Frame reveals with maskless lithography in the manufacture of integrated circuits
Integrated circuitry comprising an opaque material layer, such an interconnect metallization layer is first patterned with a maskless lithography to reveal an alignment feature, and is then patterned with masked lithography that aligns to the alignment feature. In some examples, the maskless lithography employs an I-line digital light processing (DLP) lithography system. In some examples the I-line DLP lithography system performs an alignment with IR illumination through a backside of a wafer. The maskless pattern may include dimensionally large windows within a frame around circuitry regions. A first etch of the opaque material layer may expose the alignment feature within the window, and a second etch of the opaque material may form IC features, such as interconnect metallization features.
1. An integrated circuit (IC) die, comprising:
a level of interconnect features with nanometer dimensions and comprising metallization; and
a lithography alignment feature within a second level of the IC die below the level of interconnect features; and
a reveal window polygon within which the metallization is absent, wherein:
a perimeter edge of the reveal window polygon has micrometer pixelation;
the reveal window polygon is coplanar with the level of interconnect features; and
the perimeter edge of the reveal window polygon surrounds the lithography alignment feature.
2. The IC die of claim 1 , wherein the perimeter edge of the reveal window polygon comprises a plurality of pixels having a lateral dimension of at least 1 μm.
3. The IC die of claim 2 , wherein the perimeter edge of the reveal window polygon comprises one or more stitching errors of at least one pixel in magnitude; and
one pixel has an area of at least 1 μm 2 .
4. The IC die of claim 1 , wherein:
the perimeter edge of the reveal window polygon has a lateral dimension of at least 100 μm;
the interconnect features are interconnect lines comprising a metal; and
the lithography alignment feature has nanometer dimensions.
5. The IC die of claim 4 , wherein the metal is Cu, W, Ti, Co, Ru, Mo, Ir, Rh or Pt.
6. The IC die of claim 1 , wherein:
misregistration of the interconnect features to features within the second level of the IC die is substantially the same as misregistration of the interconnect features to the alignment feature; and
the IC die further comprises a registration feature coplanar with the alignment feature, and wherein the reveal window polygon also surrounds the registration feature.
7. A computer system, comprising:
a power supply; and
the IC die of claim 1 .
8. The IC die of claim 1 , wherein the pixelation comprises a scan line stitching error along a first dimension of the reveal window polygon, the scan line stitching error comprising a lateral jog within a second dimension, perpendicular to the first dimensions, of at least 1 μm in magnitude.
9. The IC die of claim 8 , wherein a first edge of the reveal window polygon comprises a first lateral jog that is in a first direction along the second dimension and a second edge of the reveal window polygon, parallel to the first edge, comprises a second lateral jog that is in a second direction, opposite the first direction.
10. The IC die of claim 9 , wherein a magnitude of the first lateral jog is substantially the same as a magnitude of the second lateral jog.
11. The IC die of claim 8 , wherein the perimeter of the reveal window polygon is rectilinear and the pixelation comprises more lateral jogs along a first perimeter edge of the reveal window polygon than along a second perimeter edge of the reveal window polygon, orthogonal to the first perimeter edge.
12. The IC die of claim 8 , wherein the reveal window polygon is non-rectilinear, comprising a first perimeter edge orthogonal to a second perimeter edge, and a third perimeter edge intersecting the first and second perimeter edges, and wherein the third perimeter edge comprises a plurality of pixelated steps.
13. The IC die of claim 1 , wherein the perimeter edge of the reveal window polygon comprises the metallization.
14. The IC die of claim 1 , wherein the perimeter edge of the reveal window polygon extends into a dielectric material below the level of interconnect features by a first depth and a recess between the metallization features extends into the dielectric material by a second depth, different than the first depth.
15. The IC die of claim 14 , wherein the first depth is deeper than the second depth.
16. An integrated circuit (IC) die, comprising:
a dielectric material;
a level of interconnect features over the dielectric material, the interconnect features with nanometer dimensions and comprising metallization; and
a lithography alignment feature within a second level of the IC die below the level of interconnect features; and
a reveal window polygon within which the metallization is absent, wherein:
a perimeter edge of the reveal window polygon has micrometer lateral pixelation and defines a recess within the dielectric material; and
the perimeter edge of the reveal window polygon surrounds the lithography alignment feature.
17. The IC die of claim 16 , wherein the perimeter edge of the reveal window polygon extends into the dielectric material by a first depth and a recess between the metallization features extends into the dielectric material by a second depth, different than the first depth.
18. The IC die of claim 17 , wherein the first depth is deeper than the second depth.
19. The IC die of claim 16 , wherein the perimeter edge of the reveal window polygon also comprises the metallization.