MAGNETIC COLLET
Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.
1 . A magnetic collet comprising:
adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof; and
a metal plate including a common hole, which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes, and stacked on the adsorption rubber.
2 . The magnetic collet of claim 1 , wherein the plurality of individual holes are disposed in at least two rows in a direction from a first side of the contact surface toward a second surface corresponding to the first side.
3 . The magnetic collet of claim 2 , wherein:
the common hole has an “H” shape in which two first holes spaced apart from each other and a second hole connecting the first holes are formed; and
the plurality of individual holes are disposed in rows at positions corresponding to the first holes.
4 . The magnetic collet of claim 1 , wherein the adsorption rubber further includes a common groove providing a common passage disposed in the contact surface and connected to the individual holes.
5 . The magnetic collet of claim 1 , wherein the contact surface is formed to protrude from the one surface of the adsorption rubber.
6 . The magnetic collet of claim 1 , wherein an open area of the plurality of individual holes in the contact surface is less than an open area thereof in the other surface of the adsorption rubber.
7 . The magnetic collet of claim 1 , wherein the contact surface, which comes into contact with the semiconductor chip, of the adsorption rubber is formed in a round shape.
8 . The magnetic collet of claim 7 , wherein a thickness of the round shape increases in a direction toward a central portion of the contact surface.
9 . The magnetic collet of claim 7 , wherein a thickness of the round shape decreases in a direction from a central portion of the contact surface toward a first side and a second side positioned at both sides of the contact surface.
10 . A magnetic collet comprising:
adsorption rubber in which a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to a protrusion formed on the other surface thereof are formed; and
a metal plate including an insertion hole formed therein and stacked on the adsorption rubber, wherein the protrusion of the adsorption rubber is insertion-coupled to the insertion hole.
11 . The magnetic collet of claim 10 , wherein a first common groove connected to the individual holes is formed in the protrusion of the adsorption rubber.
12 . The magnetic collet of claim 10 , wherein the plurality of individual holes are disposed in at least two rows in a direction from a first side of the contact surface toward a second side thereof.
13 . The magnetic collet of claim 11 , wherein a second common hole connected to the individual holes is formed in the contact surface of the adsorption rubber.
14 . The magnetic collet of claim 13 , wherein a diameter of a passage of a first common hole is less than a diameter of a passage of the second common hole.
15 . The magnetic collet of claim 10 , wherein the contact surface is formed to protrude from the one surface of the adsorption rubber.
16 . The magnetic collet of claim 10 , wherein an open area of the plurality of individual holes in the contact surface is less than an open area thereof in the protrusion.
17 . The magnetic collet of claim 10 , wherein the contact surface, which comes into contact with the semiconductor chip, of the adsorption rubber is formed in a round shape.
18 . The magnetic collet of claim 17 , wherein a thickness of the round shape increases in a direction toward a central portion of the contact surface.
19 . The magnetic collet of claim 17 , wherein a thickness of the round shape decreases in a direction from a central portion of the contact surface toward a first side and a second side positioned at both sides of the contact surface.