Post bond inspection of devices for panel packaging

1. A method for post bond inspection comprising:

providing a carrier with die bond regions, wherein a die bond region includes local carrier fiducials from which a target bond position of the die bond region is derived;

providing a selected die for bonding to a selected die bond region of the die bond regions on the carrier, wherein an active surface of the selected die is bonded to the selected die bond region;

aligning the selected die to the target bond position on the selected die bond region, wherein aligning the selected die to the target bond position comprises

determining the target bond position based on local carrier fiducials of the selected die bond region,

determining a die reference point on the active surface of the selected die, wherein the die reference point is a virtual point,

determining a reference point offset for the die reference point, and

aligning the die reference point to the target bond position;

bonding the selected die (bonded die) to the die bond region after the selected die is aligned to the target bond position; and

performing a post bond inspection on the bonded die, wherein the post bond inspection comprises

determining the target bond position based on the local carrier fiducials of the selected die bond region,

determining a post bond die reference point based on a bonded position of the die (bonded die position) and the reference point offset, and

determining if the post bond die reference point is aligned to the target bond position.

2. The method of claim 1 wherein determining the die reference point comprises determining a plurality of die reference points.

3. The method of claim 2 wherein the plurality of die reference points are offset by a die reference point offset.

4. The method of claim 1 wherein determining the target bond position comprises determining a carrier reference point based on the local carrier fiducials.

5. The method of claim 4 wherein determining the carrier reference point comprises determining a plurality of carrier reference points.

6. The method of claim 5 wherein the plurality of carrier reference points are offset by a carrier reference point offset.

7. The method of claim 1 wherein:

determining the die reference point comprises

identifying first die fiducials on the active surface of the selected die, and

calculating the die reference point based on the first die fiducials; and

determining the reference point offset comprises

identifying second die fiducials on edges of the selected die,

calculating a second die reference point based on the second die fiducials, and

wherein the reference point offset is an offset between the die reference point and the second die reference point.

8. The method of claim 1 wherein determining the reference point offset comprises:

identifying first die fiducials on the active surface of the selected die;

identifying second die fiducials on edges of the selected die; and

wherein the reference point offset is an offset between the first and second die fiducials.

9. The method of claim 1 wherein:

determining the die reference point comprises

identifying first die fiducials on the active surface of the selected die, and

calculating the die reference point based on the first die fiducials; and

determining the reference point offset comprises

identifying second die fiducials on edges of the selected die, and

wherein the reference point offset is an offset between the die reference point and the second die fiducials.

10. The method of claim 1 wherein determining the reference point offset comprises:

identifying first fiducials on the active surface of the selected die;

identifying second die fiducials on edges of the selected die;

calculating a second die reference point based on the second die fiducials; and

wherein the reference point offset is an offset between the second die reference point and first die fiducials.

11. A post bond inspection system for a die bonder comprising:

an integrated camera module configured

to view downwards in a vertical direction for detecting local carrier fiducials of a selected die bond region of an alignment carrier when the alignment carrier is mounted on a base assembly of the die bonder, wherein the alignment carrier includes die bond regions and each die bond region includes local carrier fiducials from which a target bond position is determined, and

to view upwards in the vertical direction for viewing an active (bottom) surface including die fiducials of a selected die, wherein a die reference point is determined from the die fiducials; and

a processor, the processor receives input from the camera module, the processor is configured to perform an inspection including a post bond inspection comprising

determining the target bond position based on the local carrier fiducials of the selected die bond region,

retrieving, from a memory storage, a reference point offset determined for the die reference point during die aligning,

deriving a post bond die reference point based on a bonded position of the die (bonded die position) and the reference point offset, and

determining if the post bond die reference point is aligned to the target bond position.

12. The system of claim 11 wherein the processor is configured to perform the inspection including a pre bond inspection to align the selected die to the target bond position on the selected die bond region, wherein the pre bond inspection comprises

determining the target bond position based on the local carrier fiducials of the selected die bond region,

determining the die reference point on the active surface of the selected die, and

determining the reference point offset for the die reference point, wherein the reference point offset is stored in the memory storage for retrieval.

13. The system of claim 12 wherein determining the die reference point comprises determining a plurality of die reference points.

14. The system of claim 13 wherein the plurality of die reference points are offset by a die reference point offset.

15. The system of claim 12 wherein determining the target bond position comprises determining a carrier reference point based on the local carrier fiducials, wherein the carrier reference point comprises a plurality of carrier reference points.

16. The system of claim 15 wherein the plurality of carrier reference points are offset by a carrier reference point offset.

17. The system of claim 12 wherein:

determining the die reference point comprises

identifying first die fiducials on the active surface of the selected die, and

calculating the die reference point based on the first die fiducials; and

determining the reference point offset comprises

identifying second die fiducials on edges of the selected die,

calculating a second die reference point based on the second die fiducials, and

wherein the reference point offset is an offset between the die reference point and the second die reference point.

18. The system of claim 12 wherein determining the reference point offset comprises:

identifying first die fiducials on the active surface of the selected die;

identifying second die fiducials on edges of the selected die; and

wherein the reference point offset is an offset between the first and second die fiducials.

19. The system of claim 12 wherein:

determining the die reference point comprises

identifying first die fiducials on the active surface of the selected die, and

calculating the die reference point based on the first die fiducials; and

determining the reference point offset comprises

identifying second die fiducials on edges of the selected die, and

wherein the reference point offset is an offset between the die reference point and the second die fiducials.

20. The system of claim 12 wherein determining the reference point offset comprises:

identifying first fiducials on the active surface of the selected die;

identifying second die fiducials on edges of the selected die;

calculating a second die reference point based on the second die fiducials; and

wherein the reference point offset is an offset between the second die reference point and first die fiducials.