IP Library › Patent Application 17142582
Patent Application
App. No. 17/142,582

METHOD OF QUALITY DETERMINING OF DEPOSITION MASK, METHOD OF MANUFACTURING DEPOSITION MASK, METHOD OF MANUFACTURING DEPOSITION MASK DEVICE, METHOD OF SELECTING DEPOSITION MASK AND DEPOSITION MASK

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Quick Facts
Patent No.
US None
App. No.
17/142,582
Abstract

A method of quality determination of a deposition mask according to the present disclosure includes: a measuring step that measures a dimension X 1 from a P 1 point to a Q 1 point, and a dimension X 2 from a P 2 point to a Q 2 point; and a determining step that determines a quality of a deposition mask, based on the dimension X 1 and the dimension X 2 measured in the measuring step.

Claims (289)

1 . A method of quality determination of a deposition mask for determining a quality of a deposition mask extending in a first direction, the deposition mask comprising: a first center axis line that extends in the first direction and is arranged at a center position of a second direction orthogonal to the first direction; a P 1 point and a Q 1 point that are provided on one side of the first center axis line and are spaced apart from each other along the first direction; and a P 2 point and a Q 2 point that are provided on the other side of the first center axis line and are spaced apart from each other along the first direction; the method comprising:

a measuring step that measures a dimension X 1 from the P 1 point to the Q 1 point, and a dimension X 2 from the P 2 point to the Q 2 point; and

a determining step that determines a quality of the deposition mask, based on the dimension X 1 and the dimension X 2 measured in the measuring step.

2 . The method of quality determination of a deposition mask according to claim 1 , wherein

the determining step determines whether an equation below is satisfied:

α

X

-

X

⁢

⁢

1

+

X

⁢

⁢

2

2

≤

α

X

15

×

10

-

3

_

in which α X represents a design value of the dimension X 1 and the dimension X 2 .

3 . The method of quality determination of a deposition mask according to claim 1 , wherein:

the deposition mask has a plurality of through holes; and

the determining step determines whether an equation below is satisfied:

X

⁢

⁢

1

-

X

⁢

⁢

2

≤

α

X

10

×

α

Y

W

Y

×

10

-

3

_

in which α X represents a design value of the dimension X 1 and the dimension X 2 , α Y represents a design value of a dimension from the P 1 point to the P 2 point and a dimension from the Q 1 point to the Q 2 point, and W Y represents a maximum value of a distance between center points of the two through holes in the second direction.

4 . The method of quality determination of a deposition mask according to claim 1 , wherein

the P 1 point and the P 2 point are intended to be symmetrically arranged with respect to the first center axis line during deposition, and the Q 1 point and the Q 2 point are intended to be symmetrically arranged with respect to the first center axis line during deposition.

5 . The method of quality determination of a deposition mask according to claim 1 , wherein:

the P 1 point and the P 2 point are arranged on one side of a second center axis line arranged at a center position of the first direction; and

the Q 1 point and the Q 2 point are arranged on the other side of the second center axis line.

6 . The method of quality determination of a deposition mask according to claim 5 , wherein

the P 1 point and the Q 1 point are intended to be symmetrically arranged with respect to the second center axis line during deposition, and the P 2 point and the Q 2 point are intended to be symmetrically arranged with respect to the second center axis line during deposition.

7 . A method of manufacturing a deposition mask comprising:

a step of preparing a deposition mask; and

a step of determining a quality of the deposition mask by the method of quality determination of a deposition mask according to claim 1 .

8 . A method of manufacturing a deposition mask extending in a first direction, the method comprising:

a step of supplying an elongated metal plate extending in a strip shape;

a step of etching the metal plate by a photolithographic technique to form a first recess in the metal plate from a first surface side; and

a step of etching the metal plate by the photolithography technique to form a second recess in the metal plate from the second surface-side,

the deposition mask comprises:

a first center axis line that extends in the first direction and is arranged at a center position of a second direction orthogonal to the first direction;

a P 1 point and a Q 1 point that are provided on one side of the first center axis line and are spaced apart from each other along the first direction; and

a P 2 point and a Q 2 point that are provided on the other side of the first center axis line and are spaced apart from each other along the first direction;

wherein the deposition mask satisfies an equation below:

α

X

-

X

⁢

⁢

1

+

X

⁢

⁢

2

2

≤

α

X

15

×

10

-

3

_

in which X 1 represents a dimension from the P 1 point to the Q 1 point, X 2 represents a dimension from the P 2 point to the Q 2 point, and α X represents a design value of the dimension X 1 and the dimension X 2 .

9 . The method of manufacturing a deposition mask according to claim 8 , wherein:

the deposition mask has a plurality of through holes formed by communicating the first recess and the second recess with each other; and

wherein the deposition mask satisfies an equation below:

X

⁢

⁢

1

-

X

⁢

⁢

2

≤

α

X

10

×

α

Y

W

Y

×

10

-

3

_

in which α X represents a design value of the dimension X 1 and the dimension X 2 , α Y represents a design value of a dimension from the P 1 point to the P 2 point and a dimension from the Q 1 point to the Q 2 point, and W Y represents a maximum value of a distance between center points of the two through holes in the second direction.

