IP Library › Granted Patent US 11,335,814
Granted Patent B2
US 11,335,814 · App. 17/095,593 · Granted May 17, 2022

Semiconductor chip

Inventor: Hiroyuki Shimbo (Yokohama, JP)
Assignee: SOCIONEXT INC.
H01L29/78696H01L21/8238H01L27/088H01L27/092H01L27/11807H01L29/06H01L29/0673H01L29/41733H01L29/42392H01L29/775H01L21/823412H01L21/823475H01L27/0207H01L27/1203H01L2027/11874
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,335,814
App. No.
17/095,593
Granted
May 17, 2022
Kind
B2
Abstract

Provided is a semiconductor chip including a nanowire field effect transistor (FET) and having a layout configuration effective for making manufacturing the chip easy. A semiconductor chip includes a first block including a standard cell having a nanowire FET and a second block including a nanowire FET. In the first and second blocks, nanowires extending in an X direction have an arrangement pitch in a Y direction of an integer multiple of a pitch P 1 . Pads have an arrangement pitch in the X direction of an integer multiple of a pitch P 2.

Claims (46)

1. A semiconductor chip, comprising:

a first block including a standard cell having at least one nanowire field effect transistor (FET); and

a second block including at least one nanowire FET,

wherein

the nanowire FETs included in the first and second blocks each include:

a plurality of nanowires extending in a first direction;

a pair of pads that are respectively arranged at both ends of the plurality of nanowires in the first direction, each connected to the plurality of nanowires; and

a gate electrode that extends in a second direction perpendicular to the first direction, and surrounds a periphery of the plurality of nanowires within a predetermined range of the plurality of nanowires in the first direction,

in the first and second blocks, the pads have an arrangement pitch in the first direction of an integer multiple of a first pitch, and

in the nanowire FETs included in the first and second blocks, the nanowires are arranged in a third direction perpendicular to the first direction and the second direction at an integer multiple of a nanowire stack pitch.

2. The semiconductor chip of claim 1 , wherein

in the first and second blocks, a gate line constituting the gate electrode and a dummy gate line have an arrangement pitch in the first direction of an integer multiple of the first pitch.

3. The semiconductor chip of claim 1 , wherein

the standard cell has a size in the first direction of an integer multiple of the first pitch.

4. The semiconductor chip of claim 3 , wherein

the second block includes a second standard cell,

the second standard cell has a size in the first direction of an integer multiple of the first pitch.

5. The semiconductor chip of claim 1 , wherein

the second block includes a second standard cell, wherein

the standard cell and the second standard cell have a size in the second direction different from each other.

6. The semiconductor chip of claim 3 , wherein

the second block includes a memory cell.

7. The semiconductor chip of claim 6 , wherein

the memory cell has a size in the first direction of an integer multiple of the first pitch.

8. A semiconductor chip, comprising:

a first block including a standard cell having at least one nanowire field effect transistor (FET); and

a second block including at least one nanowire FET,

wherein

the nanowire FETs included in the first and second blocks each include:

a plurality of nanowires extending in a first direction;

a pair of pads that are respectively arranged at both ends of the plurality of nanowires in the first direction, each connected to the plurality of nanowires; and

a gate electrode that extends in a second direction perpendicular to the first direction, and surrounds a periphery of the plurality of nanowires within a predetermined range of the plurality of nanowires in the first direction,

in the first and second blocks, a gate line constituting the gate electrode and a dummy gate line have an arrangement pitch in the first direction of an integer multiple of a first pitch,

in the nanowire FETs included in the first and second blocks, the nanowires are arranged in a third direction perpendicular to the first direction and the second direction at an integer multiple of a nanowire stack pitch.

9. The semiconductor chip of claim 8 , wherein

the standard cell has a size in the first direction of an integer multiple of the first pitch.

10. The semiconductor chip of claim 9 , wherein

the second block includes a second standard cell,

the second standard cell has a size in the first direction of an integer multiple of the first pitch.

11. The semiconductor chip of claim 8 , wherein

the second block includes a second standard cell, wherein

the standard cell and the second standard cell have a size in the second direction different from each other.

12. The semiconductor chip of claim 9 , wherein

the second block includes a memory cell.

13. The semiconductor chip of claim 12 , wherein

the memory cell has a size in the first direction of an integer multiple of the first pitch.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 11, 2020
From: SHIMBO, HIROYUKI
To: SOCIONEXT INC.
Reel/Frame 054341/0472 →
Priority Claims (1)
JP JP2016-150960 · Aug 1, 2016 · national
Continuity (3)
Continuation 16262309 · Jan 30, 2019
Continuation PCTJP2017025300 · Jul 11, 2017
Related Publication 20210066508A1 · Mar 4, 2021