Medical device and sheath seal and seal verification
An oximetry device includes an inductive detector. When the oximetry device is sealed in a sheath and a latch of the sheath is in a latched position, the inductive detector inductively detects that latch. The oximeter device uses first information received from the detector for the latch being in the latched position to allow the device to take oximetry measurements. The oximeter device uses second information received from the detector for the latch not being in the latched position to allow the device to display a message on a display of the device that the sheath is not sealed. The displayed message indicates to a user that the sheath lid needs to be closed. The closed lid prevents contaminants in the sheath from reaching patient tissue during use of the device and sheath.
1. A method comprising:
forming a housing for an oximeter device, wherein the housing comprises; sidewall and a bezel located on the sidewall, the sidewall comprises a first opening, the bezel comprises a second opening that is aligned with the first opening, and the bezel has a first height from the sidewall of the housing;
positioning an aperture plate in the second opening of the bezel;
positioning at least a portion of a printed circuit board (PCB) in the second opening of the bezel and in the first opening of the sidewall, wherein the PCB is coupled to the aperture plate inside the second opening and a plurality of detectors are located on a first surface of the PCB inside the second opening;
flowing epoxy over the aperture plate and through apertures formed in the aperture plate to the detectors and PCB; and
polishing the epoxy and bezel to form a probe face of the oximeter device.
2. The method of claim 1 wherein the probe face is flush with a surface of the sidewall of the housing.
3. The method of claim 1 wherein the probe face is above a surface of the sidewall of the housing.
4. The method of claim 3 wherein the probe face is flush with a surface of the bezel.
5. The method of claim 1 wherein flowing the epoxy includes flowing the epoxy between a sidewall of the PCB and a sidewall of the second opening.
6. The method of claim 1 wherein flowing the epoxy includes flowing the epoxy between a sidewall of the PCB and a sidewall of the first opening, and flowing the epoxy between the sidewall of the PCB and a sidewall of the second opening.
7. The method of claim 1 comprising positioning a plurality of spacers between the first surface of the PCB and a surface of the aperture plate.
8. The method of claim 1 wherein the detectors are photodetectors.
9. The method of claim 1 wherein the sidewall comprises a first end and a second end, the first end is proximally located to the first opening of the housing and the second end is distally located from the first opening of the housing, and the aperture plate is nearer the second end than the first end.
10. The method of claim 9 wherein each of the detectors is registered with one of the apertures on the aperture plate, such that light entering the apertures is detectable by the detectors.
11. The method of claim 1 comprising:
coupling a plurality of spacers to a surface of the printed circuit board that faces the aperture plate; and
coupling the spacers to a surface of the aperture plate that faces the printed circuit board.
12. The method of claim 1 wherein the polishing removes a portion of the epoxy and a portion of the bezel, after the polishing the bezel has a second height from the sidewall of the housing, and the second height is less than the first height.
13. A method comprising:
forming a housing for an oximeter device, wherein the housing comprises; a sidewall and a bezel extending from the sidewall of the housing, the sidewall comprises a first opening, the bezel comprises a second opening that is aligned with the first opening, and the bezel has a first height from the sidewall of the housing;
positioning an aperture plate in the second opening of the bezel;
positioning at least a portion of a printed circuit board (PCB) in the second opening of the bezel and in the first opening of the sidewall, wherein the PCB is coupled to the aperture plate inside the second opening and a plurality of photodetectors are located on a first surface the PCB inside the second opening and aligned with apertures of the aperture plate;
flowing epoxy over the aperture plate and through the apertures formed in the aperture plate to the photodetectors and PCB; and
polishing the epoxy and bezel to form a probe face of the oximeter device.
14. The method of claim 13 wherein the probe face is flush with a surface of the sidewall of the housing.
15. The method of claim 13 wherein the probe face is above a surface of the sidewall of the housing.
16. The method of claim 15 wherein the probe face is flush with a surface of the bezel.
17. The method of claim 13 wherein flowing the epoxy includes flowing the epoxy between a sidewall of the PCB and a sidewall of the second opening.
18. The method of claim 13 wherein flowing the epoxy includes flowing the epoxy between a sidewall of the PCB and a sidewall of the first opening, and flowing the epoxy between the sidewall of the PCB and a sidewall of the second opening.
19. The method of claim 13 comprising positioning a plurality of spacers between a first surface of the PCB and a surface of the aperture plate.
20. The method of claim 13 wherein the sidewall comprises a first end and a second end, the first end is proximally located to the first opening of the housing and the second end is distally located from the first opening of the housing, and the aperture plate is nearer the second end than the first end.
21. The method of claim 20 wherein each of the detectors is registered with one of the apertures on the aperture plate, such that light entering the apertures is detectable by the detectors.
22. The method of claim 13 comprising:
coupling a plurality of spacers to a surface of the printed circuit board that faces the aperture plate; and
coupling the spacers to a surface of the aperture plate that faces the printed circuit board.
23. The method of claim 13 wherein the polishing removes a portion of the epoxy and a portion of the bezel, after the polishing the bezel has a second height from the sidewall of the housing, and the second height is less than the first height.
24. A device comprising:
a housing comprising a processor located in the housing and a bottom wall, wherein an opening is formed in the bottom wall;
a portion of a printed circuit board located in the opening;
an aperture plate located in the opening, comprising a plurality of apertures;
a plurality of spacers coupled to a surface of the printed circuit board that faces the aperture plate and coupled to a surface of the aperture plate that faces the printed circuit board;
a source structure located in the opening;
a plurality of photodetectors formed on the surface of the printed circuit board and registered with the apertures, wherein the photodetectors are coupled to the processor; and
an epoxy material located over a surface of the aperture plate that faces away from the printed circuit board, wherein the device is an oximeter.
25. The device of claim 24 wherein the epoxy is located in the apertures of the aperture plate.
26. The device of claim 24 wherein the epoxy is located in a space between the aperture plate and the printed circuit board.
27. The device of claim 24 wherein the epoxy is located between a sidewall of the opening and a portion of a sidewall of the printed circuit board located in the opening.
28. The device of claim 24 wherein a portion of the photodetectors is located in the apertures of the aperture plate.
29. The device of claim 24 wherein the photodetectors are located below the surface of the aperture plate that faces the printed circuit board.