IP Library › Granted Patent US 11,442,349
Granted Patent B2
US 11,442,349 · App. 17/154,633 · Granted Sep 13, 2022

Wavelength conversion element, method of manufacturing wavelength conversion element, light source device, and projector

Inventor: Tomohiro Yokoo (Matsumoto, JP)
Assignee: Seiko Epson Corporation
G03B21/204
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Quick Facts
Patent No.
US 11,442,349
App. No.
17/154,633
Granted
Sep 13, 2022
Kind
B2
Abstract

A wavelength conversion element includes: a wavelength conversion layer that is formed with a plurality of pores and that is excited by light in a first wavelength band to generate light in a second wavelength band different from the light in the first wavelength band; a first bonding layer formed at a first surface of the wavelength conversion layer; a second bonding layer bonded to the first bonding layer; and a reflection member that is formed at the second bonding layer and that reflects the light in the first wavelength band or the light in the second wavelength band. The first surface of the wavelength conversion layer is formed with a recess. A part of the first bonding layer is formed at the recess. The second bonding layer is formed to cover the recess. The first bonding layer and the second bonding layer are plasma polymerized films.

Claims (59)

1. A wavelength conversion element comprising:

a wavelength conversion layer that is formed with a plurality of pores and that is excited by light in a first wavelength band to generate light in a second wavelength band different from the light in the first wavelength band;

a first bonding layer formed at a first surface of the wavelength conversion layer;

a second bonding layer bonded to the first bonding layer; and

a reflection member that is formed at the second bonding layer and that reflects the light in the first wavelength band or the light in the second wavelength band, wherein

the first surface of the wavelength conversion layer is formed with a recess,

a part of the first bonding layer is formed at the recess,

the second bonding layer is formed so as to cover the recess, and

the first bonding layer and the second bonding layer are plasma polymerized films.

2. The wavelength conversion element according to claim 1 , further comprising:

a support substrate; and

a third bonding layer that bonds the support substrate and the reflection member.

3. The wavelength conversion element according to claim 2 , wherein

a refractive index of the first bonding layer is lower than a refractive index of the wavelength conversion layer.

4. A light source device comprising:

the wavelength conversion element according to claim 3 ; and

a light source that emits the light in the first wavelength band toward the wavelength conversion element.

5. A projector comprising:

the light source device according to claim 4 ;

a light modulation device that forms image light by modulating light from the light source device according to image information; and

a projection optical system that projects the image light.

6. A light source device comprising:

the wavelength conversion element according to claim 2 ; and

a light source that emits the light in the first wavelength band toward the wavelength conversion element.

7. A projector comprising:

the light source device according to claim 6 ;

a light modulation device that forms image light by modulating light from the light source device according to image information; and

a projection optical system that projects the image light.

8. The wavelength conversion element according to claim 1 , wherein

a refractive index of the first bonding layer is lower than a refractive index of the wavelength conversion layer.

9. A light source device comprising:

the wavelength conversion element according to claim 8 ; and

a light source that emits the light in the first wavelength band toward the wavelength conversion element.

10. A projector comprising:

the light source device according to claim 9 ;

a light modulation device that forms image light by modulating light from the light source device according to image information; and

a projection optical system that projects the image light.

11. A light source device comprising:

the wavelength conversion element according to claim 1 ; and

a light source that emits the light in the first wavelength band toward the wavelength conversion element.

12. A projector comprising:

the light source device according to claim 11 ;

a light modulation device that forms image light by modulating light from the light source device according to image information; and

a projection optical system that projects the image light.

13. A method of manufacturing a wavelength conversion element, the method comprising:

a preparation step of preparing a wavelength conversion layer that has a plurality of pores, a first surface, and a recess formed at the first surface and that is excited by light in a first wavelength band to generate light in a second wavelength band different from the light in the first wavelength band;

a first step of forming a first bonding layer at the first surface of the wavelength conversion layer;

a second step of forming a reflection member at a second surface of a substrate;

a third step of forming a second bonding layer at the reflection member;

a fourth step of applying energy to the first bonding layer and the second bonding layer;

a fifth step of pressing the first bonding layer and the second bonding layer, and bonding the first bonding layer and the second bonding layer so that the recess is covered by the second bonding layer; and

a sixth step of separating the reflection member and the substrate, wherein

in the first step, a part of the first bonding layer is formed in the recess.

14. The method of manufacturing a wavelength conversion element according to claim 13 , the method further comprising:

after the sixth step, a seventh step of bonding a bonded body and a support substrate via a third bonding layer, the bonded body being obtained by bonding the wavelength conversion layer and the reflection member by the first bonding layer and the second bonding layer.

15. The method of manufacturing the wavelength conversion element according to claim 14 , wherein

in the first step, the first bonding layer is formed using a material having a lower refractive index than the wavelength conversion layer.

16. The method of manufacturing the wavelength conversion element according to claim 13 , wherein

in the first step, the first bonding layer is formed using a material having a lower refractive index than the wavelength conversion layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 21, 2021
From: YOKOO, TOMOHIRO
To: SEIKO EPSON CORPORATION
Reel/Frame 054991/0007 →
Priority Claims (1)
JP JP2020-008513 · Jan 22, 2020 · national
Continuity (1)
Related Publication 20210223672A1 · Jul 22, 2021