MATTHEW C.; PUTMAN, JOHN B.; ORLANDO, JULIE; FRANKEL, ADELE; SCOTT, BRANDON
To: NANOTRONICS IMAGING, INC.
Reel/Frame 054812/0128 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2021
From: CRUICKSHANK, JOHN
To: NANOTRONICS IMAGING, INC.
Reel/Frame 054812/0142 →
Continuity (3)
Continuation 16583925 · Sep 26, 2019
Continuation 16164990 · Oct 19, 2018
Related Publication 20210026125A1 · Jan 28, 2021