IP Library Granted Patent US 11,259,442
Granted Patent B2
US 11,259,442 · App. 17/091,747 · Granted Feb 22, 2022

Adjustment structure for computer water cooling

Inventor: You-Chi Liu (City of Industry, CA)
Assignee: American Future Technology
H05K7/20327G06F1/20H05K7/20781
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Quick Facts
Patent No.
US 11,259,442
App. No.
17/091,747
Granted
Feb 22, 2022
Kind
B2
Abstract

An adjustment structure for computer water cooling includes a water-cooling head attached to a heating element of a circuit board, a water-cooling head adapter attached to the water-cooling head and provided with two water inlet and outlet connectors, and a steering adapter with two hard water pipes extended from one lateral side thereof and connected to a water cooling row connector of a water cooling row and two flexible water pipes extended from a bottom side thereof and respectively connected to the water inlet and outlet connectors of the water-cooling head adapter. The two flexible water pipes form an adjustment structure that flexibly fits the steering adapter and the two water inlet and outlet connectors.

Claims (10)

1. An adjustment structure for computer water cooling, comprising a computer mainframe with an accommodation space defined therein and a water cooling mechanism mounted in said accommodation space of said computer mainframe and filled with a water cooling fluid for carrying thermal energy, said water cooling mechanism comprising:

a water-cooling head having a bottom surface thereof attached to a top surface of a heating element of a circuit board;

a water-cooling head adapter having a bottom side thereof attached to an opposing top surface of said water-cooling head and an opposing top side thereof provided with two water inlet and outlet connectors; and

a steering adapter comprising two hard water pipes extended from one lateral side thereof and connected to a water cooling row connector of a water cooling row, and two flexible water pipes extended from a bottom side thereof and respectively connected to said water inlet and outlet connectors of said water-cooling head adapter, said two flexible water pipes being an adjustment structure that flexibly fits said steering adapter and said two water inlet and outlet connectors.

2. The adjustment structure for computer water cooling as claimed in claim 1 , wherein said flexible water pipes refer to transparent or opaque hollow water pipes made of soft rubber.

3. The adjustment structure for computer water cooling as claimed in claim 1 , wherein the angle between said two hard water pipes and said two flexible water pipes of said steering adapter is between 60° and 120°.

4. The adjustment structure for computer water cooling as claimed in claim 1 , wherein the connection structure of said flexible water pipes and said water inlet and outlet connectors is selectively to positioned an outer pipe wall of each of said flexible water pipes on an side wall of a joining cavity inside the respective said water inlet and outlet connector or to attach an inner pipe wall of each said flexible water pipe onto an outer wall of the respective said water inlet and outlet connector.

5. The adjustment structure for computer water cooling as claimed in claim 1 , wherein said hard water pipes refer to hollow water pipes made of glass or copper material.

6. The adjustment structure for computer water cooling as claimed in claim 1 , wherein said water cooling fluid refers to a water cooling fluid with anti-corrosion and antibacterial properties.

7. The adjustment structure for computer water cooling as claimed in claim 1 , wherein said heating element refers to the central processing unit, graphics processor, access device, interface card and power element.

Assignments (2)
SECURITY INTEREST Recorded Nov 20, 2025
From: AMERICAN FUTURE TECHNOLOGY CORP.
To: BMO BANK N.A.
Reel/Frame 072976/0246 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 6, 2020
From: LIU, YOU-CHI
To: AMERICAN FUTURE TECHNOLOGY
Reel/Frame 054303/0275 →
Priority Claims (1)
TW 109105894 · Feb 24, 2020 · national
Continuity (1)
Related Publication 20210267092A1 · Aug 26, 2021