Electronic package and manufacturing method thereof
An electronic package and a method for manufacturing the electronic package are provided. The method includes forming a slope surface on at least one side surface of at least one of a plurality of electronic components, and then disposing the plurality of electronic components on a carrier structure, such that the two adjacent electronic components form a space by the slope surface. Afterwards, an encapsulation layer is formed on the carrier structure and filled into the space to cover the two adjacent electronic components so as to disperse stress on the electronic components through the design of the space to prevent cracking due to stress concentration.
1. An electronic package, comprising:
a carrier structure;
a plurality of electronic components disposed at intervals on the carrier structure, wherein each of the electronic components includes an active face, a non-active face opposite to the active face, and side faces adjacent to and interconnected between the active face and the non-active face, wherein a width of the active face of at least one of the plurality of electronic components is greater than a width of the non-active face, such that a slope surface is formed on at least one of the side faces of the at least one of the plurality of electronic components, and wherein a space is formed between the two adjacent electronic components, such that at least one side of the space includes the slope surface; and
an encapsulation layer formed on the carrier structure for encapsulating the plurality of electronic components,
wherein structures of the plurality of electronic components are different from one another.
2. The electronic package of claim 1 , wherein the active faces of the electronic components include a plurality of electrode pads electrically connected with the carrier structure.
3. The electronic package of claim 1 , wherein a chamfer is formed at a corner between the active face and the side face of the electronic components.
4. The electronic package of claim 1 , wherein a width of the space gradually reduces as the width of the space gets towards the carrier structure.
5. The electronic package of claim 1 , wherein the electronic components are electrically connected with the carrier structure via a plurality of conductive bumps.
6. The electronic package of claim 5 , further comprising a covering layer formed between the electronic components and the carrier structure, wherein the plurality of conductive bumps are covered by the covering layer, and the covering layer is further covered by the encapsulation layer.
7. The electronic package of claim 1 , wherein the non-active faces of the electronic components are exposed from the encapsulation layer.
8. The electronic package of claim 1 , wherein a plurality of the spaces are formed by the plurality of electronic components.
9. The electronic package of claim 1 , further comprising a plurality of conductive components on a side of the carrier structure opposite to the side that the electronic components are disposed on.
10. A method of manufacturing an electronic package, comprising:
providing a plurality of electronic components, wherein each of the electronic components includes an active face, a non-active face opposite to the active face, and side faces adjacent to and interconnected between the active face and the non-active face, and wherein a width of the active face of at least one of the plurality of electronic components is greater than a width of the non-active face, such that a slope surface is formed on at least one of the side faces of the at least one of the plurality of electronic components;
disposing the plurality of electronic components at intervals on a carrier structure to form a space between the two adjacent electronic components, wherein at least one side of the space includes the slope surface; and
forming an encapsulation layer on the carrier structure for encapsulating the plurality of electronic components,
wherein structures of the plurality of electronic components are different from one another.
11. The method of claim 10 , wherein the active faces of the electronic components include a plurality of electrode pads electrically connected with the carrier structure.
12. The method of claim 10 , wherein a chamfer is formed at a corner between the active face and the side face of the electronic components.
13. The method of claim 10 , wherein a width of the space gradually reduces as the width of the space gets towards the carrier structure.
14. The method of claim 10 , wherein the electronic components are electrically connected with the carrier structure via a plurality of conductive bumps.
15. The method of claim 14 , further comprising, before forming the encapsulation layer, forming a covering layer between the electronic components and the carrier structure, wherein the plurality of conductive bumps are covered by the covering layer, and the covering layer is covered by the encapsulation layer when forming the encapsulation layer.
16. The method of claim 10 , wherein the non-active faces of the electronic components are exposed from the encapsulation layer.
17. The method of claim 10 , wherein a plurality of the spaces are formed by the plurality of electronic components.
18. The method of claim 10 , further comprising forming a plurality of conductive components on a side of the carrier structure opposite to the side that the electronic components are disposed on.