RFID device

1. A process for manufacturing a transaction device comprising the steps of:

forming a metal frame defining an outer periphery, an inner periphery defined by an opening, and at least one body discontinuity from the outer periphery to the inner periphery of the metal frame;

inserting at least one layer having a cutout into the opening;

inserting at least one electronic component into the opening, the electronic component comprising an RFID module disposed in the cutout; and

disposing a non-conductive material about the electronic component;

wherein the opening comprises a blind hole.

2. The process of claim 1 , wherein the step of disposing the non-conductive material about the at least one electronic component comprises disposing the non-conductive material onto at least a top surface of the at least one electronic component.

3. The process of claim 1 , wherein the RFID module comprises an antenna connected to or configured to inductively couple to an RFID chip.

4. The process of claim 1 , further comprising disposing at least one additional layer over the non-conductive material.

5. The process of claim 4 , wherein the at least one additional layer is a printing layer.

6. The process of claim 4 , wherein the step of disposing the at least one additional layer over the non-conductive material comprises adhesively attaching the one additional layer or laminating the at least one additional layer over the non-conductive material.

7. A transaction device comprising a molded electronic component of claim 1 .

8. A transaction device manufactured according to the process of claim 1 .

9. The process of claim 1 , further comprising a step of laminating at least one additional layer over or under the at least one layer having the cutout, such that all but a top surface of the electronic component encapsulated by the non-conductive material.

10. The process of claim 1 , further comprising laminating at least one additional layer over or under the at least one layer and forming a cutout in the at least one additional layer.

11. The process of claim 10 , wherein the steps of forming a cutout in the at least one additional layer and inserting at least one electronic component into the cutout both occur after the laminating step.

12. A transaction device, comprising:

a metal frame defining an outer periphery, an inner periphery defined by an opening in the metal frame, and at least one body discontinuity from the outer periphery to the inner periphery of the metal frame;

at least one layer having a cutout disposed in the opening;

at least one electronic component in the opening, the electronic component comprising an RFID transponder chip disposed in the cutout; and

a non-conductive material disposed about the electronic component;

wherein the opening comprises a blind hole.

13. The transaction card of claim 12 , wherein the non-conductive material is disposed on at least a top surface of the at least one electronic component.

14. The transaction card of claim 12 , further comprising a module antenna connected to or configured to inductively couple to the RFID transponder chip module.

15. The transaction card of claim 14 , wherein the RFID transponder chip and the module antenna are disposed in a substrate.

16. The transaction device of claim 12 , further comprising at least one layer laminated over at least one surface of the metal frame.

17. An RFID device comprising:

a metal frame having first and second opposite surfaces, an outer periphery, and an opening in the metal frame defining an inner periphery and extending from at least one of the opposite surfaces for a depth;

a chip layer disposed inside the opening, the chip layer comprising a substrate, an RFID transponder chip mounted to the substrate, and an module antenna in the substrate connected to the RFID transponder chip;

at least one fill layer disposed in the opening of the frame between the chip layer and one of the surfaces of the metal frame;

at least one layer laminated over at least one surface of the metal frame; and

a hole extending between the first and second opposite surfaces;

wherein the depth of the opening is coextensive with the thickness of the metal frame and the metal frame comprises a discontinuity in the form of a discontinuity extending between the first and second opposite surfaces and outer and inner peripheries, the device further comprising first and second fill layers on opposite sides of the chip layer and first and second layers laminated over the opposite surfaces of the metal frame and the respective first and second fill layers.

18. The device of claim 17 , wherein the device has only a single laminated layer extending over the first surface of the metal frame and the fill layer.

19. The RFID device of claim 17 , wherein the hole is disposed between the inner and outer peripheries.

20. The RFID device of claim 19 , wherein the device comprises a component of a key ring or key chain, further comprising a member disposed in the hole, the member comprising a component of an apparatus configured to hold one or more keys.

21. The RFID device of claim 17 , wherein the RFID transponder chip comprises a dual interface chip having a contact pad, and the contact pad is accessible from an outer surface of the device.

22. The RFID device of claim 17 , wherein the RFID transponder chip is completely surrounded by non-conductive material.

23. The RFID device of claim 22 , wherein the RFID transponder chip is embedded in a non-conductive substrate, and has a laminated fill layer in contact with at least one surface of the RFID transponder chip embedded in the non-conductive substrate.

24. The RFID device of claim 23 , wherein the laminated fill layer, a ferrite layer in contact both upper and lower surfaces of the RFID transponder chip embedded in the non-conductive substrate.

25. The RFID device of claim 23 , comprising the laminated fill layer in contact with only one surface of the RFID transponder chip embedded in the non-conductive substrate, and a ferrite layer in contact with an opposite surface of the RFID transponder chip embedded in the non-conductive substrate.