Multi-dimensional integrated circuits having semiconductors mounted on multi-dimensional planes and multi-dimensional memory structure
Monolithic multi-dimensional integrated circuits and memory architecture are provided. Exemplary integrated circuits comprise an electronic board having a first side and a second side, a multi-dimensional electronic package having multiple planes, and one or more semiconductor wafers mounted on the first side and the second side of the electronic board and on the multiple planes of the electronic package. Exemplary monolithic multi-dimensional memory architecture comprises one or more tiers, one or more monolithic inter-tier vias spanning the one or more tiers, at least one multiplexer disposed in one of the tiers, and control logic determining whether memory cells are active and which memory cells are active and controlling usage of the memory cells based on such determination. Each tier has a memory cell, and the inter-tier vias act as crossbars in multiple directions. The multiplexer is communicatively coupled to the memory cell in the respective tier. In exemplary embodiments, the one or more semiconductor wafers include one or more solar cells. The solar cells may comprise MEMS and/or on-chip solar cells.
1. A monolithic multi-dimensional integrated circuit comprising:
an electronic board having a first side and a second side;
a multi-dimensional electronic package having multi-dimensional planes, the multi-dimensional planes including one or more horizontal sides and one or more vertical sides; and
one or more semiconductor wafers mounted on the first side and the second side of the electronic board and on the multi-dimensional planes of the electronic package;
wherein one or more of the semiconductor wafers are mounted on at least one of the horizontal sides of the electronic package and one or more of the semiconductor wafers are mounted on at least one of the vertical sides of the electronic package.
2. The integrated circuit of claim 1 wherein the semiconductor wafers are mounted on all planes of the electronic package.
3. The integrated circuit of claim 1 wherein the multi-dimensional planes have a honeycomb shape.
4. The integrated circuit of claim 1 further comprising one or more of: at least one horizontal crossbar communicating signals within a horizontal plane and at least one vertical crossbar communicatively coupling electronic circuitry units.
5. The integrated circuit of claim 1 further comprising at least one multi-directional crossbar communicatively coupling one or more electronic circuitry units in single plane to at least one vertical crossbar.
6. The integrated circuit of claim 1 comprising a plurality of layered integrated circuits on a single semiconductor wafer.
7. The integrated circuit of claim 1 wherein the one or more semiconductor wafers include one or more solar cells.
8. The integrated circuit of claim 7 wherein the one or more solar cells comprise one or more of: MEMS and on-chip solar cells.
9. The integrated circuit of claim 7 wherein the one or more solar cells are mounted on one or more planes of the integrated circuit.
10. The integrated circuit of claim 1 further comprising a monolithic multi-dimensional memory architecture, the monolithic multi-dimensional memory architecture comprising:
one or more tiers, each tier having at least one memory cell;
one or more monolithic inter-tier vias spanning the one or more tiers;
at least one multiplexer disposed in one of the tiers, the multiplexer being communicatively coupled to the memory cell in the respective tier; and
control logic determining whether memory cells are active and which memory cells are active and controlling usage of the memory cells based on such determinations.
11. The integrated circuit of claim 1 wherein the one or more solar cells are integrated within the integrated circuit.
12. A monolithic multi-dimensional memory architecture comprising:
one or more tiers, each tier having a memory cell;
one or more monolithic inter-tier vias spanning the one or more tiers, the inter-tier vias acting as crossbars in multiple directions;
at least one multiplexer disposed in one of the tiers, the multiplexer being communicatively coupled to the memory cell in the respective tier;
control logic determining whether memory cells are active and which memory cells are active and controlling usage of the memory cells based on such determination; and
an integrated circuit incorporating the memory architecture;
wherein the integrated circuit is a monolithic multi-dimensional integrated circuit comprising:
an electronic board having a first side and a second side;
a multi-dimensional electronic package having multiple planes; and
one or more semiconductor wafers mounted on the first side and the second side of the electronic board and on the multiple planes of the electronic package;
wherein one or more of the semiconductor wafers are mounted on at least one of the horizontal sides of the electronic package and one or more of the semiconductor wafers are mounted on at least one of the vertical sides of the electronic package.
13. The memory architecture of claim 12 wherein the crossbars are configured in a bee hive structure.
14. The memory architecture of claim 12 wherein the crossbars are configured in a honeycomb structure.
15. The memory architecture of claim 12 wherein the control logic deactivates unused memory cells to conserve power.
16. The memory architecture of claim 12 further comprising one or both of: a three-dimensional mask-programmed read-only memory or a three-dimensional electrically programmable read-only memory.
17. The memory architecture of claim 12 wherein one of the monolithic inter-tier vias acts as a horizontal crossbar communicating signals between memory cells within a single tier.
18. The memory architecture of claim 12 wherein one of the monolithic inter-tier vias acts as a vertical, horizontal or angled crossbar spanning tiers and communicatively coupling electronic memory units between tiers.
19. A monolithic multi-dimensional integrated circuit comprising:
an electronic board having a first side and a second side;
a multi-dimensional electronic package having multiple planes;
one or more semiconductor wafers mounted on the first side and the second side of the electronic board and on the multiple planes of the electronic package; and
at least one multi-directional crossbar communicatively coupling one or more electronic circuitry units in single plane to at least one vertical crossbar.