IP Library Granted Patent US 11,238,914
Granted Patent B2
US 11,238,914 · App. 17/107,463 · Granted Feb 1, 2022

Apparatuses and methods for compute components formed over an array of memory cells

Inventor: Jason T. Zawodny (Grand Rapids, MI)
Assignee: Micron Technology, Inc.
G11C11/4023G11C5/025G11C7/1006G11C11/402G11C11/403G11C11/406G11C11/407G11C2211/4068
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Quick Facts
Patent No.
US 11,238,914
App. No.
17/107,463
Granted
Feb 1, 2022
Kind
B2
Abstract

The present disclosure includes apparatuses and methods related to compute components formed over an array of storage elements. An example apparatus comprises a base substrate material and an array of memory cells formed over the base substrate material. The array can include a plurality of access transistors comprising a first semiconductor material. A compute component can be formed over and coupled to the array. The compute component can include a plurality of compute transistors comprising a second semiconductor material. The second semiconductor material can have a higher concentration of doping ions than the first semiconductor material.

Claims (37)

1. An apparatus, comprising:

an array of memory cells comprising a first plurality of transistors comprising a first semiconductor material; and

a compute component formed over the array of memory cells and comprising a second plurality of transistors comprising a second semiconductor material having a different concentration of doping ions than the first semiconductor material,

wherein the second semiconductor material has a higher concentration of doping ions than the first semiconductor material.

2. The apparatus of claim 1 , further comprising a plurality of metal interconnects interconnecting the first plurality of transistors, the array of memory cells, and the compute component.

3. The apparatus of claim 1 , wherein the first semiconductor material comprises an amorphous silicon first semiconductor material, and

wherein the second semiconductor material comprises an amorphous silicon second semiconductor material.

4. The apparatus of claim 1 , further comprising global metal interconnects and pads formed on the compute component.

5. The apparatus of claim 1 , further comprising a sense amplifier coupled to the compute component, wherein the first plurality of transistors selectably couple respective memory cells of the array to the sense amplifier.

6. The apparatus of claim 5 , wherein the sensing circuitry is configured to perform logic operations on data stored in the array of memory cells using at least one of the second plurality of transistors.

7. A method, comprising:

forming, over an array of storage elements, a plurality of transistors comprising a semiconductor material;

doping the semiconductor material to a higher concentration of doping ions than a concentration of doping ions of another semiconductor material of the array of storage elements; and

forming sensing circuitry in the semiconductor material.

8. The method of claim 7 , wherein forming the plurality of transistors comprises forming an amorphous silicon material over the array of storage elements.

9. The method of claim 7 , further comprising doping the semiconductor material subsequent to all heating cycles associated with forming the array of storage elements.

10. The method of claim 7 , wherein forming the sensing circuitry comprises:

forming a compute component; and

forming a sense amplifier coupled to the compute component.

11. The method of claim 10 , further comprising forming a plurality of metal interconnects coupled to the plurality of transistors, the array of storage elements, and the compute component.

12. A method, comprising:

forming, over an array of storage elements, a first plurality of transistors comprising a first semiconductor material and a second plurality of transistors comprising a second semiconductor material,

wherein the second semiconductor material has a different concentration of doping ions than the first semiconductor material corresponding to a higher leakage current of the second plurality of transistors than that of the first plurality of transistors.

13. The method of claim 12 , wherein the second semiconductor material has a higher concentration of doping ions than the first semiconductor material.

14. The method of claim 12 , wherein the second semiconductor material has a lower concentration of doping ions than the first semiconductor material.

15. An apparatus, comprising:

an array of memory cells comprising a first plurality of transistors comprising a first semiconductor material; and

a compute component formed over the array of memory cells and comprising a second plurality of transistors comprising a second semiconductor material having a different concentration of doping ions than the first semiconductor material,

wherein the second semiconductor material has a lower concentration of doping ions than the first semiconductor material.

16. An apparatus, comprising:

an array of memory cells comprising a first plurality of transistors comprising a first semiconductor material; and

a compute component formed over the array of memory cells and comprising a second plurality of transistors comprising a second semiconductor material having a different concentration of doping ions than the first semiconductor material,

wherein the different concentration of doping ions corresponds to a shorter refresh cycle of the second plurality of transistors than that of the first plurality of transistors.

17. A method, comprising:

forming, over an array of storage elements, a plurality of transistors comprising a semiconductor material;

doping the semiconductor material to a lower concentration of doping ions than a concentration of doping ions of another semiconductor material of the array of storage elements; and

forming sensing circuitry in the semiconductor material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2020
From: ZAWODNY, JASON T.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 054495/0110 →
Continuity (4)
Continuation 16526198 · Jul 30, 2019
Continuation 15806123 · Nov 7, 2017
Provisional Application 62419004 · Nov 8, 2016
Related Publication 20210110858A1 · Apr 15, 2021