Back plate assembly and electronic device
A back plate assembly includes a base plate formed with a groove having a bottom wall and a pair of side walls opposite to each other in a first horizontal direction, and an arch plate assembled into the groove and having a pair of opposite ends in the first horizontal direction. A pair of end surfaces of the ends of the arch plate abut against the side walls and a part of a middle portion of the arch plate between the ends is not in contact with the bottom wall of the groove.
1. An electronic device, comprising:
a back plate assembly including a base plate formed with a groove having a bottom wall and a pair of side walls opposite to each other in a first horizontal direction, and an arch plate assembled into the groove and having a pair of opposite ends in the first horizontal direction, a pair of end surfaces of the ends of the arch plate abut against the side walls and a part of a middle portion of the arch plate between the ends is not in contact with the bottom wall of the groove and the arch plate having a length less than a length of the base plate when assembled into the groove;
an electronic component including a circuit board having a bottom side placed directly on the arch plate; and
a connection mechanism mounting the electronic component on the back plate assembly and applying a loading force on the electronic component directed in a vertical direction of the arch plate,
wherein the electronic component includes a socket connector mounted on a top side of the circuit board directly opposite the arch plate, a central processing unit mounted on the socket connector, and a heatsink mounted on the central processing unit.
2. The electronic device of claim 1 , wherein the connection mechanism includes a nut fixed on the base plate, a bolt passing through a connection hole formed in a connection portion of the heatsink and screwed with the nut, and a spring sleeved on a rod of the bolt and squeezed between a head of the bolt and the connection portion of the heatsink.
3. The electronic device of claim 2 , wherein the connection mechanism includes a spacer supported on the connection portion of the heatsink, the bolt passes through the spacer and a lower end of the spring is supported on the spacer.
4. The electronic device of claim 2 , wherein the base plate has a pair of opposite ends in a first horizontal direction, the nut is fixed on one of the ends of the base plate.
5. The electronic device of claim 1 , wherein the heatsink is a fin type heatsink.