Semiconductor device and manufacturing method thereof
A semiconductor device includes channel region, first and second two-dimensional metallic contacts, a gate structure, and first and second metal contacts. The channel region includes a two-dimensional semiconductor material. The first two-dimensional metallic contact is disposed at a side of the channel region and includes a two-dimensional metallic material. The second two-dimensional metallic contact is disposed at an opposite side of the channel region and includes the two-dimensional metallic material. The gate structure is disposed on the channel region in between the first and second two-dimensional metallic contacts. The first metal contact is disposed at an opposite side of the first two-dimensional metallic contact with respect to the channel region. The second metal contact is disposed at an opposite side of the second two-dimensional metallic contact with respect to the channel region. The first and second two-dimensional metallic contacts contact sideways the channel region to form lateral semiconductor-metallic junctions.
1. A semiconductor device, comprising:
a substrate;
a channel region disposed on the substrate and comprising a two-dimensional semiconductor material;
a first two-dimensional metallic contact disposed over the substrate, at a side of the channel region and comprising a two-dimensional metallic material;
a second two-dimensional metallic contact disposed on the substrate, at an opposite side of the channel region and comprising the two-dimensional metallic material;
a gate structure, disposed on the channel region in between the first two-dimensional metallic contact and the second two-dimensional metallic contact;
a first metal contact disposed at an opposite side of the first two-dimensional metallic contact with respect to the channel region;
a second metal contact disposed at an opposite side of the second two-dimensional metallic contact with respect to the channel region;
a first layer disposed between the first metal contact and the substrate and comprising the two-dimensional semiconductor material, wherein the first two-dimensional metallic contact is disposed between the first layer and the channel region; and
a second layer disposed between the second metal contact and the substrate and comprising the two-dimensional semiconductor material, wherein the second two-dimensional metallic contact is disposed between the second layer and the channel region,
wherein the first two-dimensional metallic contact and the second two-dimensional metallic contact laterally contact the channel region to form lateral semiconductor-metallic junctions.
2. The semiconductor device of claim 1 , wherein the first two-dimensional metallic contact comprises vertically stacked monolayers of the two-dimensional metallic material, and a number of monolayers of the two-dimensional metallic material in the first two-dimensional metallic contact is greater than a number of monolayers of two-dimensional semiconductor material in the channel region.
3. The semiconductor device of claim 2 , wherein a bottommost monolayer of the monolayers of the two-dimensional semiconductor material and a bottommost monolayer of the monolayers of the two-dimensional metallic material are horizontally aligned.
4. The semiconductor device of claim 2 , wherein the channel region includes a single monolayer of the two-dimensional semiconductor material.
5. The semiconductor device of claim 2 , wherein the two-dimensional semiconductor material and the two-dimensional metallic material have a same chemical composition, and a thickness-modulated switchable material is used as the two-dimensional semiconductor material and as the two-dimensional metallic material.
6. The semiconductor device of claim 5 , wherein the thickness-modulated switchable material includes at least one selected from PtSe 2 , PdSe 2 , and PtTe 2 .
7. The semiconductor device of claim 2 , wherein the number of the monolayers of the two-dimensional metallic material in the first two-dimensional metallic contact is greater than a number of monolayers of the two-dimensional semiconductor material in the first layer.
8. The semiconductor device of claim 1 , wherein the first metal contact laterally contacts the first two-dimensional metallic contact to form a lateral metal-metallic junction, and the second metal contact laterally contacts the second two-dimensional metallic contact to form another lateral metal-metallic junction.
