Semiconductor device and manufacturing method of semiconductor device
A semiconductor device includes a stacked structure including conductive layers and insulating layers stacked alternately with each other, a channel layer passing through the stacked structure, a ferroelectric layer surrounding a sidewall of the channel layer, a first dielectric layer surrounding a sidewall of the ferroelectric layer, and sacrificial patterns interposed between the first dielectric layer and the insulating layers and including a material with a higher dielectric constant than the first dielectric layer.
1. A semiconductor device, comprising:
a stacked structure with conductive layers and insulating layers that are stacked alternately with each other;
a channel layer passing through the stacked structure;
a ferroelectric layer surrounding a sidewall of the channel layer;
a first dielectric layer surrounding a sidewall of the ferroelectric layer; and
sacrificial patterns interposed between the first dielectric layer and the insulating layers, the sacrificial patterns including a material with a higher dielectric constant than the first dielectric layer.
2. The semiconductor device of claim 1 , wherein each of the insulating layers comprises a first portion interposed between the conductive layers and a second portion that protrudes further toward the channel layer than the conductive layers.
3. The semiconductor device of claim 2 , wherein the second portion has a rounded edge.
4. The semiconductor device of claim 1 , wherein the ferroelectric layer includes grooves on a sidewall thereof, and
wherein the grooves are located at levels that correspond to the insulating layers.
5. The semiconductor device of claim 1 , further comprising a second dielectric layer interposed between the first dielectric layer and the ferroelectric layer, the second dielectric layer with a material that has a higher dielectric constant than the first dielectric layer.
6. The semiconductor device of claim 1 , further comprising a second dielectric layer interposed between the first dielectric layer and the ferroelectric layer, the second dielectric layer with a material that has a larger band gap than the ferroelectric layer.
7. The semiconductor device of claim 1 , further comprising a third dielectric layer interposed between the ferroelectric layer and the channel layer, the third dielectric layer with a material that has a higher dielectric constant than the first dielectric layer.
8. The semiconductor device of claim 1 , further comprising a third dielectric layer interposed between the ferroelectric layer and the channel layer, the third dielectric layer with a material that has a larger band gap than the ferroelectric layer.
9. The semiconductor device of claim 1 , where each of the insulating layers includes an air gap.
10. The semiconductor device of claim 1 , wherein the ferroelectric layer includes ferroelectric patterns that are interposed between the channel layer and the conductive layers, the ferroelectric patterns being separated from each other.
11. The semiconductor device of claim 1 , wherein the first dielectric layer includes a material with a larger band gap than the ferroelectric layer.