Preload cable, detonator cable assembly, and methods of making the same
View Patent ↗A preload cable comprises a cable, a first substrate, a bridge, a flyer, and a second substrate. The cable includes a pair of contacts. The first substrate includes a pair of conductors connected to the contacts. The bridge is positioned on the first substrate and is connected to the conductors. The flyer is positioned on the bridge. The second substrate is positioned adjacent to the first substrate and comprises a polyimide layer, and a hole extending through the polyimide layer and in alignment with the flyer.
1 . A preload cable comprising:
a cable having a pair of contacts;
a first substrate including a pair of conductors connected to the contacts;
a bridge positioned on the first substrate and connected to the conductors;
a flyer positioned on the bridge; and
a second substrate positioned adjacent to the first substrate and comprising—
a polyimide layer, and
a hole extending through the polyimide layer and in alignment with the flyer,
wherein the second substrate comprises a first surface that faces the first substrate and that includes a first fiducial formed thereon.
2 . The preload cable of claim 1 , wherein the first surface of the second substrate includes a second fiducial, the first fiducial and the second fiducial located on opposing sides of the hole of the second substrate.
3 . The preload cable of claim 1 , wherein the second substrate has a thickness of about 127 microns to about 508 microns.
4 . The preload cable of claim 1 , wherein the thickness of the second substrate is about 355.6 microns.
5 . The preload cable of claim 1 , wherein the first substrate includes a first surface on which the bridge is positioned and a second surface, the pair of conductors comprising conductive material disposed in unfilled vias to form filled vias extending from the first surface to the second surface, the contacts of the cable connected to the pair of conductors on the second surface.
6 . A detonator cable assembly comprising:
a cable having a pair of contacts;
a first substrate including a pair of conductors connected to the contacts;
a bridge positioned on the first substrate and connected to the conductors;
a flyer positioned on the bridge;
a second substrate positioned adjacent the first substrate and comprising—
a plurality of polyimide layers having a first surface adjacent the first substrate and a second surface opposite the first surface, and
a hole extending from the first surface to the second surface and in alignment with the flyer; and
a charge comprising explosive material positioned on the second surface of the second substrate,
wherein the first surface of the second substrate includes a first fiducial formed thereon.
7 . The detonator cable assembly of claim 6 , wherein the first surface of the second substrate includes a second fiducial, the first fiducial and the second fiducial positioned on opposing sides of the hole of the second substrate.
8 . A method of forming a preload cable, the method comprising:
forming a first substrate with one or more layers of polyimide;
cutting a hole in the first substrate;
ablating a portion of the first substrate to form a fiducial;
aligning a second substrate using the fiducial of the first substrate, the second substrate including a bridge with a flyer positioned thereon; and
attaching the second substrate to the first substrate so that the flyer is aligned with the hole of the first substrate.
9 . The method of claim 8 , wherein the portion of the first substrate is a first portion and the fiducial is a first fiducial, further comprising ablating a second fiducial.
10 . The method of claim 8 , wherein the cutting step comprises cutting the hole via a laser.
11 . The method of claim 8 , wherein the ablating step comprises ablating the portion of the first substrate via a laser.
12 . The method of claim 8 , further comprising forming holes in the second substrate extending from the bridge to a surface of the second substrate opposite to the bridge.
13 . The method of claim 12 , further comprising filling the holes in the second substrate with conductive material to form filled vias.
14 . The method of claim 13 , further comprising connecting contacts of a cable to the filled vias on the surface of the second substrate opposite to the bridge.
15 . The method of claim 8 , wherein the forming step comprises stacking the one or more layers of polyimide until the first substrate has a thickness of about 127 microns to about 508 microns.
16 . The method of claim 8 , wherein the forming step comprises stacking the one or more layers of polyimide until the first substrate has a thickness of about 355.6 microns.
17 . The method of claim 8 , wherein the first substrate is formed with a thickness that varies by less than about 5%.