Wiring board
A wiring board includes: an insulating layer; and a connection terminal formed on the insulating layer. The connection terminal includes a first metal layer laminated on the insulating layer, a second metal layer laminated on the first metal layer, a metal pad laminated on the second metal layer, and a surface treatment layer that covers an upper surface and a side surface of the pad and that is in contact with the upper surface of the insulating layer. An end portion of the second metal layer is in contact with the surface treatment layer, and an end portion of the first metal layer is positioned closer to a center side of the pad than the end portion of the second metal layer is to form a gap between the end portion of the first metal layer and the surface treatment layer.
1. A wiring board comprising:
an insulating layer; and
a connection terminal formed on an upper surface of the insulating layer, wherein
the connection terminal includes
a first metal layer laminated on the upper surface of the insulating
a second metal layer laminated on an per surface of the first metal layer,
a metal pad laminated on an upper surface of the second metal layer, and
a surface treatment layer that covers an upper surface and a side surface of the pad and that is in contact with the upper surface of the insulating layer,
an end portion of the second metal layer is in contact with the surface treatment layer, and
an end portion of the first metal layer is positioned closer to a center side of the pad than the end portion of the second metal layer is to form a gap between the end Portion of the first metal layer and the surface treatment layer.
2. The wiring board according to claim 1 , wherein
the second metal layer is a layer made of a same metal as the pad, and
the first metal layer is a layer made of a metal different from the second metal layer.
3. The wiring board according to claim 1 , wherein
the end portion of the second metal layer extends to a same position as the side surface of the pad, and
the surface treatment layer covers the end portion of the second metal layer as well as the side surface of the pad.
4. The wiring board according to claim 1 , wherein
the end portion of the second metal layer is positioned closer to the center side than the side surface of the pad is
the pad has an inclined plane through which the side surface of the pad and the end portion of the second metal layer are connected, and
the surface treatment layer covers the inclined plane and the end portion of the second metal layer as well as the side surface of the of the pad.