IP Library Granted Patent US 11,218,343
Granted Patent B2
US 11,218,343 · App. 17/156,813 · Granted Jan 4, 2022

Memory device and memory system including the same

Inventors: Jaewoo Park (Yongin-si, KR); Youngdon Choi (Seoul, KR); Junghwan Choi (Hwaseong-si, KR); Changsik Yoo (Seoul, KR)
Assignees: Samsung Electronics Co., Ltd.; IUCF-HYU (Industry-University Cooperation Four
H04L25/0272H04L25/14H04L25/4917
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Quick Facts
Patent No.
US 11,218,343
App. No.
17/156,813
Granted
Jan 4, 2022
Kind
B2
Abstract

Provided are a memory device and a memory system including the same. The memory device may include a data bus inversion (DBI) mode selector configured to select a first multi-bit DBI signal from among a plurality of multi-bit DBI signals respectively corresponding to a plurality of DBI modes according to multi-bit data; a multi-mode DBI encoder configured to generate encoded multi-bit data by DBI encoding the multi-bit data according to the first multi-bit DBI signal; and a transceiver configured to transmit a data symbol corresponding to the encoded multi-bit data through a data channel and transmit a DBI symbol corresponding to the first multi-bit DBI signal through a DBI channel.

Claims (68)

1. A memory device, comprising:

a data bus inversion (DBI) mode selector configured to select a first multi-bit DBI signal from among a plurality of multi-bit DBI signals respectively corresponding to a plurality of DBI modes according to multi-bit data;

a multi-mode DBI encoder configured to generate encoded multi-bit data by DBI encoding the multi-bit data according to the first multi-bit DBI signal; and

a transceiver configured to transmit a data symbol corresponding to the encoded multi-bit data through a data channel and transmit a DBI symbol corresponding to the first multi-bit DBI signal through a DBI channel.

2. The memory device as claimed in claim 1 , wherein:

the multi-bit data includes 2-bit data, and

each of the plurality of multi-bit DBI signals includes a 2-bit signal.

3. The memory device as claimed in claim 2 , wherein the plurality of DBI modes include:

a first DBI mode in which all bits of the 2-bit data are not inverted;

a second DBI mode in which only a least significant bit (LSB) of the 2-bit data is inverted;

a third DBI mode in which only a most significant bit (MSB) of the 2-bit data is inverted; and

a fourth DBI mode in which all bits of the 2-bit data are inverted.

4. The memory device as claimed in claim 2 , wherein the transceiver includes:

a data transceiver configured to generate the data symbol having one voltage level from among first to fourth voltage levels, from the 2-bit data by using a pulse amplitude modulation (PAM)-4 scheme; and

a DBI transceiver configured to generate the DBI symbol having one voltage level from among the first to fourth voltage levels, from the first multi-bit DBI signal by using the PAM-4 scheme.

5. The memory device as claimed in claim 1 , wherein:

the multi-bit data includes 3-bit data,

each of the plurality of multi-bit DBI signals includes a 3-bit signal, and the transceiver includes:

a data transceiver configured to generate the data symbol having one voltage level from among first to eighth voltage levels, from the 3-bit data by using a pulse amplitude modulation (PAM)-8 scheme; and

a DBI transceiver configured to generate the DBI symbol having one voltage level from among the first to eighth voltage levels, from the first multi-bit DBI signal by using the PAM-8 scheme.

6. The memory device as claimed in claim 1 , wherein the DBI mode selector is further configured to select the first multi-bit DBI signal such that a transmission consumption current for the data symbol is minimized.

7. The memory device as claimed in claim 1 , wherein:

the data channel includes a plurality of data channels,

the multi-mode DBI encoder includes a plurality of multi-mode DBI encoders configured to generate a plurality of pieces of encoded multi-bit data by DBI encoding a plurality of pieces of multi-bit data, respectively, according to the first multi-bit DBI signal, and

the transceiver includes a plurality of data transceivers configured to transmit a plurality of data symbols corresponding to the encoded multi-bit data through the plurality of data channels, respectively.

8. The memory device as claimed in claim 7 , wherein the DBI mode selector is further configured to count a number of each of a plurality of data patterns in the multi-bit data, and, based on the counted numbers, select the first multi-bit DBI signal such that a transmission consumption current for the plurality of data symbols is minimized.

9. The memory device as claimed in claim 7 , wherein:

the DBI mode selector includes:

a first DBI mode selector configured to select the first multi-bit DBI signal from among the plurality of multi-bit DBI signals, according to a data pattern of first multi-bit data from among the multi-bit data; and

a second DBI mode selector configured to select a second multi-bit DBI signal from among the plurality of multi-bit DBI signals, according to a data pattern of second multi-bit data from among the multi-bit data, and

the plurality of multi-mode DBI encoders include:

a first multi-mode DBI encoder configured to generate first encoded multi-bit data by DBI encoding the first multi-bit data, according to the first multi-bit DBI signal; and

a second multi-mode DBI encoder configured to generate second encoded multi-bit data by DBI encoding the second multi-bit data, according to the first multi-bit DBI signal.

