IP Library › Granted Patent US 12,315,571
Granted Patent B2
US 12,315,571 · App. 17/151,226 · Granted May 27, 2025

Semiconductor structure with wave shaped erase gate and forming method thereof

Inventors: Yi-Ning Peng (Miaoli County, TW); Hsueh-Chun Hsiao (Hsinchu County, TW); Tzu-Yun Chang (Hsinchu County, TW)
Assignee: UNITED MICROELECTRONICS CORP.
G11C16/24G11C16/08H10B41/10H10B41/27H10D30/681
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Quick Facts
Patent No.
US 12,315,571
App. No.
17/151,226
Granted
May 27, 2025
Kind
B2
Abstract

An electrically erasable programmable read only memory (EEPROM) includes a substrate, isolation structures, a row of erase gate and a row of floating gates. The isolation structures are defined in the substrate to extend in a first direction. The row of erase gate having a wave shape is disposed across the substrate. The row of floating gates having staggered islands is disposed parallel to the row of erase gate. A method of forming said electrically erasable programmable read only memory (EEPROM) is also provided.

Claims (14)

1. A semiconductor structure with wave shaped erase gate, comprising:

a substrate;

isolation structures defined in the substrate to extend in a first direction;

an erase gate having a wave shape disposed across the substrate when viewed from a top view, wherein the wave shape has first parts connecting to second-one parts and second-two parts, wherein the first parts, the second-one parts and the second-two parts are directly connected with each other, wherein the first parts, the second-one parts, the first parts and the second-two parts are alternatingly and repeatingly arranged, wherein the first parts extend along a second direction, the second-one parts extend along a third direction and the second-two parts extend along a fourth direction, and wherein the third direction and the fourth direction are not orthogonal to the second direction, and wherein the first parts overlap the substrate, the second-one parts and the second-two parts overlap the isolation structures, but the first parts do not overlap the isolation structures; and

floating gates having staggered islands disposed parallel to the erase gate when viewed from the top view.

2. The semiconductor structure with wave shaped erase gate according to claim 1 , further comprising:

a word line having the wave shape disposed parallel to the erase gate and at a side of the floating gates opposite to the erase gate.

3. The semiconductor structure with wave shaped erase gate according to claim 1 , wherein the second-one parts and the second-two parts extend along different directions.

4. The semiconductor structure with wave shaped erase gate according to claim 1 , wherein the second direction is orthogonal to the first direction.

5. The semiconductor structure with wave shaped erase gate according to claim 1 , wherein the third direction and the fourth direction have common absolute values of slope.

6. The semiconductor structure with wave shaped erase gate according to claim 1 , wherein two of the first parts adjacent to each other are dislocated.

7. The semiconductor structure with wave shaped erase gate according to claim 1 , wherein a length of a gap between two adjacent floating gates is defined as g, and a length of a shifting between two adjacent floating gates is defined as s, and wherein a ratio of the g and the s is between 63:45 to 45:63.

8. The semiconductor structure with wave shaped erase gate according to claim 1 , further comprising:

a source line located right below the erase gate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 18, 2021
From: PENG, YI-NING; HSIAO, HSUEH-CHUN; CHANG, TZU-YUN
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 054941/0086 →
Continuity (1)
Related Publication 20220230689A1 · Jul 21, 2022
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