IP Library Granted Patent US 11,646,605
Granted Patent B2
US 11,646,605 · App. 17/113,308 · Granted May 9, 2023

Wafer-level integrated antenna array for wireless battery charging

Inventors: Hatem Ibrahim Zeine (Bellevue, WA); Seyed Ali Malek Abadi (Mill Creek, WA); Alireza Pourghorban Saghati (Los Gatos, CA)
Assignee: Ossia Inc.
H02J50/402H01Q1/12H02J7/00034H02J50/20H02J50/80H03L7/06H01Q3/26H01Q21/06H01Q21/20
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Quick Facts
Patent No.
US 11,646,605
App. No.
17/113,308
Granted
May 9, 2023
Kind
B2
Abstract

Systems and methods are described for transmitting and receiving wireless power. In some embodiments, a wireless power transmission system comprises an antenna array comprising a plurality of antennas and a transceiver module configured to receive a plurality of beaconing signals via the antenna array from a wireless client during a beacon cycle. The system also comprises a controller configured to measure a phase of each of the plurality of beaconing signals and determine a transmit phase configuration for each of the antennas, and a transceiver module configured to send signals to the antenna array based on the transmit phase configuration for delivery of wireless power to the wireless client.

Claims (19)

1. A wireless power transmission system comprising:

an antenna array comprising a plurality of antennas;

a transceiver module configured to receive a plurality of beaconing signals via the antenna array from a wireless client during a beacon cycle;

a controller configured to measure a phase of each of the plurality of beaconing signals and determine a transmit phase configuration for each of the antennas;

a phase-locked loop (PLL) configured to feed signals to the antenna array based on the transmit phase configuration for delivery of wireless power to the wireless client; and

a wafer onto which at least the transceiver module, the controller, and the antenna array are formed.

2. The wireless power transmission system of claim 1 , wherein the wafer includes: one layer, and another layer, and wherein:

the transceiver module is formed in the one layer of the wafer; and

the antenna array is formed in the another layer of the wafer.

3. The wireless power transmission system of claim 2 , wherein the one layer having the transceiver module wafer is wafer bonded to the another layer having the antenna array.

4. The wireless power transmission system of claim 2 , wherein a material of the one layer having the transceiver module wafer is different from a material of the another layer having the antenna array.

5. The wireless power transmission system of claim 1 , wherein the plurality of antennas comprises a plurality of antenna groups, each antenna group comprising a sub-group of the plurality of antennas.

6. The wireless power transmission system of claim 5 , wherein the plurality of antenna groups covers the entire surface of the wafer.

7. The wireless power transmission system of claim 5 , wherein each antenna group of the plurality of antenna groups is formed into a same shape.

8. The wireless power transmission system of claim 7 , wherein the shape is a hexagon.

9. The wireless power transmission system of claim 1 , wherein the plurality of antennas is configured to transmit the signals at a wavelength in a microwave frequency region.

10. The wireless power transmission system of claim 9 , wherein the plurality of antennas is configured to transmit the signals at 60 gigahertz.

11. The wireless power transmission system of claim 1 , wherein the plurality of antennas is configured to transmit the signals at a wavelength in a terahertz frequency region.

12. The wireless power transmission system of claim 1 wherein the PLL is formed onto the wafer.

Assignments (4)
AMENDED AND RESTATED NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Jul 15, 2024
From: OSSIA INC.
To: FARAH CAPITAL LIMITED, AS SECURED PARTY; NERVE INVESTMENT SPV LTD, AS SECURED PARTY; TOYODA GOSEI., LTD
Reel/Frame 068369/0303 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME AND ZIP CODE OF CORRESPONDENCE ADDRESS PREVIOUSLY RECORDED AT REEL: 062336 FRAME: 0628. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 26, 2023
From: OSSIA INC.
To: FARAH CAPITAL LIMITED; NERVE INVESTMENT SPV LTD
Reel/Frame 062926/0332 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Jan 9, 2023
From: OSSIA INC.
To: FARAH CAPITAL LMITED; NERVE INVESTMENT SPV LTD
Reel/Frame 062336/0628 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2021
From: ZEINE, HATEM IBRAHIM; ABADI, SEYED ALI MALEK; SAGHATI, ALIREZA POURGHORBAN
To: OSSIA INC.
Reel/Frame 054873/0188 →
Continuity (2)
Division 15718233 · Sep 28, 2017
Related Publication 20210091604A1 · Mar 25, 2021