Light-emitting device and manufacturing method thereof
This disclosure discloses a method of manufacturing a light-emitting device includes steps of providing a first substrate with a plurality of first light-emitting elements and adhesive units arranged thereon, providing a second substrate with a first group of second light-emitting elements and a second group of second light-emitting elements arranged thereon, and connecting the a second group of second light-emitting elements and the adhesive units. The first light-emitting elements and the first group of second light-emitting elements are partially or wholly overlapped with each other during connecting the second group of second light-emitting elements and the adhesive units.
1. A method of manufacturing a light-emitting device, comprising:
providing a first substrate comprising an intermediate layer;
providing a second substrate;
placing a first light-emitting element on the intermediate layer;
pushing the first light-emitting element toward the second substrate by forming at least two protrusions on the intermediate layer,
wherein in a cross-sectional view, the at least two protrusions overlap with the first light-emitting element.
2. The method of claim 1 , further comprising forming an adhesive unit on the second substrate before the pushing step.
3. The method of claim 2 , wherein the adhesive unit contains an insulating material and conductive particles dispersed within the insulating material.
4. The method of claim 1 , wherein the first light-emitting element is adhered to the second substrate after the pushing step.
5. The method of claim 1 , further comprising placing a second light-emitting element on the intermediate layer, wherein the second light-emitting element remains on the first substrate after the pushing step.
6. The method of claim 5 , further comprising placing a third light-emitting element on the second substrate, the third light-emitting element is overlapped with the second light-emitting element during the pushing step.
7. The method of claim 1 , wherein the first substrate is separated from the second substrate by a distance which is twice larger than a height of the first light-emitting element during the pushing step.
8. The method of claim 1 , further comprising arranging a spacer between the first substrate and the second substrate.
9. The method of claim 8 , wherein the spacer is arranged on an edge of the second substrate.
10. The method of claim 8 , wherein the spacer is arranged on a center of the second substrate.
11. The method of claim 1 , wherein the first substrate and the intermediate layer are partially separated from each other after the pushing step.
12. The method of claim 1 , wherein the first light-emitting element does not simultaneously contact both of the intermediate layer and the second substrate during the pushing step.
13. The method of claim 1 , wherein the first light-emitting element has a plurality of electrode pads formed on a side opposite to the first substrate.
14. The method of claim 13 , wherein the first light-emitting element is connected to the intermediate layer through a unit substrate.
15. The method of claim 14 , wherein the unit substrate has a width larger than that of the first light-emitting element.
16. The method of claim 14 , wherein in the pushing step, the unit substrate and the first light-emitting element are both pushed toward the second substrate.
17. The method of claim 1 , wherein the at least two protrusions are formed by applying laser to the intermediate layer.
18. The method of claim 1 , wherein the intermediate layer comprises a bubble layer and an adhesive structure, and the bubble layer is between the first substrate and the adhesive structure.
19. The method of claim 18 , wherein the first light-emitting element is connected to the adhesive structure before the pushing step.
20. The method of claim 18 , wherein, in the pushing step, the bubble layer is heated to bulge to form the at least two protrusions.