IP Library Granted Patent US 11,574,663
Granted Patent B2
US 11,574,663 · App. 17/109,853 · Granted Feb 7, 2023

Data latch circuit and semiconductor memory device

Inventors: Keisuke Nakatsuka (Kobe Hyogo, JP); Tomoya Sanuki (Yokkaichi Mie, JP); Takashi Maeda (Kamakura Kanagawa, JP); Go Shikata (Moriya Ibaraki, JP); Hideaki Aochi (Yokkaichi Mie, JP)
Assignee: Kioxia Corporation
G11C7/106G11C7/08G11C7/18G11C16/26H01L27/11529H01L27/11573
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Quick Facts
Patent No.
US 11,574,663
App. No.
17/109,853
Granted
Feb 7, 2023
Kind
B2
Abstract

A data latch circuit includes a first n-channel transistor and a first p-channel transistor. A gate of the first n-channel transistor and a gate of the first p-channel transistor are a common gate.

Claims (48)

1. A data latch circuit, comprising:

a first n-channel transistor; and

a first p-channel transistor,

a gate of the first n-channel transistor and a gate of the first p-channel transistor being a common gate,

wherein the gate has a crank-like configuration in a plan view.

2. The circuit according to claim 1 , wherein

the first n-channel transistor is a driver, and

the first p-channel transistor is a load.

3. The circuit according to claim 1 , further comprising:

a second n-channel transistor;

a third n-channel transistor;

a fourth n-channel transistor; and

a second p-channel transistor,

a gate of the second n-channel transistor and a gate of the second p-channel transistor being a common gate,

one of a source or a drain of the third n-channel transistor being connected to the gate of the second n-channel transistor, the gate of the second p-channel transistor, one of a source or a drain of the first n-channel transistor, and one of a source or a drain of the first p-channel transistor,

the other of the source or the drain of the third n-channel transistor being connected to a sense amplifier,

one of a source or a drain of the fourth n-channel transistor being connected to the gate of the first n-channel transistor, the gate of the first p-channel transistor, one of a source or a drain of the second n-channel transistor, and one of a source or a drain of the second p-channel transistor,

the other of the source or the drain of the fourth n-channel transistor being connected to the sense amplifier,

a first reference potential being applicable to the other of the source or the drain of the first p-channel transistor and the other of the source or the drain of the second p-channel transistor,

a second reference potential being applied to the other of the source or the drain of the first n-channel transistor and the other of the source or the drain of the second n-channel transistor.

4. A semiconductor memory device, comprising:

a sense amplifier;

the data latch circuit according to claim 1 ,

a plurality of electrode films stacked to be separated from each other;

a semiconductor member piercing the plurality of electrode films;

a charge storage member provided between the semiconductor member and the electrode films;

a source line connected to the semiconductor member; and

a bit line connected between the semiconductor member and the sense amplifier.

5. The device according to claim 4 , wherein

the sense amplifier and the data latch circuit are provided on a first substrate,

the plurality of electrode films, the semiconductor member, the charge storage member, the source line, and the bit line are provided on a second substrate, and

the first substrate and the second substrate are bonded to each other.

6. A semiconductor memory device, comprising:

a first sense amplifier circuit; and

a second sense amplifier circuit,

the first sense amplifier circuit and the second sense amplifier circuit each including a data latch circuit including an n-channel transistor,

a gate of the n-channel transistor of the first sense amplifier circuit and a gate of the n-channel transistor of the second sense amplifier circuit being a common gate,

wherein the n-channel transistor of the first sense amplifier circuit and the n-channel transistor of the second sense amplifier circuit are transfer gates.

7. The device according to claim 6 , further comprising:

a plurality of electrode films stacked to be separated from each other;

a semiconductor member piercing the plurality of electrode films;

a charge storage member provided between the semiconductor member and the electrode films;

a source line connected to the semiconductor member; and

a bit line connecting the semiconductor member to the first sense amplifier circuit and the second sense amplifier circuit.

8. The device according to claim 7 , wherein

the first sense amplifier circuit and the second sense amplifier circuit are formed on a first substrate,

the plurality of electrode films, the semiconductor member, the charge storage member, the source line, and the bit line are formed on a second substrate, and

the first substrate and the second substrate are bonded to each other.

Assignments (3)
CHANGE OF NAME Recorded Apr 25, 2022
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 059698/0727 →
MERGER Recorded Apr 25, 2022
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 059788/0964 →
CHANGE OF NAME Recorded Apr 25, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 059789/0008 →
Priority Claims (2)
JP JP2018-172343 · Sep 14, 2018 · national
JP JP2019-044614 · Mar 12, 2019 · national
Continuity (2)
Division 16356980 · Mar 18, 2019
Related Publication 20210090616A1 · Mar 25, 2021
Cited By (1)
US 12,658,244