Semiconductor devices having electro-optical substrates
Memory devices having electro-optical substrates are described herein. In one embodiment, a memory device includes a plurality of memories carried by an electro-optical substrate. The electro-optical substrate can include a circuit board and an optical routing layer on the circuit board. The memories can be (a) electrically coupled to the circuit board and (b) optically coupled to the optical routing layer. In some embodiments, the optical routing layer is a polymer waveguide.
1. A memory device, comprising:
an electro-optical substrate including a waveguide and multiple grating couplings, wherein the waveguide defines a plurality of receive optical paths and a plurality of transmit optical paths, wherein the receive optical paths are optically separated from one another, and wherein the transmit optical paths are optically separated from one another;
a plurality of memories carried by the electro-optical substrate, wherein the memories are electrically coupled to the electro-optical substrate, wherein individual ones of the memories are optically coupled, via a corresponding one of the grating couplings, to (a) a corresponding one of the receive optical paths and (b) a corresponding one of the transmit optical paths, and wherein the receive optical paths and the transmit optical paths are different for each of the memories; and
an optical connector optically coupled to the receive optical paths and the transmit optical paths, wherein individual ones of the memories are optically coupled to the optical connector via (a) the corresponding one of the receive optical paths and (b) the corresponding one of the transmit optical paths.
2. The memory device of claim 1 wherein the optical connector is configured to be optically coupled to an external device.
3. The memory device of claim 1 wherein the optical connector is a multi-fiber push on (MPO) connector.
4. The memory device of claim 1 wherein the electro-optical substrate further includes an electrical substrate coupled to the waveguide, and wherein the memories are electrically coupled to the electrical substrate.
5. The memory device of claim 4 wherein the waveguide is affixed to the electrical substrate.
6. The memory device of claim 4 wherein the electrical substrate is a printed circuit board (PCB).
7. The memory device of claim 1 wherein the waveguide comprises two or more layers of polymer material and does not include a pre-formed substrate.
8. The memory device of claim 1 wherein individual ones of the memories include (a) a first photon integrated circuit (PIC) chip optically coupled to the corresponding one of the receive optical paths and (b) a second PIC chip optically coupled to the corresponding one of the transmit optical paths.
9. A memory device, comprising:
an electro-optical substrate including a waveguide, wherein the waveguide defines a plurality of receive optical paths and a plurality of transmit optical paths, wherein the receive optical paths are optically separated from one another, and wherein the transmit optical paths are optically separated from one another;
a plurality of optical fibers;
a plurality of memories carried by the electro-optical substrate, wherein the memories are electrically coupled to the electro-optical substrate, wherein individual ones of the memories are optically coupled, via a corresponding one of the optical fibers, to (a) a corresponding one of the receive optical paths and (b) a corresponding one of the transmit optical paths, and wherein the receive optical paths and the transmit optical paths are different for each of the memories; and
an optical connector optically coupled to the receive optical paths and the transmit optical paths, wherein individual ones of the memories are optically coupled to the optical connector via (a) the corresponding one of the receive optical paths and (b) the corresponding one of the transmit optical paths, and wherein the optical connector is configured to be optically coupled to an external device.
10. The memory device of claim 9 wherein the electro-optical substrate includes an edge connector, wherein the memories are configured to receive power via the edge connector, and wherein the memories are configured to receive data signals only via the waveguide.
11. The memory device of claim 9 wherein individual ones of the memories include (a) a first photon integrated circuit (PIC) chip optically coupled to the corresponding one of the receive optical paths and (b) a second PIC chip optically coupled to the corresponding one of the transmit optical paths.
12. A memory device, comprising:
an electro-optical substrate having a plurality of receive optical paths and a plurality of transmit optical paths, wherein the receive optical paths are optically separated from one another, and wherein the transmit optical paths are optically separated from one another;
an edge connector coupled to the electro-optical substrate;
a plurality of memories carried by the electro-optical substrate, wherein the memories are electrically coupled to the electro-optical substrate and configured to receive power via the edge connector, wherein individual ones of the memories are optically coupled to (a) a corresponding one of the receive optical paths and (b) a corresponding one of the transmit optical paths, and wherein the receive optical paths and the transmit optical paths are different for each of the memories; and
an optical connector optically coupled to the receive optical paths and the transmit optical paths, wherein individual ones of the memories are optically coupled to the optical connector via (a) the corresponding one of the receive optical paths and (b) the corresponding one of the transmit optical paths.
13. The memory device of claim 12 wherein the memories are configured to receive data signals only via the waveguide.
14. The memory device of claim 12 , further comprising an optical connector optically coupled to the receive optical paths and the transmit optical paths, wherein the optical connector is configured to be optically coupled to an external device.
15. The memory device 14 wherein individual ones of the memories include a photon integrated (PIC) chip optically coupled to the corresponding one of the receive optical paths or the corresponding one of the transmit optical paths.
16. The memory device of claim 12 wherein the electro-optical substrate includes a circuit board and an optical routing layer on the circuit board, wherein the optical routing layer includes two or more layers of polymer material having different refractive indices, and wherein the optical routing layer includes the plurality of receive optical paths and the plurality of transmit optical paths.
17. The memory device of claim 16 wherein the layers of polymer material are formed directly on the circuit board.
18. The memory device of claim 16 wherein the layers of polymer material form an optical waveguide.