Photoacoustic sensors and MEMS devices
A photoacoustic sensor includes a first MEMS device and a second MEMS device. The first MEMS device includes a first MEMS component including an optical emitter, and a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity. The second MEMS device includes a second MEMS component including a pressure detector, and a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity.
1. A photoacoustic sensor, comprising:
a first MEMS device, comprising:
a first MEMS component comprising an optical emitter; and
a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity;
a second MEMS device, comprising:
a second MEMS component comprising a pressure detector; and
a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity;
an encapsulation material, wherein the first MEMS device and the second MEMS device are encapsulated by the encapsulation material; and
a gas channel extending within the encapsulation material between the first MEMS device and the second MEMS device.
2. The photoacoustic sensor as claimed in claim 1 , wherein:
the first MEMS device further comprises a third cover wafer-bonded to the first MEMS component,
the first MEMS component further comprises a movable structure,
the first MEMS component and the third cover form a third closed cavity, and
the first closed cavity and the third closed cavity are arranged on opposite sides of the movable structure of the first MEMS component.
3. The photoacoustic sensor as claimed in claim 1 , wherein:
the first MEMS device further comprises a carrier,
the first MEMS component further comprises a movable structure,
the first optically transparent cover is wafer-bonded to the carrier,
the first closed cavity is arranged between the first optically transparent cover and the movable structure of the first MEMS component, and
a third closed cavity is arranged between the carrier and the movable structure.
4. The photoacoustic sensor as claimed in claim 1 , further comprising:
a substrate, wherein the first MEMS device and the second MEMS device are arranged next to one another on a same surface of the substrate.
5. The photoacoustic sensor as claimed in claim 4 , further comprising:
another cover arranged above the first and the second MEMS devices arranged next to one another, the other cover having an optically reflective inner surface.
6. The photoacoustic sensor as claimed in claim 1 , further comprising:
a substrate, wherein the first MEMS device and the second MEMS device are arranged on opposite surfaces of the substrate and are both arranged over an opening formed in the substrate.
7. The photoacoustic sensor as claimed in claim 1 , further comprising:
an optical path extending within the encapsulation material from the first MEMS device to the second MEMS device.
8. The photoacoustic sensor as claimed in claim 7 , further comprising:
a leadframe, wherein the first MEMS device and the second MEMS device are arranged on opposite surfaces of the leadframe,
wherein the gas channel extends at least partly parallel to the surfaces of the leadframe, and
wherein the optical path extends at least partly perpendicularly to the opposite surfaces of the leadframe.
9. The photoacoustic sensor as claimed in claim 7 , further comprising:
a leadframe, wherein the first MEMS device and the second MEMS device are arranged on a common surface of the leadframe,
wherein the optical path extends at least partly parallel to the common surface of the leadframe.
10. The photoacoustic sensor as claimed in claim 1 , further comprising:
a shell, wherein the first MEMS device and the second MEMS device are arranged next to one another on a base of the shell.
11. The photoacoustic sensor as claimed in claim 1 , further comprising:
a shell, wherein the first MEMS device and the second MEMS device are arranged in a manner stacked one above the other on a base of the shell and a spacer is arranged between the first and the second MEMS devices stacked one above the other.
12. A system, comprising:
a first device, comprising:
a first MEMS component comprising an optical emitter; and
a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity;
a second device, comprising:
a second MEMS component comprising a pressure detector; and
a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity;
an encapsulation material, wherein the first device and the second device are encapsulated by the encapsulation material; and
a gas channel extending within the encapsulation material between the first device and the second device.
13. The system as claimed in claim 12 , further comprising:
an optical path extending within the encapsulation material from the first device to the second device.
14. The system as claimed in claim 13 , further comprising:
a leadframe, wherein the first device and the second device are arranged on opposite surfaces of the leadframe,
wherein the gas channel extends at least partly parallel to the surfaces of the leadframe, and
wherein the optical path extends at least partly perpendicularly to the opposite surfaces of the leadframe.
15. The system as claimed in claim 13 , further comprising:
a leadframe, wherein the first device and the second device are arranged on a common surface of the leadframe,
wherein the optical path extends at least partly parallel to the common surface of the leadframe.
16. The system as claimed in claim 12 , further comprising:
a shell, wherein the first device and the second device are arranged next to one another on a base of the shell.
17. The system as claimed in claim 12 , further comprising:
a shell, wherein the first device and the second device are arranged in a manner stacked one above the other on a base of the shell and a spacer is arranged between the first device and the second device stacked one above the other.
18. The system as claimed in claim 12 , wherein:
the first device further comprises a third cover wafer-bonded to the first MEMS component,
the first MEMS component further comprises a movable structure,
the first MEMS component and the third cover form a third closed cavity, and
the first closed cavity and the third closed cavity are arranged on opposite sides of the movable structure of the first MEMS component.
19. The system as claimed in claim 12 , wherein:
the first device further comprises a carrier,
the first MEMS component further comprises a movable structure,
the first optically transparent cover is wafer-bonded to the carrier,
the first closed cavity is arranged between the first optically transparent cover and the movable structure of the first MEMS component, and
a third closed cavity is arranged between the carrier) and the movable structure.
20. The system as claimed in claim 12 , further comprising:
a substrate, wherein the first device and the second device are arranged on opposite surfaces of the substrate and are both arranged over an opening formed in the substrate.