IP Library › Granted Patent US 11,624,127
Granted Patent B2
US 11,624,127 · App. 17/082,502 · Granted Apr 11, 2023

Boron nitride layer, apparatus including the same, and method of fabricating the boron nitride layer

Inventors: Changseok Lee (Gwacheon-si, KR); Hyeonsuk Shin (Ulsan, KR); Hyeonjin Shin (Suwon-si, KR); Seokmo Hong (Ulsan, KR); Minhyun Lee (Suwon-si, KR); Seunggeol Nam (Suwon-si, KR); Kyungyeol Ma (Ulsan, KR)
Assignees: Samsung Electronics Co., Ltd.; UNIST (Ulsan National Institute of Science and Technology)
C30B29/38H01L21/02172H01L21/02252H01L21/02293
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,624,127
App. No.
17/082,502
Granted
Apr 11, 2023
Kind
B2
Abstract

A boron nitride layer and a method of fabricating the same are provided. The boron nitride layer includes a boron nitride compound and has a dielectric constant of about 2.5 or less at an operating frequency of 100 kHz.

Claims (26)

1. A boron nitride layer comprising:

a boron nitride compound, the boron nitride layer having a dielectric constant of about 2.5 or less at an operating frequency of 100 kHz, wherein

the boron nitride layer has a mass density of about 1 to about 3 g/cm 3 and is at least one of amorphous and nanocrystalline.

2. The boron nitride layer of claim 1 , wherein a ratio of boron to nitrogen of the boron nitride layer is about 0.9 to about 1.1.

3. The boron nitride layer of claim 1 , wherein the boron nitride layer is non-porous.

4. The boron nitride layer of claim 1 , wherein the boron nitride layer comprises one or more pores.

5. The boron nitride layer of claim 1 , wherein a breakdown field of the boron nitride layer is about 4 MVcm−1 or more.

6. The boron nitride layer of claim 1 , wherein a breakdown field of the boron nitride layer is about 10 MVcm −1 or less.

7. The boron nitride layer of claim 1 , wherein a roughness of the boron nitride layer is about 0.3 to about 0.6 root-mean-square (RMS).

8. The boron nitride layer of claim 1 , wherein the boron nitride layer has an energy band gap of about 6.00 eV or less.

9. The boron nitride layer of claim 1 , wherein the nitrogen and the boron of the boron nitride compound comprise an sp 2 bond.

10. The boron nitride layer of claim 1 , wherein the boron nitride layer has a hydrogen content of about 10% or less.

11. The boron nitride layer of claim 1 , wherein the boron nitride layer has a dielectric constant of about 2.3 or less at the operating frequency of 100 kHz.

12. The boron nitride layer of claim 11 , wherein the boron nitride layer is amorphous.

13. The boron nitride layer of claim 1 , wherein the boron nitride layer has a dielectric constant of about 2.3 to about 2.5 at the operating frequency of 100 kHz.

14. The boron nitride layer of claim 13 , wherein the boron nitride layer is nanocrystalline and comprises a nano crystal.

15. A method of fabricating a boron nitride layer, the method comprising:

preparing a substrate; and

growing the boron nitride layer on the substrate using a plasma from a reaction gas comprising a boron nitride source at a temperature of about 700° C. or less, wherein

the boron nitride layer has a mass density of about 1 to about 3 g/cm 3 and comprises at least one of an amorphous structure and a nano crystal.

16. The method of claim 15 , wherein the preparing the substrate comprises pretreating the substrate.

17. The method of claim 15 , wherein the plasma comprises at least one of an inductively coupled plasma, a capacitively coupled plasma, a microwave plasma, a plasma enhanced method, an electron cyclotron resonance plasma, an arc discharge plasma, and a helicon plasma.

18. The method of claim 15 , wherein the boron nitride layer has a dielectric constant of about 2.5 or less at an operating frequency of 100 kHz.

19. The method of claim 15 , wherein the boron nitride layer comprises the amorphous structure.

20. The boron nitride layer of claim 1 ,

wherein the boron nitride layer has a hydrogen content of above 10% or less and greater than 0%.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 3, 2020
From: LEE, CHANGSEOK; SHIN, HYEONJIN; LEE, MINHYUN; NAM, SEUNGGEOL
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 054249/0028 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 3, 2020
From: SHIN, HYEONSUK; HONG, SEOKMO; MA, KYUNGYEOL
To: UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
Reel/Frame 054249/0040 →
Priority Claims (2)
KR 10-2019-0135755 · Oct 29, 2019 · national
KR 10-2020-0054096 · May 6, 2020 · national
Continuity (1)
Related Publication 20210123161A1 · Apr 29, 2021