IP Library Granted Patent US 11,460,425
Granted Patent B2
US 11,460,425 · App. 17/130,233 · Granted Oct 4, 2022

Thermal analyzer

Inventors: Kengo Kobayashi (Tokyo, JP); Shinya Nishimura (Tokyo, JP); Hirohito Fujiwara (Tokyo, JP)
Assignee: HITACHI HIGH-TECH SCIENCE CORPORATION
G01N25/20G01N25/02
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Quick Facts
Patent No.
US 11,460,425
App. No.
17/130,233
Granted
Oct 4, 2022
Kind
B2
Abstract

Provided is a thermal analyzer, with which a sample can be observed even under a state in which a heat sink is cooled to a room temperature or lower. The thermal analyzer includes: the heat sink, in which a measurement sample container and a reference sample container are placed; a heat sink cover configured to cover the heat sink; a heat sink window provided in the heat sink; a heat sink cover window provided in the heat sink cover; an imaging device configured to image the sample in the heat sink through the heat sink window and the heat sink cover window; a purge gas introduction portion, through which a purge gas is introduced into the heat sink; and a discharge port, through which the purge gas is allowed to flow from one of the heat sink window and the heat sink to a space inside the heat sink cover.

Claims (14)

1. A thermal analyzer, comprising:

a heat sink, in which a measurement sample container and a reference sample container are to be placed, the measurement sample container being configured to contain a measurement sample, the reference sample container being configured to contain a reference sample;

a differential heat flow detector configured to detect, under a state in which the measurement sample and the reference sample are placed in the heat sink, a temperature difference between the measurement sample and the reference sample caused by heat absorbed or released by the measurement sample;

a measurement circuit configured to convert the temperature difference detected and input thereto by the differential heat flow detector into a DSC signal;

a heat sink cover configured to cover the heat sink;

a heat sink window provided in a part of the heat sink;

a heat sink cover window provided in a part of the heat sink cover;

an imaging device configured to image at least the measurement sample placed in the heat sink through the heat sink window and the heat sink cover window;

a purge gas introduction portion, through which a purge gas is introduced into an internal space of the heat sink; and

a discharge port, through which the purge gas is allowed to flow from the internal space of the heat sink through one of the heat sink window and the heat sink to a space inside the heat sink cover.

2. The thermal analyzer according to claim 1 , further comprising a heat sink cover heater configured to heat the heat sink cover window.

3. The thermal analyzer according to claim 1 , further comprising an outlet port configured to blow the purge gas inside the heat sink cover at an outdoor air side of the heat sink cover window.

4. The thermal analyzer according to any one of claims 1 to 3 , wherein the heat sink window is formed of a transparent material and a material having a high heat conductivity.

5. The thermal analyzer according to any one of claims 1 to 3 , wherein the heat sink cover window is formed of a transparent material and a material having a high heat conductivity.

Assignments (2)
CHANGE OF NAME Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH ANALYSIS CORPORATION
Reel/Frame 072903/0672 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2022
From: KOBAYASHI, KENGO; NISHIMURA, SHINYA; FUJIWARA, HIROHITO
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 060935/0793 →
Priority Claims (1)
JP JP2020-061447 · Mar 12, 2020 · national
Continuity (1)
Related Publication 20210285904A1 · Sep 16, 2021