Barrier film, organic el device, flexible substrate, and method for manufacturing barrier film
An organic EL device including a first barrier film that contains primarily silicon nitride, a second barrier film that contains primarily silicon nitride, an organic EL element that is disposed between the first barrier film and the second barrier film, a first flexible substrate that is disposed opposite the organic EL element with the first barrier film interposed therebetween, a second flexible substrate that is disposed opposite the organic EL element with the second barrier film interposed therebetween, and a third barrier film that is disposed between the second barrier film and the organic EL element, and contains primarily silicon nitride.
1. An organic EL device comprising:
a first barrier film that contains silicon nitride;
a second barrier film that contains silicon nitride;
an organic EL element that is disposed between the first barrier film and the second barrier film;
a first flexible substrate that is disposed opposite the organic EL element with the first barrier film interposed therebetween;
a second flexible substrate that is disposed opposite the organic EL element with the second barrier film interposed therebetween;
a third barrier film that is disposed between the second barrier film and the organic EL element, and contains silicon nitride; and
a TFT layer that is disposed between the first barrier film and the organic EL element, wherein
the organic EL device has a bendable surface,
each of the first barrier film, the second barrier film, the organic EL element, the first flexible substrate, the second flexible substrate, and the third barrier film is bent along the bendable surface, and
the bendable surface includes a longitudinal center of the organic EL device.
2. The organic EL device of claim 1 , wherein, a side end portion of the second barrier film and a side end portion of the third barrier film are located closer to the organic EL element than a side end portion of the first barrier film.
3. The organic EL device of claim 1 , further comprising a resin layer that is disposed between the second barrier film and the third barrier film.
4. The organic EL device of claim 1 , wherein the side end portion of the third barrier film is located closer to the organic EL element than the side end portion of the second barrier film.
5. The organic EL device of claim 1 , wherein the third barrier film directly contacts with the first barrier film.
6. An organic EL device comprising:
a bendable surface, the bendable surface including a longitudinal center of the organic EL device; and
a pre-formed structure that is laminated prior to a bending process used to form the bendable surface, the pre-formed structure including:
a first barrier film that contains silicon nitride;
a second barrier film that contains silicon nitride;
an organic EL element that is disposed between the first barrier film and the second barrier film;
a first flexible substrate that is disposed opposite the organic EL element with the first barrier film interposed therebetween;
a second flexible substrate that is disposed opposite the organic EL element with the second barrier film interposed therebetween;
a third barrier film that is disposed between the second barrier film and the organic EL element, and contains silicon nitride; and
a TFT layer that is disposed between the first barrier film and the organic EL element.
7. A method for manufacturing an organic EL device comprising:
forming a structure, the structure including:
a first barrier film that contains silicon nitride;
a second barrier film that contains silicon nitride;
an organic EL element that is disposed between the first barrier film and the second barrier film;
a first flexible substrate that is disposed opposite the organic EL element with the first barrier film interposed therebetween;
a second flexible substrate that is disposed opposite the organic EL element with the second barrier film interposed therebetween;
a third barrier film that is disposed between the second barrier film and the organic EL element, and contains silicon nitride; and
a TFT layer that is disposed between the first barrier film and the organic EL element; and
bending the structure around a longitudinal center of the organic EL device to form a bendable surface.
8. An organic EL device comprising:
a first barrier film;
a second barrier film that contains silicon nitride;
an organic EL element that is disposed between the first barrier film and the second barrier film;
a first flexible substrate that is disposed opposite the organic EL element with the first barrier film interposed therebetween;
a second flexible substrate that is disposed opposite the organic EL element with the second barrier film interposed therebetween;
a third barrier film that is disposed between the second barrier film and the organic EL element, and contains silicon nitride; and
a side end portion of the second barrier film and a side end portion of the third barrier film are located closer to the organic EL element than a side end portion of the first barrier film.
9. The organic EL device of claim 8 , wherein light emitted from the organic EL element is externally extracted through the first flexible substrate.
10. The organic EL device of claim 8 , wherein light emitted from the organic EL element is externally extracted through the second flexible substrate.
11. The organic EL device of claim 8 , wherein the side end portion of the third barrier film is located closer to the organic EL element than the side end portion of the second barrier film.
12. The organic EL device of claim 8 , further comprising an insulating film that is disposed between the first barrier film and the organic EL element.
13. The organic EL device of claim 8 , further comprising barrier ribs that is disposed beside the organic EL element, wherein the second barrier film and the third barrier film are formed over the barrier ribs.