Nanowire structures having wrap-around contacts
Nanowire structures having wrap-around contacts are described. For example, a nanowire semiconductor device includes a nanowire disposed above a substrate. A channel region is disposed in the nanowire. The channel region has a length and a perimeter orthogonal to the length. A gate electrode stack surrounds the entire perimeter of the channel region. A pair of source and drain regions is disposed in the nanowire, on either side of the channel region. Each of the source and drain regions has a perimeter orthogonal to the length of the channel region. A first contact completely surrounds the perimeter of the source region. A second contact completely surrounds the perimeter of the drain region.
1. A semiconductor device, comprising:
a plurality of vertically stacked nanowires disposed above a substrate, each of the nanowires comprising:
a discrete channel region disposed in the nanowire, the channel region having a length and a perimeter orthogonal to the length, wherein the perimeter of the channel region has a first geometry; and
a pair of source and drain regions disposed in the nanowire, on either side of the channel region, each of the source and drain regions comprising a portion having a perimeter orthogonal to the length of the channel region, wherein the perimeters of the portions of the source and drain regions have a second geometry different than the first geometry of the perimeter of the channel region;
a gate electrode stack surrounding and in contact with the entire perimeter of each of the channel regions;
a pair of conductive contacts, a first of the pair of conductive contacts completely surrounding and in contact with the entire perimeter of the source regions, and a second of the pair of conductive contacts completely surrounding and in contact with the entire perimeter of the drain regions, wherein the pair of conductive contacts has an uppermost surface co-planar with an uppermost surface of the gate electrode stack; and
a pair of spacers adjacent the gate electrode stack.
2. The semiconductor device of claim 1 , wherein the first geometry comprises a curved surface, and the second geometry comprises a flat surface.
3. The semiconductor device of claim 1 , further comprising:
an intervening semiconductor material between and in contact with the plurality of vertically stacked nanowires but not along sidewalls of the nanowires at a location beneath the pair of spacers.
4. The semiconductor device of claim 1 , wherein each of the channel regions has a width and a height, the width approximately the same as the height, and wherein each of the portions of the source or drain regions has a width and a height, the width approximately the same as the height.
5. The semiconductor device of claim 1 , wherein each of the channel regions has a width and a height, the width substantially greater than the height, and wherein each of the portions of the source or drain regions has a width and a height, the width substantially greater than the height.
6. The semiconductor device of claim 5 , wherein each of the nanowires consists essentially of silicon, the perimeter along the width of each of the portions of the source or drain regions comprises exposed <110> silicon surfaces, and the perimeter along the height of each of the portions of the source or drain regions comprises exposed <100> silicon surfaces.
7. The semiconductor device of claim 1 , wherein each of the channel regions has a width and a height, the width substantially less than the height, and wherein each of the portions of the source or drain regions has a width and a height, the width substantially less than the height.
8. The semiconductor device of claim 7 , wherein each of the nanowires consists essentially of silicon, the perimeter along the width of each of the portions of the source or drain regions comprises exposed <100> silicon surfaces, and the perimeter along the height of each of the portions of the source or drain regions comprises exposed <110> silicon surfaces.
9. The semiconductor device of claim 1 , wherein each of the nanowires consists essentially of silicon, and the entire perimeter of each of the portions of the source or drain regions is an exposed <111> silicon surface.
10. The semiconductor device of claim 1 , wherein the gate electrode stack comprises a metal gate and a high-k gate dielectric, and each of the nanowires comprises silicon, germanium, or a combination thereof.
11. A computing device, comprising:
a board; and
a component coupled to the board, the component including an integrated circuit structure, comprising:
a plurality of vertically stacked nanowires disposed above a substrate, each of the nanowires comprising:
a discrete channel region disposed in the nanowire, the channel region having a length and a perimeter orthogonal to the length, wherein the perimeter of the channel region has a first geometry;
a pair of source and drain regions disposed in the nanowire, on either side of the channel region, each of the source and drain regions comprising a portion having a perimeter orthogonal to the length of the channel region, wherein the perimeters of the portions of the source and drain regions have a second geometry different than the first geometry of the perimeter of the channel region;
a gate electrode stack surrounding and in contact with the entire perimeter of each of the channel regions;
a pair of conductive contacts, a first of the pair of conductive contacts completely surrounding and in contact with the entire perimeter of the source regions, and a second of the pair of conductive contacts completely surrounding and in contact with the entire perimeter of the drain regions, wherein the pair of conductive contacts has an uppermost surface co-planar with an uppermost surface of the gate electrode stack; and
a pair of spacers adjacent the gate electrode stack.
12. The computing device of claim 11 , further comprising:
a memory coupled to the board.
13. The computing device of claim 11 , further comprising:
a communication chip coupled to the board.
14. The computing device of claim 11 , further comprising:
a camera coupled to the board.
15. The computing device of claim 11 , further comprising:
a battery coupled to the board.
16. The computing device of claim 11 , further comprising:
an antenna coupled to the board.
17. The computing device of claim 11 , wherein the component is a packaged integrated circuit die.
18. The computing device of claim 11 , wherein the component is selected from the group consisting of a processor, a communications chip, and a digital signal processor.
19. The computing device of claim 11 , wherein the computing device is selected from the group consisting of a mobile phone, a laptop, a desk top computer, a server, and a set-top box.
20. The computing device of claim 11 , wherein the first geometry comprises a curved surface, and the second geometry comprises a flat surface.