Heat spreader having conduction enhancement with EMI shielding

1. A heat spreader, comprising:

a body having a first end portion and a second end portion opposite the first end portion, the body includes a first conduction value and a first electromagnetic interference shield value; and

a conduction enhancement affixed to the body, the conduction enhancement having a second conduction value greater than the first conduction value and a second electromagnetic interference shield value less than the first electromagnetic interference shield value;

wherein a portion of the body is removed to at least partially receive the conduction enhancement;

wherein a subportion of the removed body portion is affixed to the body within a groove and on top of the conduction enhancement such that an upper surface of the subportion is flush with an upper surface of the body; and

wherein the conduction enhancement is positioned in direct contact with the body within the groove and extends from the first end portion to the second end portion of the body for increasing an effective electromagnetic interference shield value of the body associated with the conduction enhancement.

2. The heat spreader of claim 1 , wherein a second body is affixed to the body, the conduction enhancement, or both the body and the conduction enhancement to at least partially be adjacent to, exterior of, obscure, extend over, or a combination thereof of at least a portion of the conduction enhancement.

3. A heat spreader, comprising:

a first body having a first end portion and a second end portion opposite the first end portion, the first body includes a first conduction value and a first electromagnetic interference shield value; and

a conduction enhancement having a second conduction value greater than the first conduction value and a second electromagnetic interference shield value less than the first electromagnetic interference shield value;

wherein a portion of the first body is removed providing a first groove to at least partially receive the conduction enhancement;

wherein a subportion of the removed body portion is affixed to the first body the first groove and on top of the conduction enhancement such that an upper surface of the subportion is flush with an upper surface of the first body;

wherein the conduction enhancement is positioned in direct contact with the first body within the first groove and extends from the first end portion to the second end portion of the first body; and

wherein a second body has a third conduction value greater than the first conduction value and a third electromagnetic interference shield value less than the first electromagnetic interference shield value, and the second body is positioned within a second groove formed in the subportion such that an upper portion of the second body is flush with the upper surface of the subportion and the upper surface of the first body.

4. A method for constructing a heat spreader, comprising:

providing a body having a first end portion and a second end portion opposite the first end portion, the body includes a first conduction value and a first electromagnetic interference shield value;

providing a conduction enhancement having a second conduction value greater than the first conduction value and a second electromagnetic interference shield value less than the first electromagnetic interference shield value; and

positioning the conduction enhancement from the first end portion to the second end portion within the body for increasing an effective electromagnetic interference shield value of the body associated with the conduction enhancement,

wherein prior to positioning at least a portion of the conduction enhancement,

removing a portion of the body to at least partially receive the conduction enhancement; and

subsequent to positioning at least a portion of the conduction enhancement, affixing a subportion of the removed body portion to at least partially be adjacent to, exterior of, obscure, extend over, or a combination thereof of the at least a portion of the conduction enhancement.

5. The method of claim 4 further comprising prior to positioning at least a portion of the conduction enhancement,

removing a portion of the body to at least partially receive the conduction enhancement; and

subsequent to positioning at least a portion of the conduction enhancement,

affixing a second body to at least partially be adjacent to, exterior of, obscure, extend over, or a combination thereof of the at least a portion of the conduction enhancement, the second body having a third conduction value greater than the first conduction value and a third electromagnetic interference shield value less than the first electromagnetic interference shield value.

6. The heat spreader of claim 1 , wherein the first conduction value is between 20 W/m K and 500 W/m K.

7. The heat spreader of claim 1 , wherein the second conduction value is between 1,000 W/m K and 250,000 W/m K.

8. The heat spreader of claim 1 , wherein the body is composed of copper, aluminum, magnesium, beryllium, molybdenum-copper, tungsten-copper, aluminum-silicone carbide, beryllium-copper, or combination thereof.

9. The heat spreader of claim 1 , wherein the conduction enhancement is a heat pipe, vapor chamber, diamond, or pyrolytic graphite.

10. The heat spreader of claim 3 , wherein the first conduction value is between 20 W/m K and 500 W/m K.

11. The heat spreader of claim 3 , wherein the second conduction value is between 1,000 W/m K and 250,000 W/m K.

12. The heat spreader of claim 3 , wherein the body is composed of copper, aluminum, magnesium, beryllium, molybdenum-copper, tungsten-copper, aluminum-silicone carbide, beryllium-copper, or combination thereof.

13. The heat spreader of claim 3 , wherein the conduction enhancement is a heat pipe, vapor chamber, diamond, or pyrolytic graphite.

14. The method of claim 4 , wherein the first conduction value is between 20 W/m K and 500 W/m K.

15. The method of claim 4 , wherein the second conduction value is between 1,000 W/m K and 250,000 W/m K.

16. The method of claim 4 , wherein the body is composed of copper, aluminum, magnesium, beryllium, molybdenum-copper, tungsten-copper, aluminum-silicon-carbide, beryllium-copper, or combination thereof.