Extreme ultraviolet mask absorber materials
Extreme ultraviolet (EUV) mask blanks, methods for their manufacture and production systems therefor are disclosed. The EUV mask blanks comprise a substrate; a multilayer stack of reflective layers on the substrate; a capping layer on the multilayer stack of reflecting layers; and an absorber layer on the capping layer, the absorber layer made from tantalum and ruthenium.
1. A method of manufacturing an extreme ultraviolet (EUV) mask blank comprising:
forming on a substrate a multilayer stack which reflects EUV radiation, the multilayer stack comprising a plurality of reflective layer pairs;
forming a capping layer on the multilayer stack; and
forming an absorber layer on the capping layer, the absorber layer comprising an alloy of tantalum and ruthenium, wherein the alloy of tantalum and ruthenium comprises from about 20 wt. % to about 70 wt. % tantalum and from about 30 wt. % to about 80 wt. % ruthenium.
2. The method of claim 1 , wherein the alloy of tantalum and ruthenium comprises a single phase alloy.
3. The method of claim 1 , wherein the alloy of tantalum and ruthenium comprises from about 30 wt. % to about 60 wt. % tantalum and from about 40 wt. % to about 70 wt. % ruthenium.
4. The method of claim 1 , wherein the alloy of tantalum and ruthenium comprises from about 40 wt. % to about 50 wt. % tantalum and from about 50 wt. % to about 60 wt. % ruthenium.
5. The method of claim 1 , wherein the alloy of tantalum and ruthenium is amorphous.
6. The method of claim 1 , wherein the alloy is formed by co-sputtered tantalum and ruthenium with a gas selected from one or more of argon (Ar), oxygen (O 2 ), or nitrogen (N 2 ) to form the absorber layer.
7. The method of claim 1 , wherein the absorber layer has a thickness in range of from 1 nm to 40 nm.
8. The method of claim 1 , wherein the alloy is deposited using a bulk target having a same composition as the alloy and is sputtered using a gas selected from one or more of argon (Ar), oxygen (O 2 ), or nitrogen (N 2 ) to form the absorber layer.
9. The method of claim 1 , wherein the alloy of tantalum and ruthenium is doped with one of more of nitrogen or oxygen in a range of from 0.1 wt. % to 5 wt. %.
10. The method of claim 1 , wherein the alloy of tantalum and ruthenium is doped with one of more of nitrogen or oxygen in a range of from about 0.1 wt. % to about 5 wt. %.
11. An extreme ultraviolet (EUV) mask blank comprising:
a substrate;
a multilayer stack which reflects EUV radiation, the multilayer stack comprising a plurality of reflective layer pairs;
a capping layer on the multilayer stack of reflecting layers; and
an absorber layer comprising an alloy of tantalum and ruthenium, wherein the alloy of tantalum and ruthenium comprises from about 20 wt. % to about 70 wt. % tantalum and from about 30 wt. % to about 80 wt. % ruthenium.
12. The extreme ultraviolet (EUV) mask blank of claim 11 , wherein the alloy of tantalum and ruthenium comprises a single phase alloy.
13. The extreme ultraviolet (EUV) mask blank of claim 11 , the alloy of tantalum and ruthenium comprises from about 30 wt. % to about 60 wt. % tantalum and from about 40 wt. % to about 70 wt. % ruthenium.
14. The extreme ultraviolet (EUV) mask blank of claim 11 , wherein the alloy of tantalum and ruthenium comprises from about 40 wt. % to about 50 wt. % tantalum and from about 50 wt. % to about 60 wt. % ruthenium.
15. The extreme ultraviolet (EUV) mask blank of claim 13 , wherein the alloy of tantalum and ruthenium is amorphous.
16. The extreme ultraviolet (EUV) mask blank of claim 11 , wherein the absorber layer has a thickness in a range of from 1 nm to 40 nm.
17. The extreme ultraviolet (EUV) mask blank of claim 11 , wherein the absorber layer further comprises a range of from about 0.1 wt. % to about 5 wt. % of a dopant selected from one or more of nitrogen or oxygen.
18. The extreme ultraviolet (EUV) mask blank of claim 15 , wherein the absorber layer has a thickness of less than 45 nm.
19. The extreme ultraviolet (EUV) mask blank of claim 11 , wherein the absorber layer is etch selective relative to the capping layer.
20. An extreme ultraviolet (EUV) mask blank comprising:
a substrate;
a multilayer stack which reflects EUV radiation, the multilayer stack comprising a plurality of reflective layer pairs including molybdenum (Mo) and silicon (Si);
a capping layer on the multilayer stack of reflecting layers; and
an absorber layer comprising an alloy of tantalum and ruthenium, wherein the alloy of tantalum and ruthenium comprises from about 20 wt. % to about 70 wt. % tantalum and from about 30 wt. % to about 80 wt. % ruthenium, the alloy comprises a single phase alloy and the absorber layer has a thickness in a range of from 1 nm to 40 nm.