Organic optoelectronic component with a coupling-out layer
An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit radiation during operation of the component; a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer; and a protective layer above the coupling-out layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, the protective layer cannot be removed without at least partially destroying the coupling-out layer, and adhesion of the structured layer to the planarization layer is smaller than adhesion of the protective layer to the planarization layer.
1. An organic optoelectronic component comprising:
an organic functional layer stack between a first electrode and a second electrode comprising a light-emitting layer formed to emit radiation during operation of the component;
a coupling-out layer arranged above the first electrode and/or the second electrode, which is in a beam path of the radiation of the light-emitting layer; and
a protective layer above the coupling-out layer,
wherein the protective layer is configured so that the coupling-out layer is at least partially destroyed during removal of the protective layer.
2. The organic optoelectronic component according to claim 1 , wherein the coupling-out layer comprises a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, and wherein the planarization layer planarizes the structured surface of the structured layer.
3. The organic optoelectronic component according to claim 2 , wherein the structured layer has structures not visible at least in places for a viewer from outside the organic optoelectronic component.
4. The organic optoelectronic component according to claim 2 , wherein the structured layer has structures that have a size of 1 Nanometer to 100 Micrometer.
5. The organic optoelectronic component according to claim 2 , wherein the structuring is periodic or non-periodic.
6. The organic optoelectronic component according to claim 2 , wherein the planarization layer comprises a polymer and the polymer is selected from the group consisting of polyimides, polyacrylates, epoxy resins and silicones.
7. The organic optoelectronic component according to claim 2 , wherein the planarization layer comprises nanoparticles of a metal oxide at least in places.
8. The organic optoelectronic component according to claim 2 , wherein the structured layer is a substrate, a scattering layer or an encapsulation layer.
9. The organic optoelectronic component according to claim 2 , wherein the structured layer comprises glass.
10. The organic optoelectronic component according to claim 2 , wherein a self-organizing monolayer is arranged between the structured layer and the planarization layer.
11. The organic optoelectronic component according to claim 10 , wherein the self-organizing monolayer is formed from thiols, silanes, silanols or phosphonates.
12. The organic optoelectronic component according to claim 2 , wherein the planarization layer is formed from a material having adhesive properties.
13. The organic optoelectronic component according to claim 2 , wherein the planarization layer and the structured layer comprise the same materials.
14. An organic optoelectronic component comprising:
an organic functional layer stack between a first electrode and a second electrode comprising a light-emitting layer formed to emit radiation during operation of the component;
a coupling-out layer arranged above the first electrode and/or the second electrode, which is in a beam path of the radiation of the light-emitting layer; and
a protective layer above the coupling-out layer,
wherein the protective layer cannot be removed without at least partially destroying the coupling-out layer,
wherein the coupling-out layer comprises a structured layer and a planarization layer arranged thereabove,
wherein the structured layer has a structured surface structured at least in places, and
wherein the planarization layer planarizes the structured surface of the structured layer by filling recesses of the surface of the structured layer.