Half-bridge semiconductor device
This disclosure relates to a discrete half bridge semiconductor device including a first cascode arrangement and a second cascode arrangement. Each of the first cascode and second cascode arrangements include a high voltage FET device die and a low voltage FET device die; and the source of the high voltage FET device die is mounted on and connected to a drain of the low voltage FET device die. The source of the low voltage FET device die and gate of the high voltage FET device die are connected to a drain terminal of the high voltage FET device die of the second cascode arrangement at a common connection pad.
1. A discrete half bridge semiconductor device comprising:
a first cascode arrangement and a second cascode arrangement;
each of the first cascode and second cascode arrangements comprising a high voltage FET device die and a low voltage FET device die;
wherein the high voltage FET device die comprises a source that is mounted on and connected to a drain of the low voltage FET device die; and
wherein the source of the low voltage FET device die and a gate of the high voltage FET device die are electrically and mechanically connected to a drain terminal of the high voltage FET device die of the second cascode arrangement at a common connection pad.
2. The discrete half bridge semiconductor device of claim 1 , wherein the high voltage FET device dies are lateral device dies and the low voltage FET device dies are vertical device dies.
3. The discrete half bridge semiconductor device of claim 1 , wherein the high voltage FET device dies are flip mounted on the flipped low voltage FET device dies.
4. The discrete half bridge semiconductor device of claim 2 , wherein the high voltage FET device dies are flip mounted on the flipped low voltage FET device dies.
5. The discrete half bridge semiconductor device of claim 1 , wherein with respect to the first cascode arrangement the gate of the high voltage FET device die and the source of the low voltage FET device die are mounted on respective contact pads, and with respect to the second cascode arrangement the drain of the high voltage FET device die is mounted on a respective contact pad.
6. The discrete half bridge semiconductor device of claim 2 , wherein with respect to the first cascode arrangement the gate of the high voltage FET device die and the source of the low voltage FET device die are mounted on respective contact pads, and with respect to the second cascode arrangement the drain of the high voltage FET device die is mounted on a respective contact pad.
7. The discrete half bridge semiconductor device of claim 3 , wherein with respect to the first cascode arrangement the gate of the high voltage FET device die and the source of the low voltage FET device die are mounted on respective contact pads, and with respect to the second cascode arrangement the drain of the high voltage FET device die is mounted on a respective contact pad.
8. The discrete half bridge semiconductor device of claim 5 , wherein the respective contact pads are arranged on a first common conductive member.
9. The discrete half bridge semiconductor device of claim 8 , wherein the first common conductive member forms an electrical connection between the first cascode arrangement to the second cascode arrangement.
10. The discrete half bridge semiconductor device of claim 8 , wherein the first common connection between first cascode arrangement and the second cascode arrangement is substantially internal to the discrete half bridge semiconductor device.
11. The discrete half bridge semiconductor device of claim 9 , wherein the first common connection between first cascode arrangement and the second cascode arrangement is substantially internal to the discrete half bridge semiconductor device.
12. The discrete half bridge semiconductor device of claim 1 , further comprising first and second, second common connections between the source terminal of the high voltage FET device die and the drain terminal of the low voltage FET device die.
13. The discrete half bridge semiconductor device of claim 1 , further comprising a third common connection between the source terminal of the low voltage FET device die and the gate terminal of the high voltage FET device die of the second cascode arrangement.
14. The discrete half bridge semiconductor device of claim 12 , further comprising a third common connection between the source terminal of the low voltage FET device die and the gate terminal of the high voltage FET device die of the second cascode arrangement.
15. The discrete half bridge semiconductor device of claim 12 , wherein each of the first and second, second common connections and third common connections are electrically conductive members comprising contact pads for receiving the respective terminals of the respective high voltage FET device dies and low voltage FET device dies.
16. The discrete half bridge semiconductor device of claim 13 , wherein each of the first and second, second common connections and third common connections are electrically conductive members comprising contact pads for receiving the respective terminals of the respective high voltage FET device dies and low voltage FET device dies.
17. The discrete half bridge semiconductor device of claim 1 , wherein the high voltage FET device dies are depletion mode devices and the low voltage FET device dies are enhancement mode devices.
18. The discrete half bridge semiconductor device of claim 15 , wherein the high voltage FET device dies are depletion mode devices and the low voltage FET device dies are enhancement mode devices.
19. The discrete half bridge semiconductor device of claim 16 , wherein the high voltage FET device dies are depletion mode devices and the low voltage FET device dies are enhancement mode devices.