10. The memory device as claimed in claim 9 , wherein the transceiver further includes:

a first DBI transceiver configured to transmit a first DBI symbol corresponding to the first multi-bit DBI signal through a first DBI channel; and

a second DBI transceiver configured to transmit a second DBI symbol corresponding to the second multi-bit DBI signal through a second DBI channel.

11. The memory device as claimed in claim 1 , further comprising a multi-mode DBI decoder, wherein:

the transceiver is further configured to receive an input data symbol through the data channel and receive an input DBI symbol through the DBI channel, and

the multi-mode DBI decoder is configured to generate multi-bit input data by DBI decoding encoded multi-bit input data corresponding to the input data symbol, according to a multi-bit input DBI signal corresponding to the DBI input symbol.

12. The memory device as claimed in claim 1 , further comprising a memory cell array configured to store the multi-bit data, the memory cell array including a plurality of DRAM cells.

13. A memory device, comprising:

a transceiver configured to receive a data symbol and a data bus inversion (DBI) symbol through a data channel and a DBI channel, respectively, generate encoded multi-bit data from the received data symbol, and generate a multi-bit DBI signal from the received DBI symbol; and

a multi-mode DBI decoder configured to generate multi-bit data by DBI decoding the encoded multi-bit data according to the multi-bit DBI signal.

14. The memory device as claimed in claim 13 , wherein:

the multi-bit data includes 2-bit data, and

the multi-bit DBI signal includes a 2-bit signal.

15. The memory device as claimed in claim 14 , wherein the multi-bit DBI signal represents one of a plurality of DBI modes, the plurality of DBI modes including:

a first DBI mode in which all bits of the 2-bit data are not inverted;

a second DBI mode in which only a least significant bit (LSB) of the 2-bit data is inverted;

a third DBI mode in which only a most significant bit (MSB) of the 2-bit data is inverted; and

a fourth DBI mode in which all bits of the 2-bit data are inverted.

16. The memory device as claimed in claim 13 , wherein the transceiver includes:

a data transceiver configured to generate the encoded multi-bit data from the data symbol having one voltage level from among first to eighth voltage levels by using a pulse amplitude modulation (PAM)-4 scheme; and

a DBI transceiver configured to generate the multi-bit DBI signal from the DBI symbol having one voltage level from among the first to fourth voltage levels by using the PAM-4 scheme.

17. The memory device as claimed in claim 13 , wherein:

the data channel includes a plurality of data channels,

the transceiver includes a plurality of data transceivers configured to receive a plurality of data symbols through the plurality of data channels and generate a plurality of pieces of encoded multi-bit data from the received data symbols, and

the multi-mode DBI decoder includes a plurality of multi-mode DBI decoders configured to generate a plurality of pieces of multi-bit data by DBI decoding the encoded multi-bit data, respectively, according to the multi-bit DBI signal.

18. The memory device as claimed in claim 13 , wherein:

the data channel includes a plurality of data channels,

the DBI channel includes a first DBI channel and a second DBI channel, the transceiver includes:

a plurality of data transceivers configured to receive a plurality of data symbols including first and second data symbols through the plurality of data channels and generate encoded first and second multi-bit data from the received first and second data symbols, respectively;

a first DBI transceiver configured to receive a first DBI symbol through the first DBI channel and generate a first multi-bit DBI signal from the received first DBI symbol; and

a second DBI transceiver configured to receive a second DBI symbol through the second DBI channel and generate a second multi-bit DBI signal from the received second DBI symbol, and

the multi-mode DBI decoder includes:

a first multi-mode DBI decoder configured to generate first multi-bit data by DBI decoding the encoded first multi-bit data according to the first multi-bit DBI signal; and

a second multi-mode DBI decoder configured to generate second multi-bit data by DBI decoding the encoded second multi-bit data according to the second multi-bit DBI signal.

19. The memory device as claimed in claim 13 , further comprising a memory cell array configured to store the multi-bit data, the memory cell array including a plurality of DRAM cells.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 25, 2021
From: PARK, JAEWOO; CHOI, YOUNGDON; CHOI, JUNGHWAN; YOO, CHANGSIK
To: SAMSUNG ELECTRONICS CO., LTD.; IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY
Reel/Frame 055014/0879 →
Priority Claims (1)
KR 10-2020-0066716 · Jun 2, 2020 · national
Continuity (1)
Related Publication 20210377080A1 · Dec 2, 2021
Cited By (1)
US 12,328,212