System of providing power to chip on mainboard
The disclosure provides a system of providing power to a chip on a mainboard, including: a first power supply, located on the mainboard, and configured to receive a first voltage and to provide a second voltage; and a second power supply and a third power supply, located on the mainboard, wherein the second power supply and the third power supply are electrically connected to the first power supply; so as to receive the second voltage, the second power supply is disposed at a first side of the chip, the third power supply is disposed at a second side of the chip, the second power supply provides a third voltage to the chip, and the third power supply provides a fourth voltage to the chip.
1. A system of providing power to a chip on a mainboard, comprising:
a first power supply, located on the mainboard, and configured to receive a first voltage and to provide a second voltage; and
a second power supply and a third power supply, located on the mainboard, wherein the second power supply and the third power supply are electrically connected to the first power supply, so as to receive the second voltage, the second power supply is disposed at a first side of the chip, the third power supply is disposed at a second side of the chip, the second power supply provides a third voltage to the chip, and the third power supply provides a fourth voltage to the chip.
2. The system of providing power to a chip on a mainboard of claim I, wherein
the first power supply is a DC-DC converter; and
the second power supply and the third power supply are DC-DC converters.
3. The system of providing power to a chip on a mainboard of claim 1 , wherein
the first voltage is greater than the second voltage;
the second voltage is greater than the third voltage; and.
the second voltage is greater than the fourth voltage.
4. The system of providing power to a chip on a mainboard of claim 1 , wherein
the first side and the second side are adjacent or opposite sides of the chip.
5. The system of providing power to a chip on a mainboard of claim 1 , wherein
the first power supply and the second power supply are located on a first side of the mainboard, and the third power supply is located on a second side of the mainboard.
6. The system of providing power to a chip on a mainboard of claim 1 , wherein
an output of the second power supply and an output of the third power supply are connected in parallel.
7. A system of providing power to a chip on a mainboard, comprising:
a first power supply and a second power supply, located on the mainboard, wherein the first power supply provides a second voltage, and the second power supply provides a third voltage; and
a third power supply and a fourth power supply, located on the mainboard, wherein the third power supply is electrically connected to the first power supply to receive the second voltage, the fourth power supply is electrically connected to the second power supply to receive the third voltage, the third power supply is disposed at a first side of the chip, the fourth power supply is disposed at a second side of the chip, the third power supply provides a fourth voltage to the chip, and the fourth power supply provides a fifth voltage to the chip.
8. The system of providing power to a chip on a mainboard of claim 7 , wherein the first power supply and the second power supply are DC-DC converters; and
the third power supply and the fourth supply are DC-DC converters.
9. The system of providing power to a chip on a mainboard of claim 7 , wherein
the first voltage is greater than the second voltage and the third voltage;
the second voltage is greater than the fourth voltage; and
the third voltage is greater than the fifth voltage.
10. The system of providing power to a chip on a mainboard of claim 7 , wherein the first power supply and the third power supply is disposed at the first side of the chip, and the second power supply and the fourth power supply is disposed at the second side of the chip.
11. A system of providing power to a chip on a mainboard, comprising:
a first module, located on the mainboard, and configured to receive a first voltage and to provide a second voltage; and
a second module and a third module, located on the mainboard, wherein the second module and the third module are electrically connected to the first module, so as to receive the second voltage, the second module is disposed at a first side of the chip, the third module is disposed at a second side of the chip, the second module provides a third voltage to the chip, and the third module provides a fourth voltage to the chip.
12. The system of providing power to a chip on a mainboard of claim 11 , wherein
the first module is a DC-DC converter; and
the second module and the third module are DC-DC converters.
13. The system of providing power to a chip on a mainboard of claim 11 , wherein
the first voltage is greater than the second voltage;
the second voltage is greater than the third voltage; and
the second voltage is greater than the fourth voltage.
14. The system of providing power to a chip on a mainboard of claim 11 , wherein
the first side and the second side are adjacent or opposite sides of the chip.
15. The system of providing power to a chip on a mainboard of claim 11 , wherein
the first module and the second module are located on a first side of the mainboard, and the third module is located on a second side of the mainboard.
16. The system of providing power to a chip on a mainboard of claim 11 , wherein
an output of the second power supply and an output of the third power supply are connected in parallel.
17. A system of providing power to a chip on a mainboard, comprising:
a first module and a second module, located on the mainboard, wherein the first module provides a second voltage, and the second module provides a third voltage; and
a third module and a fourth module, located on the mainboard, wherein the third module is electrically connected to the first module to receive the second voltage, the fourth module is electrically connected to the second module to receive the third voltage, the third module is disposed at a first side of the chip, the fourth module is disposed at a second side of the chip, the third module provides a fourth voltage to the chip, and the fourth module provides a fifth voltage to the chip.
18. The system of providing power to a chip on a mainboard of claim 17 , wherein the first module and the second module are DC-DC converters: and
the third module and the fourth module are DC-DC converters.
19. The system of providing power to a chip on a mainboard of claim 17 , wherein
the first voltage is greater than the second voltage and the third voltage;
the second voltage is greater than the fourth voltage; and
the third voltage is greater than the fifth voltage.
20. The system of providing power to a chip on a mainboard of claim 17 , wherein the first module and the third module is disposed at the first side of the chip, and the second module and the fourth module is disposed at the second side of the chip.