9. A semiconductor device, comprising:
a substrate;
a strip of a two-dimensional semiconductor material disposed on the substrate;
layers of a two-dimensional metallic material disposed over the substrate in stacks at opposite sides of the strip;
metal blocks, extending on outer sidewalls of the stacks of the layers of the two-dimensional metallic material;
a gate structure, disposed on the strip of the two-dimensional semiconductor material in between the stacks of the layers of the two-dimensional metallic material; and
additional strips of the two-dimensional semiconductor material disposed between the metal blocks and the substrate,
wherein the layers of the two-dimensional metallic material are interposed between the additional strips of the two-dimensional semiconductor material having the metal blocks disposed thereon and the strip of the two-dimensional semiconductor material having the gate structure disposed thereon, and
wherein the strip of two-dimensional semiconductor material extends on the substrate along a first direction and a second direction perpendicular to the first direction, and semiconductor-metallic junctions between the layers of the two-dimensional metallic material and the strip of the two-dimensional semiconductor material extend along at least one direction selected from the first direction and the second direction and along a third direction perpendicular to the first direction and the second direction.
10. The semiconductor device of claim 9 , wherein the two-dimensional semiconductor material and the two-dimensional metallic material have different chemical compositions.
11. The semiconductor device of claim 10 , wherein the layers of the two-dimensional metallic material are disposed directly on the substrate.
12. The semiconductor device of claim 9 , wherein the layers of the two-dimensional metallic material are disposed on the strip of the two-dimensional semiconductor material.
13. The semiconductor device of claim 9 , wherein the metal contacts are in contact with the additional strips of the two-dimensional semiconductor material.
14. The semiconductor device of claim 9 , wherein inner sidewalls of the layers of the two-dimensional metallic material extend along the same directions as the semiconductor-metallic junctions.
15. The semiconductor device of claim 9 , wherein the metal blocks further extend on top surfaces of the stacks of the layers of the two-dimensional metallic material.
16. The semiconductor device of claim 9 , wherein a thickness of the stacks of the layers of two-dimensional metallic material is greater than a thickness of the strip of two-dimensional semiconductor material.
17. A manufacturing method of a semiconductor device, comprising:
forming a sheet of a two-dimensional semiconductor material on a substrate;
forming stacked layers of two-dimensional metallic material at opposite sides of the two-dimensional semiconductor material by forming mask strips separated by trenches on the sheet of the two-dimensional semiconductor material, and growing the stacked layers of two-dimensional metallic material in the trenches, wherein a thickness of the stacked layers of two-dimensional metallic material is greater than a thickness of the sheet of two-dimensional semiconductor material, and semiconductor-metallic junctions extend parallel to inner sidewalls of the stacked layers of two-dimensional metallic material;
patterning the sheet of the two-dimensional semiconductor material to form a strip of the two-dimensional semiconductor material;
disposing a metal material over the substrate, wherein the metal material extends on outer sidewalls of the stacked layers of two-dimensional metallic material, and the outer sidewalls are opposite to the inner sidewalls; and
forming a gate structure on the strip of the two-dimensional semiconductor material, wherein the gate structure contacts the inner sidewalls of the stacked layers of two-dimensional metallic material,
wherein the sheet of the two-dimensional semiconductor material includes a thickness-modulated switchable material, and growing the stacked layers of two-dimensional metallic material comprises disposing additional thickness-modulated switchable material on the sheet of the two-dimensional semiconductor material in the trenches.
18. The manufacturing method of claim 17 , wherein forming the strip of the two-dimensional semiconductor material comprises patterning the sheet of the two-dimensional semiconductor material to form parallel strips of the two-dimensional semiconductor material separated by trenches.
19. The manufacturing method of claim 17 , wherein patterning the sheet of the two-dimensional semiconductor material comprises removing portions of the sheet of the two-dimensional semiconductor material at bottoms of the trenches, wherein the stacked layers of two-dimensional metallic material are formed in the trenches after removing the portions of the sheet of the two-dimensional semiconductor material, thus contacting side-by-side the strip of the two-dimensional semiconductor material.
20. The manufacturing method of claim 17 , wherein the thickness-modulated switchable material includes at least one selected from PtSe 2 , PdSe 2 , and PtTe 2 .