Optoelectronic assembly and method for producing an optoelectronic assembly
An optoelectronic assembly comprising an optoelectronic component, which comprises a specularly reflective surface and comprising a radiation cooler in direct physical contact with the optoelectronic component. The radiation cooler is arranged above the specularly reflective surface.
1. An optoelectronic assembly comprising:
an optoelectronic component comprising:
a first electrode;
an organic functional layer structure arranged above the first electrode;
a second electrode arranged above the organic functional layer structure;
and a specularly reflective surface, wherein the second electrode includes or forms the specularly reflective surface; and
a radiation cooler in physical contact with the optoelectronic component.
2. The optoelectronic assembly as claimed in claim 1 , wherein the radiation cooler is arranged on an exterior of the optoelectronic component.
3. The optoelectronic assembly as claimed in claim 2 , wherein the optoelectronic component comprises a covering body, which closes off the optoelectronic component toward the outside, and the radiation cooler is arranged on the covering body, and/or
the optoelectronic component comprises a carrier, which closes off the optoelectronic component toward the outside, and the radiation cooler is arranged on the carrier, and/or
the optoelectronic component comprises a heat sink, which closes off the optoelectronic component toward the outside, and the radiation cooler is arranged on the heat sink.
4. The optoelectronic assembly as claimed in claim 1 , wherein the radiation cooler is integrated into a layer structure of the optoelectronic component.
5. The optoelectronic assembly as claimed in claim 1 , wherein the radiation cooler is in direct physical contact with an electrode of the optoelectronic component.
6. The optoelectronic assembly as claimed in claim 1 , wherein the optoelectronic component is an organic optoelectronic component implemented as a solar cell or an OLED.
7. The optoelectronic assembly as claimed in claim 1 , wherein the radiation cooler comprises a layer structure comprising a plurality of different layers, wherein the layers have different refractive indices and at least partly different layer thicknesses, wherein in a first thickness region of the layer structure layers are formed which have thicknesses which are greater than the thicknesses of layers in a second thickness region.
8. The optoelectronic assembly as claimed in claim 7 , wherein the thicknesses in the first thickness region are in a range from 100 to 1000 nm and/or wherein the thicknesses in the second thickness region are in a range from 1 to 100 nm.
9. The optoelectronic assembly as claimed in claim 7 , wherein the layers in part comprise or are formed by silicon dioxide and in part comprise or are formed by hafnium oxide or titanium dioxide.
10. An optoelectronic assembly comprising:
an optoelectronic component comprising:
a first electrode;
an organic functional layer structure arranged above the first electrode; and
a second electrode arranged above the organic functional layer structure; and
a radiation cooler in contact with the optoelectronic component, wherein the radiation cooler is arranged on a side of the organic functional layer structure opposite of the second electrode, and
wherein the second electrode is reflective and configured in such a way that radiation leaves the optoelectronic component exclusively through the radiation cooler.
11. The optoelectronic assembly as claimed in claim 10 , wherein the radiation cooler is formed as an encapsulation of the optoelectronic component.
12. The optoelectronic assembly as claimed in claim 10 , wherein the optoelectronic component is an organic optoelectronic component implemented as a solar cell or an OLED.
13. The optoelectronic assembly as claimed in claim 10 , wherein the radiation cooler is arranged on the side of the organic functional layer structure facing away from the second electrode.
14. The optoelectronic assembly as claimed in claim 10 , wherein the first electrode is formed as translucent or transparent.
15. An optoelectronic assembly comprising:
an optoelectronic component comprising:
a first electrode;
an organic functional layer structure arranged above the first electrode;
a second electrode arranged above the organic functional layer structure; and
a reflective surface; and
a radiation cooler in contact with the optoelectronic component,
wherein the radiation cooler comprises a layer structure comprising a plurality of different layers, wherein the layers have different refractive indices and at least partly different layer thicknesses, wherein in a first thickness region of the layer structure layers are formed which have thicknesses which are greater than the thicknesses of layers in a second thickness region.
16. The optoelectronic assembly as claimed in claim 15 , wherein the optoelectronic component is an organic optoelectronic component implemented as a solar cell or an OLED.
17. The optoelectronic assembly as claimed in claim 15 , wherein the radiation cooler is arranged on a side of the organic functional layer structure facing away from the reflective surface.
18. The optoelectronic assembly as claimed in claim 15 , wherein the radiation cooler is arranged on a side of the organic functional layer structure facing towards the reflective surface.
19. The optoelectronic assembly as claimed in claim 15 , wherein the optoelectronic component comprises a covering body, and/or
the optoelectronic component comprises a carrier, and/or
the optoelectronic component comprises a heat sink.
20. The optoelectronic assembly as claimed in claim 19 , wherein the covering body, the carrier, the heat sink, the first electrode and/or the second electrode comprises or forms the reflective surface.