Collaborative learning model for semiconductor applications

1. A computer-implemented method for classifying wafers in a semiconductor fabrication process, comprising:

displaying on a graphical user interface (“GUI”) first wafer identifying information for a plurality of wafers at a selected step of the semiconductor fabrication process;

determining an initial classification for a first wafer of the plurality of wafers using a rule-based classification model on the basis of the wafer information obtained from the semiconductor fabrication process related to the first wafer;

determining a predicted classification for the first wafer using a machine learning model trained to predict wafer classifications on the basis of input from rule-based classification model and user input;

providing a graphical user interface (“GUI”) displaying the wafer information including the initial classification and the predicted classification for the first wafer, the display also having a plurality of user interactive elements including a first user interactive element for selecting and updating the initial classification and/or the predicted classification and a second user interactive element for entering a user classification;

receiving through the GUI the user input from the first user interactive element and/or the second user interactive element of the display to establish a final classification; and

saving into storage for use in classifying a next wafer the initial classification, the predicted classification, the user classification, and the final classification for the first wafer.

2. The method of claim 1 , further comprising:

retrieving from storage the initial classification, the predicted classification, the user input, and the final classification for the first wafer; and

training the machine learning model on the basis of the initial classification, the predicted classification, the user input, and the final classification for plurality of wafers.

3. The method of claim 1 , the user input further comprising:

receiving as the user input a confirmation of the initial classification or the predicted classification, or both.

4. The method of claim 1 , the user input further comprising:

receiving as the user input a modification of the initial classification or the predicted classification.

5. The method of claim 1 , further comprising:

providing a third user interactive element on the GUI enabling the user to drill down into a plurality of details of the first wafer information upon user selection of the first wafer via a third user interactive element.

6. A computer-implemented method for classifying wafers in a semiconductor fabrication process, comprising:

displaying, within a graphical user interface (“GUI”) on a computer monitor, a first window containing a plurality of wafer identification information each corresponding to respective ones of a plurality of wafers in a step of the semiconductor fabrication process;

receiving a selection through the GUI of a first wafer of the plurality of wafers;

determining a first classification for the first wafer using a first model, the first model is programmed with first instructions to implement a rule-based wafer classification method, the first model receiving as input first wafer information related to the first wafer obtained from the semiconductor fabrication process;

displaying the first classification in the first window in association with wafer identification information corresponding to the first wafer;

determining a second classification for the first wafer using a second model, the second model is a machine learning model trained to learn and predict wafer classifications on the basis of input from the first model and from the semiconductor fabrication process;

displaying the second classification status in the first window in association with wafer identification information corresponding to the first wafer, separate and apart from the first classification;

receiving user feedback through the GUI either confirming one or both of the first classification and the second classification or entering a different classification for the first wafer;

receiving as input data the first classification, the second classification, the user feedback, and the first wafer information into a third model, the third model is a machine learning model trained to learn and predict wafer classifications on the basis of the input data; and

periodically retraining the second model from the third model.

7. The method of claim 6 , further comprising:

displaying a second window within the GUI, the second window containing graphical information corresponding to the selected first wafer.

8. The method of claim 7 , the graphical information comprising at least one wafer map corresponding to the selected first wafer.

9. The method of claim 6 , further comprising:

providing a user interactive element on the GUI enabling the user to drill down into a plurality of details of the wafer information for the first wafer.

10. The method of claim 6 , further comprising:

receiving user feedback through the GUI from a plurality of users;

resolving classification conflicts by providing additional information as input to the third model.

11. The method of claim 10 , further comprising:

providing additional information including information regarding timing of feedback from different ones of the plurality of users.

12. The method of claim 10 , further comprising:

providing additional information including information regarding timing status of each of the plurality of users.

13. The method of claim 6 , further comprising:

receiving user feedback through the GUI from a plurality of users;

providing a user interactive element on the GUI enabling the user to run on demand the first model and/or the second model.