10 . A method of manufacturing a deposition mask extending in a first direction, the method comprising:

a step of supplying an elongated metal plate extending in a strip shape;

a step of etching the metal plate by a photolithographic technique to form a first recess in the metal plate from a first surface side; and

a step of etching the metal plate by the photolithography technique to form a second recess in the metal plate from the second surface side,

the deposition mask comprises:

a first center axis line that extends in the first direction and is arranged at a center position of a second direction orthogonal to the first direction;

a P 1 point and a Q 1 point that are provided on one side of the first center axis line and are spaced apart from each other along the first direction;

a P 2 point and a Q 2 point that are provided on the other side of the first center axis line and are spaced apart from each other along the first direction; and

a plurality of throughholes formed by communicating the first recess and the second recess with each other,

wherein the deposition mask satisfies an equation below:

X

⁢

⁢

1

-

X

⁢

⁢

2

≤

α

X

10

×

α

Y

W

Y

×

10

-

3

_

in which X 1 represents a dimension from the P 1 point to the Q 1 point X 2 represents a dimension from the P 2 point to the Q 2 point α X represents a design value of the dimension X 1 and the dimension X 2 , α Y represents a design value of a dimension from the P 1 point to the P 2 point and a dimension from the Q 1 point to the Q 2 point, and W Y represents a maximum value of a distance between center points of two through holes in the second direction.

11 . A method of manufacturing a deposition mask device comprising:

a step of preparing the deposition mask by the method of manufacturing a deposition mask according to claim 7 ; and

a step of applying a tensile force to the deposition mask in the first direction and stretching the deposition mask on a frame.

12 . A method of selecting a deposition mask extending in a first direction, the deposition mask comprising: a first center axis line that extends in the first direction and is arranged at a center position of a second direction orthogonal to the first direction; a P 1 point and a Q 1 point that are provided on one side of the first center axis line and are spaced apart from each other along the first direction; and a P 2 point and a Q 2 point that are provided on the other side of the first center axis line and are spaced apart from each other along the first direction; the method comprising:

a measuring step that measures a dimension X 1 from the P 1 point to the Q 1 point, and a dimension X 2 from the P 2 point to the Q 2 point; and

a selecting step that selects the deposition mask wherein the dimension X 1 and the dimension X 2 measured in the measuring step satisfy an equation below:

α

X

-

X

⁢

⁢

1

+

X

⁢

⁢

2

2

≤

α

X

15

×

10

-

3

_

in which α X represents a design value of the dimension X 1 and the dimension X 2 .

13 . A method of selecting a deposition mask extending in a first direction and having a plurality of through holes, the deposition mask comprising: a first center axis line that extends in the first direction and is arranged at a center position of a second direction orthogonal to the first direction; a P 1 point and a Q 1 point that are provided on one side of the first center axis line and are spaced apart from each other along the first direction; and a P 2 point and a Q 2 point that are provided on the other side of the first center axis line and are spaced apart from each other along the first direction; the method comprising:

a measuring step that measures a dimension X 1 from the P 1 point to the Q 1 point, and a dimension X 2 from the P 2 point to the Q 2 point; and

a selecting step that selects the deposition mask wherein the dimension X 1 and the dimension X 2 measured in the measuring step satisfy an equation below:

X

⁢

⁢

1

-

X

⁢

⁢

2

≤

α

X

10

×

α

Y

W

Y

×

10

-

3

_

in which α X represents a design value of the dimension X 1 and the dimension X 2 , α Y represents a design value of a dimension from the P 1 point to the P 2 point and a dimension from the Q 1 point to the Q 2 point, and W Y represents a maximum value of a distance between center points of two through holes in the second direction.

14 . A deposition mask extending in a first direction, comprising:

a first center axis line that extends in the first direction and is arranged at a center position of a second direction orthogonal to the first direction;

a P 1 point and a Q 1 point that are provided on one side of the first center axis line and are spaced apart from each other along the first direction; and

a P 2 point and a Q 2 point that are provided on the other side of the first center axis line and are spaced apart from each other along the first direction;

wherein the deposition mask satisfies an equation below:

α

X

-

X

⁢

⁢

1

+

X

⁢

⁢

2

2

≤

α

X

15

×

10

-

3

_

in which X 1 represents a dimension from the P 1 point to the Q 1 point, X 2 represents a dimension from the P 2 point to the Q 2 point, and α X represents a design value of the dimension X 1 and the dimension X 2 .

15 . A deposition mask extending in a first direction and having a plurality of through holes, comprising:

a first center axis line that extends in the first direction and is arranged at a center position of a second direction orthogonal to the first direction;

a P 1 point and a Q 1 point that are provided on one side of the first center axis line and are spaced apart from each other along the first direction; and

a P 2 point and a Q 2 point that are provided on the other side of the first center axis line and are spaced apart from each other along the first direction;

wherein the deposition mask satisfies an equation below:

X

⁢

⁢

1

-

X

⁢

⁢

2

≤

α

X

10

×

α

Y

W

Y

×

10

-

3

_

in which X 1 represents a dimension from the P 1 point to the Q 1 point, X 2 represents a dimension from the P 2 point to the Q 2 point, α X represents a design value of the dimension X 1 and the dimension X 2 , α Y represents a design value of a dimension from the P 1 point to the P 2 point and a dimension from the Q 1 point to the Q 2 point, and W Y represents a maximum value of a distance between center points of two through holes in the second direction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2021
From: IKENAGA, CHIKAO
To: DAI NIPPON PRINTING CO., LTD.
Reel/Frame 056054/0791 →