IP Library › Granted Patent US 11,415,764
Granted Patent B2
US 11,415,764 · App. 17/132,918 · Granted Aug 16, 2022

Optical module

Inventors: Teruhiro Kubo (Kitahiroshima, JP); Yuka Ojima (kawasaki, JP); Tetsuo Ishizaka (Inagi, JP); Tomoyuki Ito (Sapporo, JP)
Assignee: FUJITSU OPTICAL COMPONENTS LIMITED
G02B6/4266G02B6/428G02B6/4257G02B6/4284H05K1/0203H05K7/2039
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Quick Facts
Patent No.
US 11,415,764
App. No.
17/132,918
Granted
Aug 16, 2022
Kind
B2
Abstract

An optical module includes: a board that is accommodated in a housing and in which a through hole is formed; a metal plate that is bonded to an area of the board including the through hole; a component that is mounted on one surface of the metal plate and is arranged inside the through hole; and a thermal-conductive member that is arranged on another surface of the metal plate and transmits heat generated by the component to the housing.

Claims (18)

1. An optical module comprising:

a board that is accommodated in a housing and in which a through hole is formed;

a metal plate that is bonded to an area of the board including the through hole;

a component that is mounted on one surface of the metal plate and is arranged inside the through hole such that a surface of the component and a surface of the board are set flush with each other; and

a thermal-conductive member that is arranged on another surface of the metal plate and transmits heat generated by the component to the housing.

2. The optical module according to claim 1 , wherein

the component includes:

an optical modulator that modulates light emitted by a light source; and

an optical component that sends, to an optical fiber, an optical signal obtained by modulation by the optical modulator.

3. The optical module according to claim 2 , wherein the optical modulator is arranged inside the through hole such that a height of a surface of the optical modulator is substantially same as a height of a surface of the board, and the surface of the optical modulator is connected to the surface of the board by a wire.

4. The optical module according to claim 2 , wherein the component further includes a driver that supplies a transmission signal to the optical modulator.

5. The optical module according to claim 4 , wherein the driver is arranged inside the through hole such that a height of a surface of the driver is substantially same as a height of a surface of the board, and the surface of the driver is connected to the surface of the board by a wire.

6. The optical module according to claim 1 , further comprising an optical component that converts an input optical signal into an electrical signal, wherein

the board has a recessed portion that is formed in a surface of the board to which the metal plate is bonded, and

the optical component is arranged in the recessed portion.

7. The optical module according to claim 6 , wherein the optical component is arranged in the recessed portion such that a height of a surface of the optical component is substantially same as a height of the surface of the board, and the surface of the optical component is connected to the surface of the board by a wire.

8. The optical module according to claim 1 , further comprising a heat-generating component that is arranged on a surface of the board to which the metal plate is bonded, and generates heat.

9. The optical module according to claim 8 , further comprising an electronic component that is arranged on a surface of the board opposite to the surface to which the metal plate is bonded, and generates a smaller amount of heat than the heat-generating component does.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 23, 2020
From: KUBO, TERUHIRO; OJIMA, YUKA; ISHIZAKA, TETSUO; ITO, TOMOYUKI
To: FUJITSU OPTICAL COMPONENTS LIMITED
Reel/Frame 054744/0195 →
Priority Claims (1)
JP JP2020-036724 · Mar 4, 2020 · national
Continuity (1)
Related Publication 20210278614A1 · Sep 9, 2021