Semiconductor device and fabrication method
A semiconductor device comprising a semiconductor substrate is provided, wherein the semiconductor substrate has a hydrogen containing region that contains hydrogen, the hydrogen containing region contains helium in at least some region, a hydrogen chemical concentration distribution of the hydrogen containing region in a depth direction has one or more hydrogen concentration trough portions, and in each of the hydrogen concentration trough portions the hydrogen chemical concentration is equal to or higher than 1/10 of an oxygen chemical concentration. In at least one of the hydrogen concentration trough portions, the hydrogen chemical concentration may be equal to or higher than a helium chemical concentration.
1. A semiconductor device comprising a semiconductor substrate, wherein
the semiconductor substrate has a hydrogen containing region that contains hydrogen,
the hydrogen containing region contains helium in at least some region,
a hydrogen chemical concentration distribution of the hydrogen containing region in a depth direction has one or more hydrogen concentration trough portions, and in each of the hydrogen concentration trough portions the hydrogen chemical concentration is equal to or higher than 1/10 of an oxygen chemical concentration.
2. The semiconductor device according to claim 1 , wherein in each of the hydrogen concentration trough portions the hydrogen chemical concentration is equal to or higher than a carbon chemical concentration.
3. The semiconductor device according to claim 1 , wherein
the hydrogen chemical concentration distribution of the hydrogen containing region in the depth direction has one or more hydrogen concentration peaks, and
at the hydrogen concentration peaks, the hydrogen chemical concentration is equal to or higher than ½ of the oxygen chemical concentration.
4. The semiconductor device according to claim 1 , wherein in at least one of the hydrogen concentration trough portions the hydrogen chemical concentration is equal to or higher than a helium chemical concentration.
5. The semiconductor device according to claim 1 , wherein
a helium chemical concentration distribution of the hydrogen containing region in the depth direction has a helium concentration peak, and
in the hydrogen concentration trough portion provided at a deeper position than the helium concentration peak, the hydrogen chemical concentration is equal to or higher than a helium chemical concentration.
6. The semiconductor device according to claim 5 , wherein
the hydrogen chemical concentration distribution has a plurality of hydrogen concentration peaks, and
the full width at half maximum of the helium concentration peak in the helium chemical concentration distribution is larger than an interval between each of the hydrogen concentration peaks.
7. The semiconductor device according to claim 6 , wherein the helium concentration peak is located between two of the hydrogen concentration peaks in the depth direction.
8. The semiconductor device according to claim 5 , wherein
the hydrogen chemical concentration distribution has two or more hydrogen concentration peaks at deeper positions than the helium concentration peak,
a carrier concentration distribution of the hydrogen containing region in the depth direction has two or more hydrogen corresponding peaks located at substantially the same depth as the hydrogen concentration peaks at deeper positions than the helium concentration peak,
the carrier concentration distribution between each of the hydrogen corresponding peaks has no peak at a deeper position than the helium concentration peak.
9. The semiconductor device according to claim 8 , wherein
the carrier concentration distribution has a carrier concentration trough portion between each of the hydrogen corresponding peaks,
a local minimum of the carrier concentration in the carrier concentration trough portion at substantially the same depth position as the helium concentration peak is lower than local minimums of the carrier concentration in the carrier concentration trough portions before and after the carrier concentration trough portion,
a local minimum of the carrier concentration in the carrier concentration trough portion at substantially the same depth position as the helium concentration peak is higher than a base doping concentration in the semiconductor substrate.
10. The semiconductor device according to claim 9 , wherein a vacancy defect concentration distribution of the hydrogen containing region in the depth direction is distributed only between the hydrogen corresponding peaks before and after the carrier concentration trough portion at substantially the same depth position as the helium concentration peak.
11. The semiconductor device according to claim 1 , wherein in all the hydrogen concentration trough portions the hydrogen chemical concentration is equal to or higher than a helium chemical concentration.