IP Library Granted Patent US 11,334,124
Granted Patent B2
US 11,334,124 · App. 17/152,794 · Granted May 17, 2022

Electronic device

Inventors: Kai-Cheng Chao (Taipei, TW); Chia-Huang Chan (Taipei, TW); You-Yu Chen (Taipei, TW); Chia-Hao Hsu (Taipei, TW)
Assignee: COMPAL ELECTRONICS, INC.
G06F1/1681G06F1/203H05K7/20145G06F2200/202
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Quick Facts
Patent No.
US 11,334,124
App. No.
17/152,794
Granted
May 17, 2022
Kind
B2
Abstract

An electronic device including two bodies, at least one hinge assembly, and a hinge cover is provided. The two bodies are pivoted to each other through the hinge assembly. The hinge cover is connected between the two bodies and covers the hinge assembly. The hinge cover includes a plurality of shell parts, and the shell parts are movably connected to each other in sequence. The hinge cover has at least one first heat dissipation opening and at least one heat dissipation flow channel, and the at least one heat dissipation flow channel communicates the first heat dissipation opening and an inner space of at least one of the bodies.

Claims (16)

1. An electronic device, comprising:

two bodies;

at least one hinge assembly, wherein the two bodies are pivoted to each other through the at least one hinge assembly; and

a hinge cover, connected between the two bodies and covering the at least one hinge assembly, the hinge cover comprising a plurality of shell parts movably connected to each other in sequence, at least one first heat dissipation opening, and at least one heat dissipation flow channel, wherein the at least one heat dissipation flow channel communicates with the at least one first heat dissipation opening and an inner space of at least one of the bodies.

2. The electronic device according to claim 1 , comprising a heat dissipation fan disposed in the inner space of the at least one of the bodies and adapted to provide a heat dissipation air flow, wherein at least a part of the heat dissipation air flow passes through the at least one heat dissipation flow channel and flows out of the electronic device from the at least one first heat dissipation opening.

3. The electronic device according to claim 2 , comprising a heat dissipation structure disposed in the inner space of the at least one of the bodies and located between the heat dissipation fan and the at least one heat dissipation flow channel, wherein at least a part of the heat dissipation air flow flows along the heat dissipation structure and arrives at the at least one heat dissipation flow channel.

4. The electronic device according to claim 2 , comprising a display module disposed in the inner space of the at least one of the bodies, wherein the at least one of the bodies comprises a second heat dissipation opening, and a part of the heat dissipation air flow flows along a surface of the display module and flows out of the electronic device from the second heat dissipation opening.

5. The electronic device according to claim 1 , wherein the number of the at least one first heat dissipation opening is plural, and the first heat dissipation openings are formed in at least a part of the shell parts, respectively.

6. The electronic device according to claim 1 , wherein an overlapping region exists between any two adjacent shell parts of the shell parts, and a size of the overlapping region is changed along with relative movement of the shell parts.

7. The electronic device according to claim 1 , wherein at least one retaining wall is arranged in the hinge cover, and the at least one retaining wall separates the at least one hinge assembly from the at least one heat dissipation flow channel.

8. The electronic device according to claim 7 , wherein each of the shell parts comprises at least one extending wall, and the extending walls of the shell parts are arranged in sequence to constitute the at least one retaining wall.

9. The electronic device according to claim 1 , wherein the hinge cover comprises a line channel, a line is suitable for extending from one of the bodies to the other one of the bodies through the line channel, at least one retaining wall is arranged in the hinge cover, and the at least one retaining wall separates the line channel from the at least one heat dissipation flow channel.

10. The electronic device according to claim 9 , wherein each of the shell parts comprises at least one extending wall, and the extending walls of the shell parts are arranged in sequence to constitute the at least one retaining wall.

11. The electronic device according to claim 1 , wherein the at least one hinge assembly comprises a plurality of rotating shafts movably connected to each other in sequence, and the shell parts are connected to the rotating shafts, respectively.

12. The electronic device according to claim 11 , comprising a plurality of buckle members installed on the rotating shafts, respectively, wherein each of the shell parts comprises at least one buckle part, and the buckle parts of the shell parts are buckled on the plurality of buckle members, respectively.

13. The electronic device according to claim 12 , wherein each buckle member of the plurality of buckle members comprises a receding notch, and when the rotating shafts move relatively, the receding notch provides space for another adjacent buckle member of the plurality of buckle members to move.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2021
From: CHAO, KAI-CHENG; CHAN, CHIA-HUANG; CHEN, YOU-YU; HSU, CHIA-HAO
To: COMPAL ELECTRONICS, INC.
Reel/Frame 054959/0242 →
Priority Claims (1)
TW 109116260 · May 15, 2020 · national
Continuity (1)
Related Publication 20210356999A1 · Nov 18, 2021
Cited By (1)
US 12,200,897