IP Library Granted Patent US 12,003,014
Granted Patent B2
US 12,003,014 · App. 17/141,302 · Granted Jun 4, 2024

Antenna module and communication device

Inventor: Ryuken Mizunuma (Kyoto, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H01Q1/2283H01Q1/2266H01Q1/526H01Q9/0421H01Q5/357
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,003,014
App. No.
17/141,302
Granted
Jun 4, 2024
Kind
B2
Abstract

An antenna module includes a substrate that includes a first dielectric layer and a second dielectric layer with a dielectric constant different from a dielectric constant of the first dielectric layer, a first antenna that is disposed on or in the first dielectric layer and transmits and receives a signal in a first frequency band, a second antenna that is disposed on or in the second dielectric layer and transmits and receives a signal in a second frequency band which is a lower frequency band than the first frequency band, and a radio frequency circuit that is disposed on or in the substrate and is electrically connected to the first antenna.

Claims (33)

1. An antenna module comprising:

a substrate that includes a first dielectric layer with a first dielectric constant and a second dielectric layer with a second dielectric constant, wherein the second dielectric constant is different from the first dielectric constant;

a first antenna that is disposed on or in the first dielectric layer and that transmits and receives a signal in a first frequency band;

a second antenna that is disposed on or in the second dielectric layer and that transmits and receives a signal in a second frequency band which is a lower frequency band than the first frequency band;

a radio frequency circuit that is disposed on or in the substrate, and that is electrically connected to the first antenna; and

a ground layer that is disposed between the first antenna and the second antenna, the first antenna and the second antenna opposing to each other,

at least part of the first antenna is disposed in a region overlapping with the second antenna in a plan view.

2. The antenna module according to claim 1 , wherein the second dielectric constant is higher than the first dielectric constant.

3. The antenna module according to claim 2 , wherein the first dielectric layer has a larger area than the second dielectric layer in the plan view.

4. The antenna module according to claim 2 , wherein a connector electrically connected to the second antenna is disposed on or in the first dielectric layer.

5. The antenna module according to claim 2 , wherein the radio frequency circuit is encapsulated within a resin.

6. The antenna module according to claim 2 , further comprising a filter circuit configured to allow at least the signal in the first frequency band to pass therethrough, the filter circuit being disposed on or in the second dielectric layer.

7. The antenna module according to claim 1 , wherein the first dielectric layer has a larger area than the second dielectric layer in the plan view.

8. The antenna module according to claim 7 , wherein a connector electrically connected to the second antenna is disposed on or in the first dielectric layer.

9. The antenna module according to claim 7 , wherein the radio frequency circuit is encapsulated within a resin.

10. The antenna module according to claim 7 , further comprising a filter circuit configured to allow at least the signal in the first frequency band to pass therethrough, the filter circuit being disposed on or in the second dielectric layer.

11. The antenna module according to claim 1 , wherein a connector electrically connected to the second antenna is disposed on or in the first dielectric layer.

12. The antenna module according to claim 1 , wherein the radio frequency circuit is encapsulated within a resin.

13. The antenna module according to claim 12 , wherein a shield layer covers the radio frequency circuit encapsulated within the resin.

14. The antenna module according to claim 1 , further comprising a filter circuit configured to allow at least the signal in the first frequency band to pass therethrough, the filter circuit being disposed on or in the second dielectric layer.

15. The antenna module according to claim 14 , wherein

the second dielectric layer and the radio frequency circuit are disposed adjacent to each other on the surface of the first dielectric layer, and

the antenna module includes a signal path that is disposed on or in the first dielectric layer and the second dielectric layer and that connects the first antenna, the filter circuit, and the radio frequency circuit.

16. A communication device comprising:

the antenna module according to claim 1 ,

a mother board;

a millimeter wave circuit that is disposed on or in the mother board and is connected to the antenna module; and

a microwave circuit that is disposed on or in the mother board and is connected to the antenna module.

17. A communication device comprising:

the antenna module according to claim 2 ,

a mother board;

a millimeter wave circuit that is disposed on or in the mother board and is connected to the antenna module; and

a microwave circuit that is disposed on or in the mother board and is connected to the antenna module.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2021
From: MIZUNUMA, RYUKEN
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 054809/0721 →
Priority Claims (1)
JP 2018-129515 · Jul 6, 2018 · national
Continuity (2)
Continuation PCTJP2019025919 · Jun 28, 2019
Related Publication 20210126341A1 · Apr 29, 2021