Semiconductor device and method of manufacturing same
A semiconductor device according to one or more embodiments may include a first semiconductor region of a first conductivity type, a second semiconductor region of the first conductivity type with a higher impurity concentration than an impurity concentration of the first semiconductor region, the second semiconductor region being provided on a first principal surface of the first semiconductor region, a third semiconductor region of a second conductivity type provided on an upper surface of the second semiconductor region, the third semiconductor region being doped with an impurity in accordance with an impurity concentration profile including peaks along a film thickness direction, a fourth semiconductor region of the first conductivity type provided on an upper surface of the third semiconductor region.
1. A semiconductor device comprising:
a first semiconductor region of a first conductivity type;
a second semiconductor region of the first conductivity type with a higher impurity concentration than an impurity concentration of the first semiconductor region, the second semiconductor region being provided on a first principal surface of the first semiconductor region;
a third semiconductor region of a second conductivity type provided on an upper surface of the second semiconductor region, the third semiconductor region being doped with an impurity in accordance with an impurity concentration profile including peaks and convex regions along a film thickness direction;
a fourth semiconductor region of the first conductivity type provided on an upper surface of the third semiconductor region;
a gate insulating film provided on an inner wall of a groove that extends from an upper surface of the fourth semiconductor region and penetrates the third semiconductor region;
a control electrode provided inside the groove in such a way as to be opposed to a side surface of the third semiconductor region through the gate insulating film;
a fifth semiconductor region of the first conductivity type with a higher impurity concentration than the impurity concentration of the first semiconductor region, the fifth semiconductor region being provided on a second principal surface of the first semiconductor region opposed to the first principal surface; and
a sixth semiconductor region of the second conductivity type provided on the second principal surface of the first semiconductor region through the fifth semiconductor region, wherein
each of the convex regions is defined as an area of the impurity concentration profile from a first minimum value in the impurity concentration profile along the groove of the third semiconductor region to a next minimum value in the impurity concentration profile that sandwich one of the peaks, and
a width in a film thickness direction of each of the convex regions is smaller than a film thickness of the second semiconductor region along the groove.
2. The semiconductor device according to claim 1 , wherein a film thickness of the third semiconductor region along the groove is larger than a film thickness of the second semiconductor region along the groove.
3. The semiconductor device according to claim 1 , wherein an impurity concentration at the peak close to the second semiconductor region is higher than an impurity concentration at the peak close to the fourth semiconductor region in the impurity concentration profile along the groove of the third semiconductor region.
4. The semiconductor device according to claim 1 , wherein a film thickness of the second semiconductor region along the groove is less than 1 μm.