Method of manufacturing display device
A method of manufacturing a display device is disclosed. A light emitting unit is provided. The light emitting unit has a chip and at least one bonding pin. The light emitting unit is mounted on the substrate through the at least one bonding pin, and an adhesive material is applied to a space between the chip and the substrate.
1. A method of manufacturing a display device, comprising:
providing a substrate;
providing a light emitting unit having a chip and at least one bonding pin;
mounting the light emitting unit on the substrate through the at least one bonding pin;
applying an adhesive material to a space between the chip and the substrate after mounting the light emitting unit on the substrate, wherein the adhesive material is applied by:
attaching a sheet of the adhesive material in a solid state on the light emitting unit and
converting the sheet from the solid state into a fluid state, thereby flowing into the space between the chip and the substrate; and
providing an external vacuum to let the adhesive material fill the space.
2. The method according to claim 1 , wherein the adhesive material is applied by an ink-jet printing process.
3. The method according to claim 2 , wherein the adhesive material has a viscosity in a range from 8 cP to 12 cP.
4. The method according to claim 1 , comprising a heating step to convert the sheet of the adhesive material from the solid state into the fluid state.
5. The method according to claim 1 , wherein the sheet has a thickness less than 10μm.